JP5562254B2 - 脆性材料の分割装置および割断方法 - Google Patents

脆性材料の分割装置および割断方法 Download PDF

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Publication number
JP5562254B2
JP5562254B2 JP2010542973A JP2010542973A JP5562254B2 JP 5562254 B2 JP5562254 B2 JP 5562254B2 JP 2010542973 A JP2010542973 A JP 2010542973A JP 2010542973 A JP2010542973 A JP 2010542973A JP 5562254 B2 JP5562254 B2 JP 5562254B2
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Japan
Prior art keywords
laser beam
beam irradiation
brittle material
irradiation region
laser
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Expired - Fee Related
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JP2010542973A
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English (en)
Japanese (ja)
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JPWO2010071128A1 (ja
Inventor
人士 榎園
規夫 軽部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LEMI Co Ltd
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LEMI Co Ltd
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Publication date
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Priority to JP2010542973A priority Critical patent/JP5562254B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Toxicology (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
  • Laser Beam Processing (AREA)
JP2010542973A 2008-12-16 2009-12-15 脆性材料の分割装置および割断方法 Expired - Fee Related JP5562254B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010542973A JP5562254B2 (ja) 2008-12-16 2009-12-15 脆性材料の分割装置および割断方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008320251 2008-12-16
JP2008320251 2008-12-16
PCT/JP2009/070900 WO2010071128A1 (fr) 2008-12-16 2009-12-15 Appareil de fendage et procédé de division pour matériau cassant
JP2010542973A JP5562254B2 (ja) 2008-12-16 2009-12-15 脆性材料の分割装置および割断方法

Publications (2)

Publication Number Publication Date
JPWO2010071128A1 JPWO2010071128A1 (ja) 2012-05-31
JP5562254B2 true JP5562254B2 (ja) 2014-07-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010542973A Expired - Fee Related JP5562254B2 (ja) 2008-12-16 2009-12-15 脆性材料の分割装置および割断方法

Country Status (4)

Country Link
JP (1) JP5562254B2 (fr)
KR (1) KR101404250B1 (fr)
CN (1) CN102239034A (fr)
WO (1) WO2010071128A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102515494B (zh) * 2011-12-05 2014-04-09 深圳市华星光电技术有限公司 一种玻璃基板切割装置
KR102421381B1 (ko) 2014-02-20 2022-07-18 코닝 인코포레이티드 얇은 가요성 유리에 반경을 절단하기 위한 방법 및 장치
DE102014116957A1 (de) 2014-11-19 2016-05-19 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung
EP3854513B1 (fr) * 2014-11-19 2024-01-03 TRUMPF Laser- und Systemtechnik GmbH Système de formation d'un faisceau optique asymétrique
DE102014116958B9 (de) 2014-11-19 2017-10-05 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung
JP6700581B2 (ja) * 2015-06-25 2020-05-27 日本電気硝子株式会社 管ガラスの切断方法及び切断装置、並びに管ガラス製品の製造方法
KR20180075707A (ko) * 2015-11-25 2018-07-04 코닝 인코포레이티드 유리 웹의 분리 방법들
SG11202008663VA (en) * 2018-03-30 2020-10-29 Tokyo Electron Ltd Laser processing device and laser processing method
JP7466829B2 (ja) * 2020-02-06 2024-04-15 日本電気硝子株式会社 ガラス板の製造方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08197271A (ja) * 1995-01-27 1996-08-06 Ricoh Co Ltd 脆性材料の割断方法及び脆性材料の割断装置
WO2003008468A2 (fr) * 2001-07-19 2003-01-30 Univation Technologies, Llc Systemes catalyseurs mixtes a metallocene contenant un agent a faible incorporation de comonomere et un agent assurant une bonne incorporation de comonomere
WO2003008168A1 (fr) * 2001-07-16 2003-01-30 Mitsuboshi Diamond Industrial Co., Ltd. Dispositif de rainurage pour substrat constitue de matiere fragile
JP2005212364A (ja) * 2004-01-30 2005-08-11 Shibaura Mechatronics Corp 脆性材料の割断加工システム及びその方法
JP2006137169A (ja) * 2004-11-12 2006-06-01 Lemi Ltd 脆性材料の割断方法及び装置
JP2007076930A (ja) * 2005-09-12 2007-03-29 Joyo Kogaku Kk ガラス切断方法
WO2007094348A1 (fr) * 2006-02-15 2007-08-23 Toray Engineering Co., Ltd. Procede et appareil de decoupe au laser et substrat decoupe en utilisant un tel procede ou appareil
JP2008246808A (ja) * 2007-03-30 2008-10-16 Japan Steel Works Ltd:The 高脆性非金属材料製の被加工物の加工方法及びその装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2006038565A1 (ja) * 2004-10-01 2008-05-15 三星ダイヤモンド工業株式会社 脆性材料のスクライブ方法およびスクライブ装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08197271A (ja) * 1995-01-27 1996-08-06 Ricoh Co Ltd 脆性材料の割断方法及び脆性材料の割断装置
WO2003008168A1 (fr) * 2001-07-16 2003-01-30 Mitsuboshi Diamond Industrial Co., Ltd. Dispositif de rainurage pour substrat constitue de matiere fragile
WO2003008468A2 (fr) * 2001-07-19 2003-01-30 Univation Technologies, Llc Systemes catalyseurs mixtes a metallocene contenant un agent a faible incorporation de comonomere et un agent assurant une bonne incorporation de comonomere
JP2005212364A (ja) * 2004-01-30 2005-08-11 Shibaura Mechatronics Corp 脆性材料の割断加工システム及びその方法
JP2006137169A (ja) * 2004-11-12 2006-06-01 Lemi Ltd 脆性材料の割断方法及び装置
JP2007076930A (ja) * 2005-09-12 2007-03-29 Joyo Kogaku Kk ガラス切断方法
WO2007094348A1 (fr) * 2006-02-15 2007-08-23 Toray Engineering Co., Ltd. Procede et appareil de decoupe au laser et substrat decoupe en utilisant un tel procede ou appareil
JP2008246808A (ja) * 2007-03-30 2008-10-16 Japan Steel Works Ltd:The 高脆性非金属材料製の被加工物の加工方法及びその装置

Also Published As

Publication number Publication date
KR20110106360A (ko) 2011-09-28
KR101404250B1 (ko) 2014-06-09
CN102239034A (zh) 2011-11-09
WO2010071128A1 (fr) 2010-06-24
JPWO2010071128A1 (ja) 2012-05-31

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