KR101432243B1 - 필름 증착을 위한 액체 유동 제어 - Google Patents

필름 증착을 위한 액체 유동 제어 Download PDF

Info

Publication number
KR101432243B1
KR101432243B1 KR1020130025646A KR20130025646A KR101432243B1 KR 101432243 B1 KR101432243 B1 KR 101432243B1 KR 1020130025646 A KR1020130025646 A KR 1020130025646A KR 20130025646 A KR20130025646 A KR 20130025646A KR 101432243 B1 KR101432243 B1 KR 101432243B1
Authority
KR
South Korea
Prior art keywords
liquid
flow
diaphragm
orifice
outlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020130025646A
Other languages
English (en)
Korean (ko)
Other versions
KR20130105419A (ko
Inventor
벤자민 와이. 에이치. 리우
툭 엠. 딘
야민 마
Original Assignee
엠 에스피 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엠 에스피 코포레이션 filed Critical 엠 에스피 코포레이션
Publication of KR20130105419A publication Critical patent/KR20130105419A/ko
Application granted granted Critical
Publication of KR101432243B1 publication Critical patent/KR101432243B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0402Apparatus for fluid treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00Actuating devices; Operating means; Releasing devices
    • F16K31/004Actuating devices; Operating means; Releasing devices actuated by piezoelectric means
    • F16K31/007Piezoelectric stacks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00Actuating devices; Operating means; Releasing devices
    • F16K31/12Actuating devices; Operating means; Releasing devices actuated by fluid
    • F16K31/122Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston
    • F16K31/1221Actuating devices; Operating means; Releasing devices actuated by fluid the fluid acting on a piston one side of the piston being spring-loaded
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K7/00Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves
    • F16K7/12Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm
    • F16K7/14Diaphragm valves or cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage ; Pinch valves with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/0318Processes
    • Y10T137/0324With control of flow by a condition or characteristic of a fluid
    • Y10T137/0357For producing uniform flow
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/7722Line condition change responsive valves
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/7722Line condition change responsive valves
    • Y10T137/7758Pilot or servo controlled
    • Y10T137/7759Responsive to change in rate of fluid flow

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Flow Control (AREA)
  • Measuring Volume Flow (AREA)
  • Fluid-Driven Valves (AREA)
  • Electrically Driven Valve-Operating Means (AREA)
KR1020130025646A 2012-03-12 2013-03-11 필름 증착을 위한 액체 유동 제어 Active KR101432243B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201261609616P 2012-03-12 2012-03-12
US61/609,616 2012-03-12
US13/785,819 US8783652B2 (en) 2012-03-12 2013-03-05 Liquid flow control for film deposition
US13/785,819 2013-03-05

Publications (2)

Publication Number Publication Date
KR20130105419A KR20130105419A (ko) 2013-09-25
KR101432243B1 true KR101432243B1 (ko) 2014-09-23

Family

ID=47900664

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130025646A Active KR101432243B1 (ko) 2012-03-12 2013-03-11 필름 증착을 위한 액체 유동 제어

Country Status (4)

Country Link
US (1) US8783652B2 (https=)
EP (2) EP3040591B1 (https=)
JP (1) JP5725482B2 (https=)
KR (1) KR101432243B1 (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9308307B2 (en) 2007-09-13 2016-04-12 Fresenius Medical Care Holdings, Inc. Manifold diaphragms
US10035103B2 (en) 2008-10-30 2018-07-31 Fresenius Medical Care Holdings, Inc. Modular, portable dialysis system
US8240636B2 (en) 2009-01-12 2012-08-14 Fresenius Medical Care Holdings, Inc. Valve system
US8597505B2 (en) 2007-09-13 2013-12-03 Fresenius Medical Care Holdings, Inc. Portable dialysis machine
US8105487B2 (en) 2007-09-25 2012-01-31 Fresenius Medical Care Holdings, Inc. Manifolds for use in conducting dialysis
US9199022B2 (en) 2008-09-12 2015-12-01 Fresenius Medical Care Holdings, Inc. Modular reservoir assembly for a hemodialysis and hemofiltration system
US9358331B2 (en) 2007-09-13 2016-06-07 Fresenius Medical Care Holdings, Inc. Portable dialysis machine with improved reservoir heating system
EP3511034B1 (en) 2007-11-29 2023-03-29 Fresenius Medical Care Holdings, Inc. Extracorporeal blood processing system for conducting hemodialysis and hemofiltration
AU2009302327C1 (en) 2008-10-07 2015-09-10 Fresenius Medical Care Holdings, Inc. Priming system and method for dialysis systems
US9201036B2 (en) 2012-12-21 2015-12-01 Fresenius Medical Care Holdings, Inc. Method and system of monitoring electrolyte levels and composition using capacitance or induction
US9157786B2 (en) 2012-12-24 2015-10-13 Fresenius Medical Care Holdings, Inc. Load suspension and weighing system for a dialysis machine reservoir
US9354640B2 (en) * 2013-11-11 2016-05-31 Fresenius Medical Care Holdings, Inc. Smart actuator for valve
KR102312480B1 (ko) * 2016-11-08 2021-10-14 가부시키가이샤 후지킨 밸브 장치, 이 밸브 장치를 사용한 유량제어방법 및 반도체 제조 방법
CN110023659B (zh) * 2016-11-30 2021-01-29 株式会社富士金 阀装置、使用该阀装置的流量控制方法和半导体制造方法
JP7113529B2 (ja) * 2017-09-25 2022-08-05 株式会社フジキン バルブ装置、流量調整方法、流体制御装置、流量制御方法、半導体製造装置および半導体製造方法
JP7475631B2 (ja) * 2017-11-24 2024-04-30 株式会社フジキン バルブ装置およびその制御装置を用いた制御方法、流体制御装置および半導体製造装置
DE102018001048A1 (de) * 2018-02-09 2019-08-14 Atlas Copco Ias Gmbh Dosierventil
KR102398907B1 (ko) 2018-03-09 2022-05-17 가부시키가이샤 후지킨 밸브 장치
IL268254B2 (en) * 2019-07-24 2024-10-01 Ham Let Israel Canada Ltd Fluid-flow control device
MX2022003625A (es) * 2019-09-25 2022-04-20 Shibaura Machine Co Ltd Valvula de ajuste de velocidad de flujo, unidad de bomba y dispositivo de tratamiento de superficie.
JP2024158856A (ja) * 2023-04-28 2024-11-08 株式会社堀場エステック 流体制御弁、流体制御装置、及び、材料供給システム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010030282A (ko) * 1999-09-09 2001-04-16 히가시 데쓰로 기화기 및 이것을 이용한 반도체 제조 시스템
KR20090088943A (ko) * 2007-03-30 2009-08-20 가부시키가이샤 후지킨 압전 소자 구동식 제어 밸브
US20100224804A1 (en) * 2003-10-17 2010-09-09 Sundew Technologies, Llc Fail safe pneumatically actuated valve with fast time response and adjustable conductance
WO2011097238A2 (en) * 2010-02-05 2011-08-11 Msp Corporation Fine droplet atomizer for liquid precursor vaporization

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5092360A (en) * 1989-11-14 1992-03-03 Hitachi Metals, Ltd. Flow rated control valve using a high-temperature stacked-type displacement device
JPH0784662B2 (ja) * 1989-12-12 1995-09-13 アプライドマテリアルズジャパン株式会社 化学的気相成長方法とその装置
DE69312436T2 (de) * 1992-12-15 1998-02-05 Applied Materials Inc Verdampfung von flüssigen Reaktionspartnern für CVD
JPH08200525A (ja) * 1995-01-31 1996-08-06 Hitachi Metals Ltd 液体原料気化器用弁
JPH1089532A (ja) * 1995-12-13 1998-04-10 Rintetsuku:Kk 気化装置の弁構造
JPH11319660A (ja) * 1998-05-15 1999-11-24 Rintec:Kk 気化装置
JP2001317646A (ja) * 2000-05-08 2001-11-16 Smc Corp 圧電式流体制御弁
JP2004092824A (ja) * 2002-09-02 2004-03-25 Fujikin Inc 流体制御器
JP2005113221A (ja) * 2003-10-08 2005-04-28 Lintec Co Ltd 気化器並びにこれを用いた液体気化供給装置
JP4743763B2 (ja) * 2006-01-18 2011-08-10 株式会社フジキン 圧電素子駆動式金属ダイヤフラム型制御弁
DE502007004403D1 (de) 2007-08-03 2010-08-26 Georg Fischer Wavin Ag Ventilanordnung mit Drehmomentbegrenzer
US20130000759A1 (en) * 2011-06-30 2013-01-03 Agilent Technologies, Inc. Microfluidic device and external piezoelectric actuator

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010030282A (ko) * 1999-09-09 2001-04-16 히가시 데쓰로 기화기 및 이것을 이용한 반도체 제조 시스템
US20100224804A1 (en) * 2003-10-17 2010-09-09 Sundew Technologies, Llc Fail safe pneumatically actuated valve with fast time response and adjustable conductance
KR20090088943A (ko) * 2007-03-30 2009-08-20 가부시키가이샤 후지킨 압전 소자 구동식 제어 밸브
WO2011097238A2 (en) * 2010-02-05 2011-08-11 Msp Corporation Fine droplet atomizer for liquid precursor vaporization

Also Published As

Publication number Publication date
EP2639483A2 (en) 2013-09-18
US8783652B2 (en) 2014-07-22
JP2013210095A (ja) 2013-10-10
EP2639483A3 (en) 2015-01-07
JP5725482B2 (ja) 2015-05-27
US20130233395A1 (en) 2013-09-12
EP3040591B1 (en) 2018-01-03
KR20130105419A (ko) 2013-09-25
EP3040591A1 (en) 2016-07-06

Similar Documents

Publication Publication Date Title
KR101432243B1 (ko) 필름 증착을 위한 액체 유동 제어
JP5350824B2 (ja) 液体材料の気化供給システム
US12228435B2 (en) Flow control system, method, and apparatus
KR100714985B1 (ko) 액체 유동 제어기와 정밀 분배 장치 및 시스템
US6640840B1 (en) Delivery of liquid precursors to semiconductor processing reactors
JP3296749B2 (ja) 液体放出及び気化システム
KR102242962B1 (ko) 압력 조절식 유체 보관 및 운반 용기의 스파이크 압력 방지 관리
EP0867649B1 (en) Suck back valve
WO2001009696A1 (en) Pressure control device for a pipeline
US7195026B2 (en) Micro electromechanical systems for delivering high purity fluids in a chemical delivery system
WO2004006035A1 (ja) 流体制御弁
TW202024835A (zh) 用於使用外部壓力觸發儀輸送脈衝氣體的方法和裝置
US5520001A (en) Vapor controller
KR20150069510A (ko) 유량 제어 밸브 및 이것을 사용한 유량 제어 장치
EP1106826A2 (en) Flow rate control with a positive displacement liquid pump
KR102812621B1 (ko) 가스 공급 시스템 및 가스 공급 방법
JP2013532391A (ja) プロセスチャンバの圧力制御システムおよび制御方法
WO2011119952A2 (en) Integrated system for vapor generation and thin film deposition
JP3409910B2 (ja) 液体材料気化供給装置
WO2009152103A2 (en) Method and apparatus for dampening pressure fluctuations in a fluid delivery system
JP2024072527A (ja) プラズマ生成装置用のガス流量調整パイプ
KR20230007427A (ko) 무전환 가스 도징 (divertless gas-dosing)
US20260084128A1 (en) Fluid supply mechanism and fluid supply method
JP2002110659A (ja) 脱気機能を具えた気化器
JPH07230322A (ja) 気化流量制御器

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20170731

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20180731

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20190805

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000