KR101424791B1 - 발광장치 제조방법 - Google Patents

발광장치 제조방법 Download PDF

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Publication number
KR101424791B1
KR101424791B1 KR1020080028414A KR20080028414A KR101424791B1 KR 101424791 B1 KR101424791 B1 KR 101424791B1 KR 1020080028414 A KR1020080028414 A KR 1020080028414A KR 20080028414 A KR20080028414 A KR 20080028414A KR 101424791 B1 KR101424791 B1 KR 101424791B1
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South Korea
Prior art keywords
substrate
layer
organic compound
light emitting
electrode
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Expired - Fee Related
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KR1020080028414A
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English (en)
Korean (ko)
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KR20080096376A (ko
Inventor
코헤이 요코야마
히사오 이케다
요스케 사토
토모야 아오야마
타카히로 이베
요시하루 히라카타
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가부시키가이샤 한도오따이 에네루기 켄큐쇼
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Publication of KR20080096376A publication Critical patent/KR20080096376A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/14—Carrier transporting layers
    • H10K50/15—Hole transporting layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/18—Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H10K50/125—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light
    • H10K50/13—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light comprising stacked EL layers within one EL unit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020080028414A 2007-04-27 2008-03-27 발광장치 제조방법 Expired - Fee Related KR101424791B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007119084 2007-04-27
JPJP-P-2007-00119084 2007-04-27

Publications (2)

Publication Number Publication Date
KR20080096376A KR20080096376A (ko) 2008-10-30
KR101424791B1 true KR101424791B1 (ko) 2014-07-31

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Country Status (3)

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US (1) US8367152B2 (https=)
JP (1) JP5073566B2 (https=)
KR (1) KR101424791B1 (https=)

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TWI477195B (zh) * 2007-04-27 2015-03-11 Semiconductor Energy Lab 發光裝置的製造方法
US8549912B2 (en) 2007-12-18 2013-10-08 Teradyne, Inc. Disk drive transport, clamping and testing
KR101689519B1 (ko) * 2007-12-26 2016-12-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 증착용 기판, 증착용 기판의 제조방법, 및 발광장치의 제조방법
JP5416987B2 (ja) 2008-02-29 2014-02-12 株式会社半導体エネルギー研究所 成膜方法及び発光装置の作製方法
JP2009231277A (ja) * 2008-02-29 2009-10-08 Semiconductor Energy Lab Co Ltd 製造装置
JP5238544B2 (ja) * 2008-03-07 2013-07-17 株式会社半導体エネルギー研究所 成膜方法及び発光装置の作製方法
US7848106B2 (en) 2008-04-17 2010-12-07 Teradyne, Inc. Temperature control within disk drive testing systems
US8238099B2 (en) 2008-04-17 2012-08-07 Teradyne, Inc. Enclosed operating area for disk drive testing systems
US8095234B2 (en) 2008-04-17 2012-01-10 Teradyne, Inc. Transferring disk drives within disk drive testing systems
US20090262455A1 (en) 2008-04-17 2009-10-22 Teradyne, Inc. Temperature Control Within Disk Drive Testing Systems
US8409672B2 (en) * 2008-04-24 2013-04-02 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing evaporation donor substrate and method of manufacturing light-emitting device
US8405909B2 (en) * 2008-05-09 2013-03-26 Semiconductor Energy Laboratories Co., Ltd. Deposition donor substrate and deposition method using the same
DE102008054435A1 (de) * 2008-12-09 2010-06-10 Universität Zu Köln Organische Leuchtdiode mit optischem Resonator nebst Herstellungsverfahren
KR101563914B1 (ko) 2009-03-04 2015-10-28 제록스 코포레이션 구조화 유기 필름
KR101570535B1 (ko) * 2009-05-12 2015-11-20 엘지디스플레이 주식회사 유기발광다이오드 표시장치의 제조방법
US8687356B2 (en) 2010-02-02 2014-04-01 Teradyne, Inc. Storage device testing system cooling
US8628239B2 (en) 2009-07-15 2014-01-14 Teradyne, Inc. Storage device temperature sensing
US8547123B2 (en) 2009-07-15 2013-10-01 Teradyne, Inc. Storage device testing system with a conductive heating assembly
US8466699B2 (en) 2009-07-15 2013-06-18 Teradyne, Inc. Heating storage devices in a testing system
DE102009041324A1 (de) * 2009-09-15 2011-03-24 Von Ardenne Anlagentechnik Gmbh Verfahren und Vorrichtung zur Herstellung von organischen photoaktiven Bauelementen, insbesondere von organischen Leuchtdioden
JP5747022B2 (ja) 2010-03-18 2015-07-08 株式会社半導体エネルギー研究所 成膜方法及び成膜用基板の作製方法
US8951816B2 (en) 2010-03-18 2015-02-10 Semiconductor Energy Laboratory Co., Ltd. Film forming method
US8815352B2 (en) 2010-03-18 2014-08-26 Semiconductor Energy Laboratory Co., Ltd. Film forming method and method for manufacturing film-formation substrate
US9567425B2 (en) 2010-06-15 2017-02-14 Xerox Corporation Periodic structured organic films
US8687349B2 (en) 2010-07-21 2014-04-01 Teradyne, Inc. Bulk transfer of storage devices using manual loading
US8257889B2 (en) 2010-07-28 2012-09-04 Xerox Corporation Imaging members comprising capped structured organic film compositions
US8318892B2 (en) 2010-07-28 2012-11-27 Xerox Corporation Capped structured organic film compositions
US8697322B2 (en) 2010-07-28 2014-04-15 Xerox Corporation Imaging members comprising structured organic films
US8119315B1 (en) 2010-08-12 2012-02-21 Xerox Corporation Imaging members for ink-based digital printing comprising structured organic films
US8119314B1 (en) 2010-08-12 2012-02-21 Xerox Corporation Imaging devices comprising structured organic films
JP5621624B2 (ja) * 2011-01-28 2014-11-12 ソニー株式会社 蒸発源およびこれを用いた蒸着装置ならびに蒸着方法
US8759473B2 (en) 2011-03-08 2014-06-24 Xerox Corporation High mobility periodic structured organic films
US8247142B1 (en) 2011-06-30 2012-08-21 Xerox Corporation Fluorinated structured organic film compositions
US8353574B1 (en) 2011-06-30 2013-01-15 Xerox Corporation Ink jet faceplate coatings comprising structured organic films
US8410016B2 (en) 2011-07-13 2013-04-02 Xerox Corporation Application of porous structured organic films for gas storage
US8377999B2 (en) 2011-07-13 2013-02-19 Xerox Corporation Porous structured organic film compositions
US8313560B1 (en) 2011-07-13 2012-11-20 Xerox Corporation Application of porous structured organic films for gas separation
US8372566B1 (en) 2011-09-27 2013-02-12 Xerox Corporation Fluorinated structured organic film photoreceptor layers
US8460844B2 (en) 2011-09-27 2013-06-11 Xerox Corporation Robust photoreceptor surface layer
WO2013096543A1 (en) * 2011-12-20 2013-06-27 E. I. Du Pont De Nemours And Company Process and materials for making contained layers and devices made with same
US8529997B2 (en) 2012-01-17 2013-09-10 Xerox Corporation Methods for preparing structured organic film micro-features by inkjet printing
KR101951029B1 (ko) * 2012-06-13 2019-04-26 삼성디스플레이 주식회사 증착용 마스크 및 이를 이용한 유기 발광 표시장치의 제조방법
US8765340B2 (en) 2012-08-10 2014-07-01 Xerox Corporation Fluorinated structured organic film photoreceptor layers containing fluorinated secondary components
US8906462B2 (en) 2013-03-14 2014-12-09 Xerox Corporation Melt formulation process for preparing structured organic films
US10845410B2 (en) 2017-08-28 2020-11-24 Teradyne, Inc. Automated test system having orthogonal robots
US10948534B2 (en) 2017-08-28 2021-03-16 Teradyne, Inc. Automated test system employing robotics
US10775408B2 (en) 2018-08-20 2020-09-15 Teradyne, Inc. System for testing devices inside of carriers
US11881542B2 (en) 2020-12-07 2024-01-23 Lumileds Llc Pixelated wavelength-conversion layer

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JPH118069A (ja) * 1997-02-17 1999-01-12 Nippon Steel Corp 有機エレクトロルミネッセンス素子およびその製造方法
KR20050050492A (ko) * 2003-11-25 2005-05-31 삼성에스디아이 주식회사 풀칼라 유기 전계 발광 소자용 도너 필름, 도너 필름의제조 방법 및 이 도너 필름을 사용한 풀칼라 유기 전계발광 소자
JP2005519429A (ja) * 2002-03-04 2005-06-30 シーディーティー オックスフォード リミテッド 燐光体組成物及びそれを含む有機発光装置

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JPH10245547A (ja) * 1997-01-24 1998-09-14 Eastman Kodak Co 有機発光素子における有機層の堆積方法
JPH118069A (ja) * 1997-02-17 1999-01-12 Nippon Steel Corp 有機エレクトロルミネッセンス素子およびその製造方法
JP2005519429A (ja) * 2002-03-04 2005-06-30 シーディーティー オックスフォード リミテッド 燐光体組成物及びそれを含む有機発光装置
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Also Published As

Publication number Publication date
KR20080096376A (ko) 2008-10-30
JP5073566B2 (ja) 2012-11-14
JP2008293963A (ja) 2008-12-04
US8367152B2 (en) 2013-02-05
US20080268135A1 (en) 2008-10-30

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