CN102239034A - 脆性材料的分割装置及割断方法 - Google Patents

脆性材料的分割装置及割断方法 Download PDF

Info

Publication number
CN102239034A
CN102239034A CN2009801489582A CN200980148958A CN102239034A CN 102239034 A CN102239034 A CN 102239034A CN 2009801489582 A CN2009801489582 A CN 2009801489582A CN 200980148958 A CN200980148958 A CN 200980148958A CN 102239034 A CN102239034 A CN 102239034A
Authority
CN
China
Prior art keywords
laser beam
beam irradiation
fragile material
laser
irradiation area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801489582A
Other languages
English (en)
Chinese (zh)
Inventor
榎园人士
轻部规夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LEMI Co Ltd
Original Assignee
LEMI Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LEMI Co Ltd filed Critical LEMI Co Ltd
Publication of CN102239034A publication Critical patent/CN102239034A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Toxicology (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
  • Laser Beam Processing (AREA)
CN2009801489582A 2008-12-16 2009-12-15 脆性材料的分割装置及割断方法 Pending CN102239034A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008-320251 2008-12-16
JP2008320251 2008-12-16
PCT/JP2009/070900 WO2010071128A1 (fr) 2008-12-16 2009-12-15 Appareil de fendage et procédé de division pour matériau cassant

Publications (1)

Publication Number Publication Date
CN102239034A true CN102239034A (zh) 2011-11-09

Family

ID=42268799

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801489582A Pending CN102239034A (zh) 2008-12-16 2009-12-15 脆性材料的分割装置及割断方法

Country Status (4)

Country Link
JP (1) JP5562254B2 (fr)
KR (1) KR101404250B1 (fr)
CN (1) CN102239034A (fr)
WO (1) WO2010071128A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013082830A1 (fr) * 2011-12-05 2013-06-13 深圳市华星光电技术有限公司 Dispositif de coupe et procédé pour substrat en verre
CN107635934A (zh) * 2015-06-25 2018-01-26 日本电气硝子株式会社 管玻璃的切断方法及切断装置、以及管玻璃产品的制造方法
CN111918747A (zh) * 2018-03-30 2020-11-10 东京毅力科创株式会社 激光加工装置和激光加工方法
US10941070B2 (en) 2014-02-20 2021-03-09 Corning Incorporated Methods and apparatus for cutting radii in flexible thin glass
CN114761365A (zh) * 2020-02-06 2022-07-15 日本电气硝子株式会社 玻璃板的制造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014116957A1 (de) 2014-11-19 2016-05-19 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung
EP3854513B1 (fr) * 2014-11-19 2024-01-03 TRUMPF Laser- und Systemtechnik GmbH Système de formation d'un faisceau optique asymétrique
DE102014116958B9 (de) 2014-11-19 2017-10-05 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung
KR20180075707A (ko) * 2015-11-25 2018-07-04 코닝 인코포레이티드 유리 웹의 분리 방법들

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08197271A (ja) * 1995-01-27 1996-08-06 Ricoh Co Ltd 脆性材料の割断方法及び脆性材料の割断装置
CN1529648A (zh) * 2001-07-16 2004-09-15 三星宝石工业株式会社 脆性材料基板的划线装置
JP2005212364A (ja) * 2004-01-30 2005-08-11 Shibaura Mechatronics Corp 脆性材料の割断加工システム及びその方法
CN101043992A (zh) * 2004-10-01 2007-09-26 三星钻石工业股份有限公司 脆性材料的划线方法以及划线装置
JP2008246808A (ja) * 2007-03-30 2008-10-16 Japan Steel Works Ltd:The 高脆性非金属材料製の被加工物の加工方法及びその装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100398570C (zh) * 2001-07-19 2008-07-02 尤尼威蒂恩技术有限责任公司 含有弱共聚单体引入剂和良共聚单体引入剂的混合金属茂催化剂体系
JP2006137169A (ja) * 2004-11-12 2006-06-01 Lemi Ltd 脆性材料の割断方法及び装置
JP2007076930A (ja) * 2005-09-12 2007-03-29 Joyo Kogaku Kk ガラス切断方法
WO2007094348A1 (fr) * 2006-02-15 2007-08-23 Toray Engineering Co., Ltd. Procede et appareil de decoupe au laser et substrat decoupe en utilisant un tel procede ou appareil

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08197271A (ja) * 1995-01-27 1996-08-06 Ricoh Co Ltd 脆性材料の割断方法及び脆性材料の割断装置
CN1529648A (zh) * 2001-07-16 2004-09-15 三星宝石工业株式会社 脆性材料基板的划线装置
JP2005212364A (ja) * 2004-01-30 2005-08-11 Shibaura Mechatronics Corp 脆性材料の割断加工システム及びその方法
CN101043992A (zh) * 2004-10-01 2007-09-26 三星钻石工业股份有限公司 脆性材料的划线方法以及划线装置
JP2008246808A (ja) * 2007-03-30 2008-10-16 Japan Steel Works Ltd:The 高脆性非金属材料製の被加工物の加工方法及びその装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013082830A1 (fr) * 2011-12-05 2013-06-13 深圳市华星光电技术有限公司 Dispositif de coupe et procédé pour substrat en verre
US10941070B2 (en) 2014-02-20 2021-03-09 Corning Incorporated Methods and apparatus for cutting radii in flexible thin glass
CN107635934A (zh) * 2015-06-25 2018-01-26 日本电气硝子株式会社 管玻璃的切断方法及切断装置、以及管玻璃产品的制造方法
CN111918747A (zh) * 2018-03-30 2020-11-10 东京毅力科创株式会社 激光加工装置和激光加工方法
CN114761365A (zh) * 2020-02-06 2022-07-15 日本电气硝子株式会社 玻璃板的制造方法

Also Published As

Publication number Publication date
KR20110106360A (ko) 2011-09-28
KR101404250B1 (ko) 2014-06-09
JP5562254B2 (ja) 2014-07-30
WO2010071128A1 (fr) 2010-06-24
JPWO2010071128A1 (ja) 2012-05-31

Similar Documents

Publication Publication Date Title
CN102239034A (zh) 脆性材料的分割装置及割断方法
TWI460044B (zh) Thermal Stress Cutting Method for Brittle Materials
CN102060437B (zh) 基于大区域不均匀温度分布的脆性材料的热应力切割方法及装置
JP6273231B2 (ja) 精密レーザ罫書き
TWI462793B (zh) 利用超短雷射脈衝光從兩面切割加工對象物的方法和裝置
JP5113462B2 (ja) 脆性材料基板の面取り方法
KR100699729B1 (ko) 유리의 절단 방법
EP2429961B1 (fr) Procédés pour la coupe d'un matériau fragile
CN106966580B (zh) 一种飞秒激光切割玻璃的方法
KR101440481B1 (ko) 취성 재료 기판의 스크라이브 방법 및 취성 재료 기판의 스크라이브 장치
JP2013031879A (ja) 超短パルスレーザでの透明材料処理
JPH03258476A (ja) レーザ切断方法
CN102310285B (zh) 硅-玻璃键合片的激光加工装置及其方法
TWI476063B (zh) 雷射切割方法與裝置
KR20110003531A (ko) 취성 재료 기판의 가공 방법
CN103831527A (zh) 一种激光快速分离光学晶体方法及装置
JP5057088B2 (ja) ガラス板の切断方法、及びガラス板切断用テーブル装置
JP2007055000A (ja) 非金属材料製の被加工物の切断方法及びその装置
CN202174351U (zh) 硅-玻璃键合片的激光加工装置
US20100117199A1 (en) Method and apparatus for the production of thin disks or films from semiconductor bodies
JP2007261885A (ja) 重ねガラスの割断方法
KR20180035111A (ko) 취성 재료 기판의 분단 방법 그리고 분단 장치
CN203725988U (zh) 一种激光快速分离光学晶体装置
JP2001212683A (ja) 脆性材料の割断装置、脆性材料の割断方法および液晶表示装置の製造方法
Gao et al. Investigations on the laser cutting of LiNbO3

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1160073

Country of ref document: HK

C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20111109

REG Reference to a national code

Ref country code: HK

Ref legal event code: WD

Ref document number: 1160073

Country of ref document: HK