KR101419548B1 - 포스트 및 관통 접속부 - Google Patents

포스트 및 관통 접속부 Download PDF

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KR101419548B1
KR101419548B1 KR1020077029402A KR20077029402A KR101419548B1 KR 101419548 B1 KR101419548 B1 KR 101419548B1 KR 1020077029402 A KR1020077029402 A KR 1020077029402A KR 20077029402 A KR20077029402 A KR 20077029402A KR 101419548 B1 KR101419548 B1 KR 101419548B1
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South Korea
Prior art keywords
chip
contact
wafer
electrical contact
chips
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KR1020077029402A
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English (en)
Korean (ko)
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KR20080018896A (ko
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존 트레자
존 칼라한
그레고리 듀도프
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쿠퍼 에셋 엘티디. 엘.엘.씨.
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Priority claimed from US11/329,576 external-priority patent/US7989958B2/en
Priority claimed from US11/329,556 external-priority patent/US7767493B2/en
Application filed by 쿠퍼 에셋 엘티디. 엘.엘.씨. filed Critical 쿠퍼 에셋 엘티디. 엘.엘.씨.
Publication of KR20080018896A publication Critical patent/KR20080018896A/ko
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Publication of KR101419548B1 publication Critical patent/KR101419548B1/ko

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US11/329,556 US7767493B2 (en) 2005-06-14 2006-01-10 Post & penetration interconnection
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KR100975652B1 (ko) * 2007-10-05 2010-08-17 한국과학기술원 아연 및 아연합금을 이용한 비아 및 그의 형성 방법, 그를3차원 다중 칩 스택 패키지 제조 방법
CN103050420A (zh) * 2008-06-05 2013-04-17 丘费尔资产股份有限公司 对电连接中具有高迁移率的组分的束缚
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KR102544296B1 (ko) * 2018-09-13 2023-06-16 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 표면발광레이저 소자 및 이를 구비한 표면발광레이저 장치

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