WO2014175145A1 - Procédé de découpe de plaque de verre - Google Patents

Procédé de découpe de plaque de verre Download PDF

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Publication number
WO2014175145A1
WO2014175145A1 PCT/JP2014/060870 JP2014060870W WO2014175145A1 WO 2014175145 A1 WO2014175145 A1 WO 2014175145A1 JP 2014060870 W JP2014060870 W JP 2014060870W WO 2014175145 A1 WO2014175145 A1 WO 2014175145A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass plate
laser beam
cutting
main surface
laser
Prior art date
Application number
PCT/JP2014/060870
Other languages
English (en)
Japanese (ja)
Inventor
齋藤　勲
孝弘 永田
Original Assignee
旭硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 旭硝子株式会社 filed Critical 旭硝子株式会社
Publication of WO2014175145A1 publication Critical patent/WO2014175145A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/18—Sheet panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

Abstract

L'invention concerne un procédé de découpe d'une plaque de verre mis en oeuvre avec une précision dimensionnelle supérieure. Un mode de réalisation de ce procédé de découpe d'une plaque de verre comprend une étape de formation de lignes de découpe (31, 32) respectivement au niveau de la première surface primaire (11) et de la seconde surface primaire (12) d'une plaque de verre (10) au moyen d'une lumière laser à balayage (20) émise de la première surface primaire (11) à la seconde surface primaire (12). Les largeurs de faisceau (W1, W2) au niveau de la première surface primaire (11) et de la seconde surface primaire (12) de la lumière laser à balayage (20) sont maintenues chacune à une valeur non supérieure à l'épaisseur (t) de la plaque de verre (10).
PCT/JP2014/060870 2013-04-26 2014-04-16 Procédé de découpe de plaque de verre WO2014175145A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-093430 2013-04-26
JP2013093430A JP2016128362A (ja) 2013-04-26 2013-04-26 ガラス板の切断方法

Publications (1)

Publication Number Publication Date
WO2014175145A1 true WO2014175145A1 (fr) 2014-10-30

Family

ID=51791724

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/060870 WO2014175145A1 (fr) 2013-04-26 2014-04-16 Procédé de découpe de plaque de verre

Country Status (2)

Country Link
JP (1) JP2016128362A (fr)
WO (1) WO2014175145A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05305467A (ja) * 1992-04-27 1993-11-19 Central Glass Co Ltd 光透過性材料のレーザー切断法
JP2003089538A (ja) * 2001-06-28 2003-03-28 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のブレイク装置及びブレイク方法
JP2005179154A (ja) * 2003-12-22 2005-07-07 Shibuya Kogyo Co Ltd 脆性材料の割断方法およびその装置
WO2012096284A1 (fr) * 2011-01-11 2012-07-19 旭硝子株式会社 Procédé de découpe de feuille de verre armé

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05305467A (ja) * 1992-04-27 1993-11-19 Central Glass Co Ltd 光透過性材料のレーザー切断法
JP2003089538A (ja) * 2001-06-28 2003-03-28 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板のブレイク装置及びブレイク方法
JP2005179154A (ja) * 2003-12-22 2005-07-07 Shibuya Kogyo Co Ltd 脆性材料の割断方法およびその装置
WO2012096284A1 (fr) * 2011-01-11 2012-07-19 旭硝子株式会社 Procédé de découpe de feuille de verre armé

Also Published As

Publication number Publication date
JP2016128362A (ja) 2016-07-14

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