KR101425268B1 - 기판 수수 방법 - Google Patents

기판 수수 방법 Download PDF

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Publication number
KR101425268B1
KR101425268B1 KR1020120081679A KR20120081679A KR101425268B1 KR 101425268 B1 KR101425268 B1 KR 101425268B1 KR 1020120081679 A KR1020120081679 A KR 1020120081679A KR 20120081679 A KR20120081679 A KR 20120081679A KR 101425268 B1 KR101425268 B1 KR 101425268B1
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KR
South Korea
Prior art keywords
substrate
mounting surface
lift pin
mounting
electrostatic chuck
Prior art date
Application number
KR1020120081679A
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English (en)
Korean (ko)
Other versions
KR20130018540A (ko
Inventor
아키히코 시무라
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20130018540A publication Critical patent/KR20130018540A/ko
Application granted granted Critical
Publication of KR101425268B1 publication Critical patent/KR101425268B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020120081679A 2011-08-02 2012-07-26 기판 수수 방법 KR101425268B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-169069 2011-08-02
JP2011169069A JP5907681B2 (ja) 2011-08-02 2011-08-02 基板受け渡し方法

Publications (2)

Publication Number Publication Date
KR20130018540A KR20130018540A (ko) 2013-02-25
KR101425268B1 true KR101425268B1 (ko) 2014-07-31

Family

ID=47614261

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120081679A KR101425268B1 (ko) 2011-08-02 2012-07-26 기판 수수 방법

Country Status (4)

Country Link
JP (1) JP5907681B2 (zh)
KR (1) KR101425268B1 (zh)
CN (1) CN102915944B (zh)
TW (1) TWI529842B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013005481A1 (ja) * 2011-07-05 2013-01-10 エピクルー株式会社 サセプタ装置及びこれを備えた成膜装置
KR102342231B1 (ko) * 2014-05-03 2021-12-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 필름상 부재 지지 장치
US9839106B2 (en) * 2014-07-23 2017-12-05 Moxtek, Inc. Flat-panel-display, bottom-side, electrostatic-dissipation
US9826610B2 (en) 2014-07-23 2017-11-21 Moxtek, Inc. Electrostatic-dissipation device
US9839107B2 (en) 2014-07-23 2017-12-05 Moxtek, Inc. Flowing-fluid X-ray induced ionic electrostatic dissipation
US9779847B2 (en) 2014-07-23 2017-10-03 Moxtek, Inc. Spark gap X-ray source
US10524341B2 (en) 2015-05-08 2019-12-31 Moxtek, Inc. Flowing-fluid X-ray induced ionic electrostatic dissipation
CN108257908A (zh) * 2017-12-29 2018-07-06 深圳市华星光电半导体显示技术有限公司 升降方法、升降装置及计算机可读存储介质
CN109068467A (zh) * 2018-09-18 2018-12-21 张家港康得新光电材料有限公司 一种除静电装置及除静电方法
CN110571184A (zh) * 2019-09-26 2019-12-13 芜湖通潮精密机械股份有限公司 干刻机台支撑装置
JP7438018B2 (ja) * 2020-05-11 2024-02-26 東京エレクトロン株式会社 基板載置方法及び基板載置機構
KR102251891B1 (ko) * 2020-12-08 2021-05-13 주식회사 기가레인 기판 지지 장치 및 이를 이용한 기판 반출 방법
CN117198972A (zh) * 2022-05-30 2023-12-08 江苏鲁汶仪器股份有限公司 一种晶圆升降机构及晶圆载台装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002246450A (ja) * 2001-02-20 2002-08-30 Nikon Corp 基板保持装置及び基板搬送方法
KR20060050004A (ko) * 2004-07-09 2006-05-19 어플라이드 머티어리얼스, 인코포레이티드 독립적으로 이동하는 기판 지지부
KR20070071333A (ko) * 2005-12-30 2007-07-04 주식회사 에이디피엔지니어링 기판 리프팅 모듈 및 리프팅 방법
KR20080042583A (ko) * 2006-11-10 2008-05-15 주식회사 에이디피엔지니어링 리프트 핀 구동장치 및 이를 구비한 평판표시소자 제조장치

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3005461B2 (ja) * 1995-11-24 2000-01-31 日本電気株式会社 静電チャック
JP3823027B2 (ja) * 2001-01-31 2006-09-20 東京エレクトロン株式会社 基板処理装置
JP4795899B2 (ja) * 2006-08-31 2011-10-19 東京エレクトロン株式会社 基板載置機構および基板受け渡し方法
JP4850762B2 (ja) * 2007-03-19 2012-01-11 株式会社アルバック 成膜方法
JP5261085B2 (ja) * 2008-09-05 2013-08-14 東京エレクトロン株式会社 基板載置機構、基板処理装置、基板載置機構の制御方法及び記憶媒体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002246450A (ja) * 2001-02-20 2002-08-30 Nikon Corp 基板保持装置及び基板搬送方法
KR20060050004A (ko) * 2004-07-09 2006-05-19 어플라이드 머티어리얼스, 인코포레이티드 독립적으로 이동하는 기판 지지부
KR20070071333A (ko) * 2005-12-30 2007-07-04 주식회사 에이디피엔지니어링 기판 리프팅 모듈 및 리프팅 방법
KR20080042583A (ko) * 2006-11-10 2008-05-15 주식회사 에이디피엔지니어링 리프트 핀 구동장치 및 이를 구비한 평판표시소자 제조장치

Also Published As

Publication number Publication date
TW201322359A (zh) 2013-06-01
JP5907681B2 (ja) 2016-04-26
KR20130018540A (ko) 2013-02-25
CN102915944B (zh) 2015-06-10
TWI529842B (zh) 2016-04-11
CN102915944A (zh) 2013-02-06
JP2013033847A (ja) 2013-02-14

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