KR101425112B1 - 레이저 어닐링 장치, 피처리체의 레이저 어닐링 방법, 및 레이저 어닐링 프로그램 - Google Patents
레이저 어닐링 장치, 피처리체의 레이저 어닐링 방법, 및 레이저 어닐링 프로그램 Download PDFInfo
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- KR101425112B1 KR101425112B1 KR1020117031337A KR20117031337A KR101425112B1 KR 101425112 B1 KR101425112 B1 KR 101425112B1 KR 1020117031337 A KR1020117031337 A KR 1020117031337A KR 20117031337 A KR20117031337 A KR 20117031337A KR 101425112 B1 KR101425112 B1 KR 101425112B1
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- Prior art keywords
- gas
- pulse laser
- output
- laser oscillator
- pulse
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- 238000005224 laser annealing Methods 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims description 39
- 238000004519 manufacturing process Methods 0.000 title description 2
- 230000005284 excitation Effects 0.000 claims abstract description 38
- 230000006866 deterioration Effects 0.000 claims abstract description 32
- 230000003287 optical effect Effects 0.000 claims abstract description 16
- 230000003247 decreasing effect Effects 0.000 claims abstract description 13
- 238000005259 measurement Methods 0.000 claims description 23
- 238000002834 transmittance Methods 0.000 claims description 4
- 238000012423 maintenance Methods 0.000 claims 1
- 230000008859 change Effects 0.000 abstract description 5
- 238000000137 annealing Methods 0.000 abstract description 3
- 239000010409 thin film Substances 0.000 description 14
- 239000000758 substrate Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- 229910021417 amorphous silicon Inorganic materials 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 5
- 230000006870 function Effects 0.000 description 4
- 230000001678 irradiating effect Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 238000010191 image analysis Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- General Physics & Mathematics (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Lasers (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2010-109693 | 2010-05-11 | ||
JP2010109693A JP5430488B2 (ja) | 2010-05-11 | 2010-05-11 | レーザアニール処理装置、レーザアニール処理体の製造方法およびレーザアニール処理プログラム |
PCT/JP2011/053031 WO2011142154A1 (ja) | 2010-05-11 | 2011-02-14 | レーザアニール処理装置、レーザアニール処理体の製造方法およびレーザアニール処理プログラム |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20130044125A KR20130044125A (ko) | 2013-05-02 |
KR101425112B1 true KR101425112B1 (ko) | 2014-08-01 |
Family
ID=44914213
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020117031337A KR101425112B1 (ko) | 2010-05-11 | 2011-02-14 | 레이저 어닐링 장치, 피처리체의 레이저 어닐링 방법, 및 레이저 어닐링 프로그램 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5430488B2 (ja) |
KR (1) | KR101425112B1 (ja) |
CN (1) | CN102473615B (ja) |
TW (1) | TWI446451B (ja) |
WO (1) | WO2011142154A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5829575B2 (ja) * | 2012-05-28 | 2015-12-09 | 株式会社日本製鋼所 | パルス波形測定機能を有するレーザアニール装置 |
JP5904590B2 (ja) * | 2012-10-05 | 2016-04-13 | 株式会社日本製鋼所 | 結晶質半導体の製造方法および結晶質半導体の製造装置 |
JP2015012204A (ja) * | 2013-07-01 | 2015-01-19 | 株式会社日本製鋼所 | レーザアニール装置 |
KR101523673B1 (ko) * | 2013-12-27 | 2015-05-28 | 에이피시스템 주식회사 | 레이저 조사 방법 및 레이저 조사 모듈 |
US9335276B2 (en) * | 2014-03-03 | 2016-05-10 | Coherent Lasersystems Gmbh & Co. Kg | Monitoring method and apparatus for control of excimer laser annealing |
US9432178B2 (en) * | 2014-03-24 | 2016-08-30 | Mediatek Inc. | Clock and data recovery circuit using an injection locked oscillator |
WO2018229823A1 (ja) | 2017-06-12 | 2018-12-20 | ギガフォトン株式会社 | レーザ装置、及びレーザ装置管理システム、並びにレーザ装置の管理方法 |
JP6697108B2 (ja) * | 2019-04-22 | 2020-05-20 | ギガフォトン株式会社 | レーザ装置及び極端紫外光生成システム |
CN112038267B (zh) * | 2020-09-21 | 2024-02-20 | 京东方科技集团股份有限公司 | 一种激光能量的调节装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006049606A (ja) | 2004-08-05 | 2006-02-16 | Sumitomo Heavy Ind Ltd | レーザ加工装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3296148B2 (ja) * | 1994-06-24 | 2002-06-24 | 住友電気工業株式会社 | ウエハ−及びその製造方法 |
JP3727034B2 (ja) * | 1995-01-13 | 2005-12-14 | 株式会社半導体エネルギー研究所 | レーザー照射装置 |
JPH1012549A (ja) * | 1996-06-25 | 1998-01-16 | Toshiba Corp | パルスガスレーザ発振装置、レーザアニール装置、半導体装置の製造方法、及び半導体装置 |
JPH11283933A (ja) * | 1998-01-29 | 1999-10-15 | Toshiba Corp | レ―ザ照射装置,非単結晶半導体膜の製造方法及び液晶表示装置の製造方法 |
JP2000200760A (ja) * | 1999-01-07 | 2000-07-18 | Matsushita Electric Ind Co Ltd | レ―ザアニ―ル処理方法とレ―ザアニ―ル処理装置 |
JP2001057346A (ja) * | 1999-08-19 | 2001-02-27 | Toshiba Corp | レーザ加工方法およびレーザ加工装置 |
JP2003163167A (ja) * | 2001-09-12 | 2003-06-06 | Hitachi Ltd | 多結晶半導体膜、多結晶半導体膜製造方法及びそれを用いた薄膜半導体素子 |
SG108878A1 (en) * | 2001-10-30 | 2005-02-28 | Semiconductor Energy Lab | Laser irradiation method and laser irradiation apparatus, and method for fabricating semiconductor device |
US7050878B2 (en) * | 2001-11-22 | 2006-05-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductror fabricating apparatus |
JP2003258349A (ja) * | 2002-03-04 | 2003-09-12 | Toshiba Corp | レーザ加工方法、その装置および薄膜加工方法 |
JP2004063879A (ja) * | 2002-07-30 | 2004-02-26 | Sony Corp | レーザ加工装置およびレーザ加工方法 |
KR100531416B1 (ko) * | 2003-09-17 | 2005-11-29 | 엘지.필립스 엘시디 주식회사 | Sls 장비 및 이를 이용한 실리콘 결정화 방법 |
JP2005219077A (ja) * | 2004-02-04 | 2005-08-18 | Sumitomo Heavy Ind Ltd | レーザエネルギ調整装置、及びレーザエネルギ調整方法、及びレーザ加工機 |
JP4765378B2 (ja) * | 2005-04-08 | 2011-09-07 | パナソニック株式会社 | レーザ加工装置 |
-
2010
- 2010-05-11 JP JP2010109693A patent/JP5430488B2/ja active Active
-
2011
- 2011-02-14 WO PCT/JP2011/053031 patent/WO2011142154A1/ja active Application Filing
- 2011-02-14 CN CN201180003017.7A patent/CN102473615B/zh active Active
- 2011-02-14 KR KR1020117031337A patent/KR101425112B1/ko active IP Right Grant
- 2011-03-02 TW TW100106887A patent/TWI446451B/zh active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006049606A (ja) | 2004-08-05 | 2006-02-16 | Sumitomo Heavy Ind Ltd | レーザ加工装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201145396A (en) | 2011-12-16 |
JP2011238804A (ja) | 2011-11-24 |
CN102473615B (zh) | 2015-04-01 |
JP5430488B2 (ja) | 2014-02-26 |
CN102473615A (zh) | 2012-05-23 |
TWI446451B (zh) | 2014-07-21 |
WO2011142154A1 (ja) | 2011-11-17 |
KR20130044125A (ko) | 2013-05-02 |
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