SG11202008663VA - Laser processing device and laser processing method - Google Patents

Laser processing device and laser processing method

Info

Publication number
SG11202008663VA
SG11202008663VA SG11202008663VA SG11202008663VA SG11202008663VA SG 11202008663V A SG11202008663V A SG 11202008663VA SG 11202008663V A SG11202008663V A SG 11202008663VA SG 11202008663V A SG11202008663V A SG 11202008663VA SG 11202008663V A SG11202008663V A SG 11202008663VA
Authority
SG
Singapore
Prior art keywords
laser processing
processing device
processing method
laser
processing
Prior art date
Application number
SG11202008663VA
Inventor
Hirotoshi Mori
Yoshihiro Kawaguchi
Hayato Tanoue
Kazuya Hisano
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG11202008663VA publication Critical patent/SG11202008663VA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Laser Beam Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
SG11202008663VA 2018-03-30 2019-03-18 Laser processing device and laser processing method SG11202008663VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018069540 2018-03-30
PCT/JP2019/011231 WO2019188518A1 (en) 2018-03-30 2019-03-18 Laser processing device and laser processing method

Publications (1)

Publication Number Publication Date
SG11202008663VA true SG11202008663VA (en) 2020-10-29

Family

ID=68061557

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202008663VA SG11202008663VA (en) 2018-03-30 2019-03-18 Laser processing device and laser processing method

Country Status (7)

Country Link
US (1) US20210053150A1 (en)
JP (1) JP6942244B2 (en)
KR (1) KR20200132857A (en)
CN (1) CN111918747A (en)
SG (1) SG11202008663VA (en)
TW (1) TW201942967A (en)
WO (1) WO2019188518A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023209891A1 (en) * 2022-04-27 2023-11-02 ヤマハ発動機株式会社 Wafer processing device, semiconductor chip manufacturing method, and semiconductor chip

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2579469B2 (en) * 1986-09-18 1997-02-05 株式会社 東京精密 Semiconductor wafer dicing method and apparatus
JPH09199448A (en) * 1996-01-23 1997-07-31 Seiko Seiki Co Ltd Dicing device
US20060243710A1 (en) * 2003-05-22 2006-11-02 Tokyo Seimitsu Co., Ltd. Dicing device
WO2007055010A1 (en) * 2005-11-10 2007-05-18 Renesas Technology Corp. Semiconductor device manufacturing method and semiconductor device
KR101404250B1 (en) * 2008-12-16 2014-06-09 가부시키가이샤 레미 Splitting apparatus and cleavage method for brittle material
JP2011091293A (en) 2009-10-26 2011-05-06 Disco Abrasive Syst Ltd Method for processing wafer
JP5843292B2 (en) * 2013-03-21 2016-01-13 株式会社日本製鋼所 Annealing semiconductor substrate manufacturing method, scanning apparatus, and laser processing apparatus
JP6570942B2 (en) * 2015-09-18 2019-09-04 株式会社ディスコ Dividing device and wafer dividing method
JP6633429B2 (en) * 2016-03-11 2020-01-22 株式会社ディスコ Laser processing equipment
JP6625926B2 (en) * 2016-04-13 2019-12-25 株式会社ディスコ Wafer processing method
JP2018121031A (en) * 2017-01-27 2018-08-02 株式会社ディスコ Laser processing device

Also Published As

Publication number Publication date
WO2019188518A1 (en) 2019-10-03
CN111918747A (en) 2020-11-10
TW201942967A (en) 2019-11-01
US20210053150A1 (en) 2021-02-25
JPWO2019188518A1 (en) 2021-03-11
JP6942244B2 (en) 2021-09-29
KR20200132857A (en) 2020-11-25

Similar Documents

Publication Publication Date Title
SG11202006179QA (en) Blockchain-based data processing method and device
EP3581321A4 (en) Laser processing device and laser processing method
EP3551372A4 (en) Laser processing apparatus and method
EP3731991A4 (en) Laser processing apparatus and method
EP3285956A4 (en) Laser processing apparatus and method
EP3697047A4 (en) Rule processing method and device
EP3754593A4 (en) Processing method and processing device using this
EP3613534C0 (en) Laser peening processing device and laser peening processing method
SG11202101538TA (en) Information processing method and device
EP3546109A4 (en) Laser processing device and laser processing method
SG11202008643PA (en) Laser processing device, laser processing system, and laser processing method
EP3738712A4 (en) Processing device and processing method
IL279540B1 (en) Lightguide device and laser processing device
EP3486026A4 (en) Laser processing method and laser processing apparatus
SG11202104444PA (en) Data processing method and device
EP3444062A4 (en) Laser processing device and laser processing method
EP3674894A4 (en) Processing method and device
SG11202008663VA (en) Laser processing device and laser processing method
SG10202008649VA (en) Laser processing method and laser processing apparatus
SG11202107380WA (en) Processing method and device
GB2578508B (en) Optical device and method
EP3693125A4 (en) Laser processing method and device
HK1248933A1 (en) Object processing method and device
PL3970904T3 (en) Groove processing device and groove processing method
HK1246435A1 (en) Interaction processing method and device