KR101417695B1 - 휴대용 전자 장치 - Google Patents

휴대용 전자 장치 Download PDF

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Publication number
KR101417695B1
KR101417695B1 KR1020137008424A KR20137008424A KR101417695B1 KR 101417695 B1 KR101417695 B1 KR 101417695B1 KR 1020137008424 A KR1020137008424 A KR 1020137008424A KR 20137008424 A KR20137008424 A KR 20137008424A KR 101417695 B1 KR101417695 B1 KR 101417695B1
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KR
South Korea
Prior art keywords
housing
pcb
frame
connector
microphone
Prior art date
Application number
KR1020137008424A
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English (en)
Korean (ko)
Other versions
KR20130042050A (ko
Inventor
플레쳐 알. 로스코프
필립 엠. 홉슨
아담 미틀맨
안나-카트리나 쉬들츠키
에릭 에스. 졸
스티븐 브라이언 린치
Original Assignee
애플 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/859,702 external-priority patent/US8391010B2/en
Priority claimed from US12/859,711 external-priority patent/US8515113B2/en
Priority claimed from US12/859,694 external-priority patent/US8634204B2/en
Priority claimed from US12/859,701 external-priority patent/US8427379B2/en
Priority claimed from US12/859,712 external-priority patent/US8477492B2/en
Priority claimed from US12/950,793 external-priority patent/US9602914B2/en
Application filed by 애플 인크. filed Critical 애플 인크.
Publication of KR20130042050A publication Critical patent/KR20130042050A/ko
Application granted granted Critical
Publication of KR101417695B1 publication Critical patent/KR101417695B1/ko

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1688—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being integrated loudspeakers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1698—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5387—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526—Electromagnetic shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/114—Pad being close to via, but not surrounding the via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)
  • Thermal Sciences (AREA)
  • Electric Clocks (AREA)
KR1020137008424A 2010-08-19 2011-08-19 휴대용 전자 장치 KR101417695B1 (ko)

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
US12/859,702 US8391010B2 (en) 2010-08-19 2010-08-19 Internal frame optimized for stiffness and heat transfer
US12/859,694 2010-08-19
US12/859,701 2010-08-19
US12/859,711 US8515113B2 (en) 2010-08-19 2010-08-19 Composite microphone boot to optimize sealing and mechanical properties
US12/859,694 US8634204B2 (en) 2010-08-19 2010-08-19 Compact folded configuration for integrated circuit packaging
US12/859,701 US8427379B2 (en) 2010-08-19 2010-08-19 Modular material antenna assembly
US12/859,712 US8477492B2 (en) 2010-08-19 2010-08-19 Formed PCB
US12/859,702 2010-08-19
US12/859,712 2010-08-19
US12/859,711 2010-08-19
US37786610P 2010-08-27 2010-08-27
US61/377,866 2010-08-27
US12/950,793 US9602914B2 (en) 2010-08-27 2010-11-19 Porting audio using a connector in a small form factor electronic device
US12/950,793 2010-11-19
PCT/US2011/048404 WO2012024578A2 (fr) 2010-08-19 2011-08-19 Dispositif électronique portatif

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020137006996A Division KR101494555B1 (ko) 2010-08-19 2011-08-19 휴대용 전자 장치

Publications (2)

Publication Number Publication Date
KR20130042050A KR20130042050A (ko) 2013-04-25
KR101417695B1 true KR101417695B1 (ko) 2014-07-08

Family

ID=48430393

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020137008424A KR101417695B1 (ko) 2010-08-19 2011-08-19 휴대용 전자 장치
KR1020137006996A KR101494555B1 (ko) 2010-08-19 2011-08-19 휴대용 전자 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020137006996A KR101494555B1 (ko) 2010-08-19 2011-08-19 휴대용 전자 장치

Country Status (4)

Country Link
EP (1) EP2606407A2 (fr)
KR (2) KR101417695B1 (fr)
CN (1) CN103221896B (fr)
WO (1) WO2012024578A2 (fr)

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KR101886693B1 (ko) * 2017-02-07 2018-08-08 유호연 휴대기기 내열 방출용 디바이스
US11604256B2 (en) 2019-04-04 2023-03-14 Samsung Electronics Co., Ltd. Electronic device with heat-radiant structure

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KR102214942B1 (ko) * 2013-12-20 2021-02-09 엘지디스플레이 주식회사 투명 표시 장치 및 투명 유기 발광 표시 장치
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TWI516112B (zh) 2014-12-26 2016-01-01 和碩聯合科技股份有限公司 電子裝置及其影像建立模組
KR102376981B1 (ko) * 2015-04-22 2022-03-21 삼성전자주식회사 방열 구조를 갖는 전자 장치
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KR102077541B1 (ko) * 2015-10-16 2020-02-17 삼성전자주식회사 휴대용 전자 장치
CN105847481A (zh) * 2016-05-27 2016-08-10 深圳天珑无线科技有限公司 一种移动终端接地结构和移动终端
KR20170133977A (ko) * 2016-05-27 2017-12-06 엘지전자 주식회사 이동 단말기
CN106210945A (zh) * 2016-09-07 2016-12-07 上海展扬通信技术有限公司 麦克风密封结构及终端设备
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CN106733441B (zh) * 2016-12-12 2020-07-24 奇酷互联网络科技（深圳）有限公司 点胶装配方法和用于点胶装配的治具
CN108215055B (zh) * 2016-12-21 2020-04-24 比亚迪股份有限公司 一种外壳及其制备方法和电子产品
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CN108321522B (zh) * 2018-04-23 2023-10-20 东莞美景科技有限公司 一种电子设备用天线结构
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CN108987945B (zh) * 2018-07-24 2020-08-04 维沃移动通信有限公司 一种终端设备
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KR102537318B1 (ko) * 2018-10-19 2023-05-26 삼성전자 주식회사 회로 기판 어셈블리 및 그것을 포함하는 전자 장치
CN109151687B (zh) * 2018-11-09 2020-10-27 歌尔股份有限公司 一种应用于扬声器振膜的补强部、振膜及扬声器
CN109151676B (zh) 2018-11-09 2020-10-27 歌尔股份有限公司 一种应用于扬声器振膜的补强部、振膜及扬声器
CN109451400B (zh) * 2018-11-09 2020-06-02 歌尔股份有限公司 一种应用于扬声器振膜的补强部、振膜及扬声器
CN109246553B (zh) * 2018-11-09 2021-03-30 歌尔股份有限公司 一种应用于扬声器振膜的补强部及振膜
CN109451411A (zh) * 2018-11-28 2019-03-08 深圳市南和移动通信科技股份有限公司 低干扰播放组件以及移动终端
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CN111901733B (zh) * 2020-07-28 2021-10-12 维沃移动通信有限公司 电子设备
CN112073855A (zh) * 2020-08-27 2020-12-11 瑞声新能源发展(常州)有限公司科教城分公司 扬声器箱
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CN117438774A (zh) * 2023-11-17 2024-01-23 云谷（固安）科技有限公司 天线组件、壳体及移动终端

Citations (4)

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CN103221896B (zh) 2017-06-09
WO2012024578A2 (fr) 2012-02-23
KR20130042050A (ko) 2013-04-25
CN103221896A (zh) 2013-07-24
KR20130055661A (ko) 2013-05-28
WO2012024578A8 (fr) 2012-11-15
EP2606407A2 (fr) 2013-06-26
WO2012024578A3 (fr) 2012-04-12

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