KR101404250B1 - 취성 재료의 분할 장치 및 할단 방법 - Google Patents

취성 재료의 분할 장치 및 할단 방법 Download PDF

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Publication number
KR101404250B1
KR101404250B1 KR1020117016142A KR20117016142A KR101404250B1 KR 101404250 B1 KR101404250 B1 KR 101404250B1 KR 1020117016142 A KR1020117016142 A KR 1020117016142A KR 20117016142 A KR20117016142 A KR 20117016142A KR 101404250 B1 KR101404250 B1 KR 101404250B1
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KR
South Korea
Prior art keywords
laser beam
brittle material
beam irradiation
laser
irradiation area
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Application number
KR1020117016142A
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English (en)
Korean (ko)
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KR20110106360A (ko
Inventor
히토시 에노키조노
노리오 가루베
Original Assignee
가부시키가이샤 레미
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Application filed by 가부시키가이샤 레미 filed Critical 가부시키가이샤 레미
Publication of KR20110106360A publication Critical patent/KR20110106360A/ko
Application granted granted Critical
Publication of KR101404250B1 publication Critical patent/KR101404250B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Toxicology (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
  • Laser Beam Processing (AREA)
KR1020117016142A 2008-12-16 2009-12-15 취성 재료의 분할 장치 및 할단 방법 KR101404250B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008320251 2008-12-16
JPJP-P-2008-320251 2008-12-16
PCT/JP2009/070900 WO2010071128A1 (fr) 2008-12-16 2009-12-15 Appareil de fendage et procédé de division pour matériau cassant

Publications (2)

Publication Number Publication Date
KR20110106360A KR20110106360A (ko) 2011-09-28
KR101404250B1 true KR101404250B1 (ko) 2014-06-09

Family

ID=42268799

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117016142A KR101404250B1 (ko) 2008-12-16 2009-12-15 취성 재료의 분할 장치 및 할단 방법

Country Status (4)

Country Link
JP (1) JP5562254B2 (fr)
KR (1) KR101404250B1 (fr)
CN (1) CN102239034A (fr)
WO (1) WO2010071128A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102515494B (zh) * 2011-12-05 2014-04-09 深圳市华星光电技术有限公司 一种玻璃基板切割装置
KR102421381B1 (ko) 2014-02-20 2022-07-18 코닝 인코포레이티드 얇은 가요성 유리에 반경을 절단하기 위한 방법 및 장치
DE102014116957A1 (de) 2014-11-19 2016-05-19 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung
EP3854513B1 (fr) * 2014-11-19 2024-01-03 TRUMPF Laser- und Systemtechnik GmbH Système de formation d'un faisceau optique asymétrique
DE102014116958B9 (de) 2014-11-19 2017-10-05 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung
JP6700581B2 (ja) * 2015-06-25 2020-05-27 日本電気硝子株式会社 管ガラスの切断方法及び切断装置、並びに管ガラス製品の製造方法
KR20180075707A (ko) * 2015-11-25 2018-07-04 코닝 인코포레이티드 유리 웹의 분리 방법들
SG11202008663VA (en) * 2018-03-30 2020-10-29 Tokyo Electron Ltd Laser processing device and laser processing method
JP7466829B2 (ja) * 2020-02-06 2024-04-15 日本電気硝子株式会社 ガラス板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08197271A (ja) * 1995-01-27 1996-08-06 Ricoh Co Ltd 脆性材料の割断方法及び脆性材料の割断装置
JP2005212364A (ja) 2004-01-30 2005-08-11 Shibaura Mechatronics Corp 脆性材料の割断加工システム及びその方法
JP2008246808A (ja) 2007-03-30 2008-10-16 Japan Steel Works Ltd:The 高脆性非金属材料製の被加工物の加工方法及びその装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1255858C (zh) * 2001-07-16 2006-05-10 三星宝石工业株式会社 脆性材料基板的划线装置和脆性材料基板的划线方法
CN100398570C (zh) * 2001-07-19 2008-07-02 尤尼威蒂恩技术有限责任公司 含有弱共聚单体引入剂和良共聚单体引入剂的混合金属茂催化剂体系
JPWO2006038565A1 (ja) * 2004-10-01 2008-05-15 三星ダイヤモンド工業株式会社 脆性材料のスクライブ方法およびスクライブ装置
JP2006137169A (ja) * 2004-11-12 2006-06-01 Lemi Ltd 脆性材料の割断方法及び装置
JP2007076930A (ja) * 2005-09-12 2007-03-29 Joyo Kogaku Kk ガラス切断方法
WO2007094348A1 (fr) * 2006-02-15 2007-08-23 Toray Engineering Co., Ltd. Procede et appareil de decoupe au laser et substrat decoupe en utilisant un tel procede ou appareil

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08197271A (ja) * 1995-01-27 1996-08-06 Ricoh Co Ltd 脆性材料の割断方法及び脆性材料の割断装置
JP2005212364A (ja) 2004-01-30 2005-08-11 Shibaura Mechatronics Corp 脆性材料の割断加工システム及びその方法
JP2008246808A (ja) 2007-03-30 2008-10-16 Japan Steel Works Ltd:The 高脆性非金属材料製の被加工物の加工方法及びその装置

Also Published As

Publication number Publication date
KR20110106360A (ko) 2011-09-28
CN102239034A (zh) 2011-11-09
JP5562254B2 (ja) 2014-07-30
WO2010071128A1 (fr) 2010-06-24
JPWO2010071128A1 (ja) 2012-05-31

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