KR101405361B1 - Fpc용 전자파 실드재 - Google Patents
Fpc용 전자파 실드재 Download PDFInfo
- Publication number
- KR101405361B1 KR101405361B1 KR1020120100925A KR20120100925A KR101405361B1 KR 101405361 B1 KR101405361 B1 KR 101405361B1 KR 1020120100925 A KR1020120100925 A KR 1020120100925A KR 20120100925 A KR20120100925 A KR 20120100925A KR 101405361 B1 KR101405361 B1 KR 101405361B1
- Authority
- KR
- South Korea
- Prior art keywords
- electromagnetic wave
- fpc
- wave shielding
- resin
- film
- Prior art date
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Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0112—Absorbing light, e.g. dielectric layer with carbon filler for laser processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011203034A JP5712095B2 (ja) | 2011-09-16 | 2011-09-16 | Fpc用電磁波シールド材 |
JPJP-P-2011-203034 | 2011-09-16 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020140045947A Division KR20140063546A (ko) | 2011-09-16 | 2014-04-17 | Fpc용 전자파 실드재 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20130099799A KR20130099799A (ko) | 2013-09-06 |
KR101405361B1 true KR101405361B1 (ko) | 2014-06-10 |
Family
ID=47930680
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020120100925A KR101405361B1 (ko) | 2011-09-16 | 2012-09-12 | Fpc용 전자파 실드재 |
KR1020140045947A KR20140063546A (ko) | 2011-09-16 | 2014-04-17 | Fpc용 전자파 실드재 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020140045947A KR20140063546A (ko) | 2011-09-16 | 2014-04-17 | Fpc용 전자파 실드재 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5712095B2 (ru) |
KR (2) | KR101405361B1 (ru) |
CN (2) | CN105050314B (ru) |
TW (1) | TWI547236B (ru) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180071483A (ko) * | 2016-12-20 | 2018-06-28 | 주식회사 두산 | 커버레이용 필름 |
Families Citing this family (28)
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JP2015109404A (ja) * | 2013-10-24 | 2015-06-11 | 信越ポリマー株式会社 | 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれらの製造方法 |
CN103717050A (zh) * | 2013-12-03 | 2014-04-09 | 明冠新材料股份有限公司 | 一种薄型柔性热固化电磁屏蔽胶膜 |
KR102202145B1 (ko) | 2014-03-28 | 2021-01-13 | 삼성디스플레이 주식회사 | 완충패드를 갖는 표시장치 |
KR20150130915A (ko) * | 2014-05-14 | 2015-11-24 | 티디케이가부시기가이샤 | 자기억제 시트 및 그 제조방법 |
JP2015220260A (ja) * | 2014-05-14 | 2015-12-07 | Tdk株式会社 | 磁気抑制シート及びその製造方法 |
JP2015220259A (ja) * | 2014-05-14 | 2015-12-07 | Tdk株式会社 | 磁気抑制シート及びその製造方法 |
JP6184025B2 (ja) * | 2014-09-04 | 2017-08-23 | 信越ポリマー株式会社 | 電磁波シールドフィルムおよび電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法 |
JP6381117B2 (ja) * | 2014-09-04 | 2018-08-29 | 信越ポリマー株式会社 | 電磁波シールドフィルムおよび電磁波シールドフィルム付きフレキシブルプリント配線板の製造方法 |
JP6435540B2 (ja) * | 2014-09-19 | 2018-12-12 | 信越ポリマー株式会社 | 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれら製造方法 |
JP6467701B2 (ja) * | 2014-10-28 | 2019-02-13 | 信越ポリマー株式会社 | 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれらの製造方法 |
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KR101862121B1 (ko) * | 2015-02-02 | 2018-05-29 | 토요잉크Sc홀딩스주식회사 | 전자파 차폐 시트, 프린트 배선판 및 전자 기기 |
CN104639693A (zh) * | 2015-02-28 | 2015-05-20 | 上海鼎讯电子有限公司 | 柔性连接件及移动终端 |
CN106003916A (zh) * | 2016-05-04 | 2016-10-12 | 胡银坤 | 一种电磁屏蔽膜 |
JP6694763B2 (ja) * | 2016-06-08 | 2020-05-20 | 信越ポリマー株式会社 | 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板 |
CN107953648A (zh) * | 2017-12-27 | 2018-04-24 | 太仓金煜电子材料有限公司 | 一种阻燃级哑黑复合薄膜及其生产方法 |
JP6706655B2 (ja) * | 2018-10-01 | 2020-06-10 | 信越ポリマー株式会社 | 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれらの製造方法 |
JP6706654B2 (ja) * | 2018-10-01 | 2020-06-10 | 信越ポリマー株式会社 | 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれらの製造方法 |
JP6497477B1 (ja) * | 2018-10-03 | 2019-04-10 | 東洋インキScホールディングス株式会社 | 電磁波シールドシート、および電子部品搭載基板 |
JP7281888B2 (ja) * | 2018-10-16 | 2023-05-26 | 信越ポリマー株式会社 | 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板及びその製造方法 |
JP2020064927A (ja) * | 2018-10-16 | 2020-04-23 | 信越ポリマー株式会社 | 電磁波シールドフィルム及びその製造方法、並びに電磁波シールドフィルム付きプリント配線板 |
CN109808267B (zh) * | 2019-01-31 | 2021-01-29 | 常德力元新材料有限责任公司 | 一种电磁屏蔽复合材料及其制备方法 |
TWI800733B (zh) * | 2019-05-29 | 2023-05-01 | 日商拓自達電線股份有限公司 | 電磁波屏蔽膜及屏蔽印刷配線板 |
CN111073530B (zh) * | 2019-12-02 | 2021-03-30 | 苏州市新广益电子有限公司 | 一种用于fpc电镀的导电胶膜及其生产工艺 |
CN111669957B (zh) * | 2020-06-15 | 2022-08-02 | 江苏百旭电子新材料科技有限公司 | 一种fpc热压屏蔽膜及其生产方法 |
CN111968536B (zh) * | 2020-09-09 | 2022-06-10 | 武汉华星光电半导体显示技术有限公司 | 屏蔽带及显示模组的制备方法 |
JP7420062B2 (ja) * | 2020-12-24 | 2024-01-23 | Dic株式会社 | 導電性積層体及び導電性粘着テープ |
CN115734601A (zh) * | 2022-11-24 | 2023-03-03 | 昆山雅森电子材料科技有限公司 | 一种高段差电磁干扰屏蔽膜及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010109842A1 (ja) * | 2009-03-25 | 2010-09-30 | 三井・デュポンポリケミカル株式会社 | 電子部品用金属層付きフィルム、その製造方法および用途 |
KR100996070B1 (ko) | 2010-04-29 | 2010-11-22 | 우영관 | 블랙쉴드 및 이의 제조방법, 블랙쉴드를 이용한 pcb 또는 fpc의 제조방법 |
KR20110026436A (ko) * | 2008-05-30 | 2011-03-15 | 다츠다 덴센 가부시키가이샤 | 전자파 실드재 및 프린트 배선판 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07122883A (ja) * | 1993-10-21 | 1995-05-12 | Nitto Denko Corp | 電磁波シ−ルド材 |
JP4156233B2 (ja) * | 2001-12-19 | 2008-09-24 | 大日本印刷株式会社 | 電磁波シールド材、及び電磁波シールド付きフラットケーブル |
JP4201548B2 (ja) * | 2002-07-08 | 2008-12-24 | タツタ電線株式会社 | シールドフィルム、シールドフレキシブルプリント配線板及びそれらの製造方法 |
JP2004364267A (ja) * | 2003-05-09 | 2004-12-24 | Matsushita Electric Ind Co Ltd | 撮像装置 |
JP2005056906A (ja) * | 2003-08-05 | 2005-03-03 | Reiko Co Ltd | 電磁波遮蔽性転写フイルム |
JP2007045974A (ja) * | 2005-08-11 | 2007-02-22 | Nitto Denko Corp | 熱硬化型粘接着剤組成物、熱硬化型粘接着テープ又はシートおよび配線回路基板 |
KR100761435B1 (ko) * | 2006-12-19 | 2007-09-27 | 구자은 | 수분산 폴리우레탄을 이용한 진공증착용 전자파 차폐 층 |
JP4436441B2 (ja) * | 2007-06-08 | 2010-03-24 | 大日本印刷株式会社 | 電磁波シールド材及びその製造方法 |
JP2009246121A (ja) * | 2008-03-31 | 2009-10-22 | Nippon Steel Chem Co Ltd | 電磁波シールド材及びその製造方法 |
-
2011
- 2011-09-16 JP JP2011203034A patent/JP5712095B2/ja active Active
-
2012
- 2012-08-13 TW TW101129170A patent/TWI547236B/zh active
- 2012-09-12 KR KR1020120100925A patent/KR101405361B1/ko active IP Right Grant
- 2012-09-14 CN CN201510278068.0A patent/CN105050314B/zh active Active
- 2012-09-14 CN CN2012103420250A patent/CN103002725A/zh active Pending
-
2014
- 2014-04-17 KR KR1020140045947A patent/KR20140063546A/ko not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110026436A (ko) * | 2008-05-30 | 2011-03-15 | 다츠다 덴센 가부시키가이샤 | 전자파 실드재 및 프린트 배선판 |
WO2010109842A1 (ja) * | 2009-03-25 | 2010-09-30 | 三井・デュポンポリケミカル株式会社 | 電子部品用金属層付きフィルム、その製造方法および用途 |
KR100996070B1 (ko) | 2010-04-29 | 2010-11-22 | 우영관 | 블랙쉴드 및 이의 제조방법, 블랙쉴드를 이용한 pcb 또는 fpc의 제조방법 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180071483A (ko) * | 2016-12-20 | 2018-06-28 | 주식회사 두산 | 커버레이용 필름 |
KR102014583B1 (ko) * | 2016-12-20 | 2019-08-26 | 주식회사 두산 | 커버레이용 필름 |
Also Published As
Publication number | Publication date |
---|---|
KR20130099799A (ko) | 2013-09-06 |
TW201325428A (zh) | 2013-06-16 |
KR20140063546A (ko) | 2014-05-27 |
CN105050314A (zh) | 2015-11-11 |
CN103002725A (zh) | 2013-03-27 |
TWI547236B (zh) | 2016-08-21 |
JP2013065675A (ja) | 2013-04-11 |
JP5712095B2 (ja) | 2015-05-07 |
CN105050314B (zh) | 2017-04-12 |
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