WO2003008168A1 - Dispositif de rainurage pour substrat constitue de matiere fragile - Google Patents
Dispositif de rainurage pour substrat constitue de matiere fragile Download PDFInfo
- Publication number
- WO2003008168A1 WO2003008168A1 PCT/JP2002/007233 JP0207233W WO03008168A1 WO 2003008168 A1 WO2003008168 A1 WO 2003008168A1 JP 0207233 W JP0207233 W JP 0207233W WO 03008168 A1 WO03008168 A1 WO 03008168A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- material substrate
- fragile material
- scribing device
- laser spots
- peaks
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
- C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003513754A JPWO2003008168A1 (ja) | 2001-07-16 | 2002-07-16 | 脆性材料基板のスクライブ装置 |
HK05102267A HK1069797A1 (en) | 2001-07-16 | 2005-03-15 | Scribing device and method for fragile material substrate and scribing method for fragile material substrate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001215055 | 2001-07-16 | ||
JP2001-215055 | 2001-07-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003008168A1 true WO2003008168A1 (fr) | 2003-01-30 |
Family
ID=19049763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/007233 WO2003008168A1 (fr) | 2001-07-16 | 2002-07-16 | Dispositif de rainurage pour substrat constitue de matiere fragile |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPWO2003008168A1 (fr) |
KR (1) | KR100583889B1 (fr) |
CN (2) | CN100411825C (fr) |
HK (1) | HK1069797A1 (fr) |
TW (1) | TW542763B (fr) |
WO (1) | WO2003008168A1 (fr) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005102638A1 (fr) * | 2004-04-27 | 2005-11-03 | Mitsuboshi Diamond Industrial Co., Ltd. | Méthode pour former une fente verticale sur une plaque frittée et appareil de formation de fente verticale |
JP2006167804A (ja) * | 2004-11-19 | 2006-06-29 | Canon Inc | レーザ割断方法およびレーザ割断装置 |
JP2008229716A (ja) * | 2007-03-23 | 2008-10-02 | Toray Eng Co Ltd | レーザスクライブ方法および装置およびこの方法または装置を用いて割断した割断基板 |
JP2008264805A (ja) * | 2007-04-17 | 2008-11-06 | Disco Abrasive Syst Ltd | レーザー加工装置およびウエーハの裏面に装着された接着フィルムのレーザー加工方法 |
JP2009066613A (ja) * | 2007-09-11 | 2009-04-02 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板の分断装置および分断方法 |
JP2010520083A (ja) * | 2007-02-28 | 2010-06-10 | セラムテック アクチエンゲゼルシャフト | 分離線または目標破断線に沿った非対称的なエネルギ導入を使用して構成部分を製造するための方法 |
CN102012552A (zh) * | 2010-09-27 | 2011-04-13 | 江苏大学 | 多窗口多波长激光器光路自动调节系统 |
US8093530B2 (en) | 2004-11-19 | 2012-01-10 | Canon Kabushiki Kaisha | Laser cutting apparatus and laser cutting method |
JP2013004957A (ja) * | 2011-06-17 | 2013-01-07 | National Cheng Kung Univ | 発光素子構造及びその製造方法 |
JP5562254B2 (ja) * | 2008-12-16 | 2014-07-30 | 株式会社レミ | 脆性材料の分割装置および割断方法 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101296787B (zh) * | 2005-10-28 | 2012-02-15 | 三星钻石工业股份有限公司 | 脆性材料基板的划线形成方法及划线形成装置 |
CN102282485B (zh) * | 2009-08-06 | 2012-08-29 | 住友化学株式会社 | 偏光板的制造方法 |
CN102498580A (zh) * | 2009-08-06 | 2012-06-13 | 应用材料公司 | 横向等值线的划线、缝缀、以及简化的激光器与扫描器控制 |
CN102248308A (zh) * | 2011-06-24 | 2011-11-23 | 广东工业大学 | 利用激光空化微射流进行微加工的方法 |
JP6721439B2 (ja) * | 2016-07-11 | 2020-07-15 | 株式会社ディスコ | レーザー加工装置 |
CN113618251A (zh) * | 2021-08-04 | 2021-11-09 | 昆山燎原自动化设备有限责任公司 | 一种基板划线的激光加工设备 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06234092A (ja) * | 1993-02-12 | 1994-08-23 | Nikon Corp | レーザー加工装置 |
JPH1034364A (ja) * | 1996-07-25 | 1998-02-10 | Souei Tsusho Kk | 複数点熱源による脆性材料の割断加工方法 |
JPH11784A (ja) * | 1997-06-11 | 1999-01-06 | Mitsubishi Electric Corp | レーザ加工装置 |
JP2000058489A (ja) * | 1998-08-07 | 2000-02-25 | Disco Abrasive Syst Ltd | 被加工物の分割方法及び分割装置 |
JP2001151525A (ja) * | 1999-11-25 | 2001-06-05 | Mitsuboshi Diamond Industrial Co Ltd | ガラス板分割方法及び装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01306088A (ja) * | 1988-06-01 | 1989-12-11 | Nippei Toyama Corp | 可変ビームレーザ加工装置 |
JPH0639572A (ja) * | 1991-01-11 | 1994-02-15 | Souei Tsusho Kk | ウェハ割断装置 |
JPH0929472A (ja) * | 1995-07-14 | 1997-02-04 | Hitachi Ltd | 割断方法、割断装置及びチップ材料 |
JP3164508B2 (ja) * | 1996-05-22 | 2001-05-08 | 株式会社システクアカザワ | 罫書き装置 |
JPH10128567A (ja) * | 1996-10-30 | 1998-05-19 | Nec Kansai Ltd | レーザ割断方法 |
US6259058B1 (en) * | 1998-12-01 | 2001-07-10 | Accudyne Display And Semiconductor Systems, Inc. | Apparatus for separating non-metallic substrates |
US6211488B1 (en) * | 1998-12-01 | 2001-04-03 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe |
EP1232038B1 (fr) * | 1999-11-24 | 2008-04-23 | Applied Photonics, Inc. | Procede et dispositif de separation de materiaux non metalliques |
-
2002
- 2002-07-16 JP JP2003513754A patent/JPWO2003008168A1/ja active Pending
- 2002-07-16 KR KR1020037017063A patent/KR100583889B1/ko not_active IP Right Cessation
- 2002-07-16 CN CNB2006100598631A patent/CN100411825C/zh not_active Expired - Fee Related
- 2002-07-16 CN CNB028141822A patent/CN1255858C/zh not_active Expired - Fee Related
- 2002-07-16 WO PCT/JP2002/007233 patent/WO2003008168A1/fr active Application Filing
- 2002-07-16 TW TW091115803A patent/TW542763B/zh not_active IP Right Cessation
-
2005
- 2005-03-15 HK HK05102267A patent/HK1069797A1/xx not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06234092A (ja) * | 1993-02-12 | 1994-08-23 | Nikon Corp | レーザー加工装置 |
JPH1034364A (ja) * | 1996-07-25 | 1998-02-10 | Souei Tsusho Kk | 複数点熱源による脆性材料の割断加工方法 |
JPH11784A (ja) * | 1997-06-11 | 1999-01-06 | Mitsubishi Electric Corp | レーザ加工装置 |
JP2000058489A (ja) * | 1998-08-07 | 2000-02-25 | Disco Abrasive Syst Ltd | 被加工物の分割方法及び分割装置 |
JP2001151525A (ja) * | 1999-11-25 | 2001-06-05 | Mitsuboshi Diamond Industrial Co Ltd | ガラス板分割方法及び装置 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005102638A1 (fr) * | 2004-04-27 | 2005-11-03 | Mitsuboshi Diamond Industrial Co., Ltd. | Méthode pour former une fente verticale sur une plaque frittée et appareil de formation de fente verticale |
JP2006167804A (ja) * | 2004-11-19 | 2006-06-29 | Canon Inc | レーザ割断方法およびレーザ割断装置 |
US8093530B2 (en) | 2004-11-19 | 2012-01-10 | Canon Kabushiki Kaisha | Laser cutting apparatus and laser cutting method |
JP2010520083A (ja) * | 2007-02-28 | 2010-06-10 | セラムテック アクチエンゲゼルシャフト | 分離線または目標破断線に沿った非対称的なエネルギ導入を使用して構成部分を製造するための方法 |
JP2008229716A (ja) * | 2007-03-23 | 2008-10-02 | Toray Eng Co Ltd | レーザスクライブ方法および装置およびこの方法または装置を用いて割断した割断基板 |
JP2008264805A (ja) * | 2007-04-17 | 2008-11-06 | Disco Abrasive Syst Ltd | レーザー加工装置およびウエーハの裏面に装着された接着フィルムのレーザー加工方法 |
JP2009066613A (ja) * | 2007-09-11 | 2009-04-02 | Mitsuboshi Diamond Industrial Co Ltd | 脆性材料基板の分断装置および分断方法 |
JP5562254B2 (ja) * | 2008-12-16 | 2014-07-30 | 株式会社レミ | 脆性材料の分割装置および割断方法 |
CN102012552A (zh) * | 2010-09-27 | 2011-04-13 | 江苏大学 | 多窗口多波长激光器光路自动调节系统 |
JP2013004957A (ja) * | 2011-06-17 | 2013-01-07 | National Cheng Kung Univ | 発光素子構造及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TW542763B (en) | 2003-07-21 |
CN1827311A (zh) | 2006-09-06 |
CN1255858C (zh) | 2006-05-10 |
JPWO2003008168A1 (ja) | 2004-11-04 |
KR100583889B1 (ko) | 2006-05-26 |
KR20040017248A (ko) | 2004-02-26 |
HK1069797A1 (en) | 2005-06-03 |
CN1529648A (zh) | 2004-09-15 |
CN100411825C (zh) | 2008-08-20 |
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