WO2014171396A1 - Procédé de découpe de feuille de verre - Google Patents

Procédé de découpe de feuille de verre Download PDF

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Publication number
WO2014171396A1
WO2014171396A1 PCT/JP2014/060424 JP2014060424W WO2014171396A1 WO 2014171396 A1 WO2014171396 A1 WO 2014171396A1 JP 2014060424 W JP2014060424 W JP 2014060424W WO 2014171396 A1 WO2014171396 A1 WO 2014171396A1
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WIPO (PCT)
Prior art keywords
glass plate
axis direction
cutting
axis
laser beam
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PCT/JP2014/060424
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English (en)
Japanese (ja)
Inventor
齋藤　勲
孝弘 永田
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旭硝子株式会社
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Publication of WO2014171396A1 publication Critical patent/WO2014171396A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam

Definitions

  • the present invention relates to a method for cutting a glass plate, and more particularly to a method for cutting a glass plate using internal heating by laser light.
  • the glass plate is usually cut by introducing a scribe line mechanically into the main surface with a hard roller or chip such as diamond and applying a bending force along the scribe line.
  • a scribe line mechanically into the main surface with a hard roller or chip such as diamond and applying a bending force along the scribe line.
  • a chamfering process is performed on a cut end surface (particularly a corner portion) of a glass plate after cutting from the viewpoint of preventing breakage.
  • a chamfering process is performed on a cut end surface (particularly a corner portion) of a glass plate after cutting from the viewpoint of preventing breakage.
  • the present invention has been made in view of the above, and an object of the present invention is to provide a method for cutting a glass plate with excellent productivity.
  • One aspect of the present invention provides the following glass plate cutting method.
  • the glass plate is shifted in the scanning direction of the laser light from the normal direction of the end surface including the scanning start point at which the scanning of the laser light is started on the glass plate as viewed from the normal direction of the first main surface.
  • the first principal surface and the second principal surface constitute an xy plane
  • the scanning direction is an x-axis plus direction
  • the normal direction of the first principal surface is
  • the first main surface side is the z-axis direction positive side
  • the second main surface side is the z-axis direction negative side
  • the first principal surface and the second principal surface constitute an xy plane
  • the scanning direction is an x-axis plus direction
  • the normal direction of the first principal surface is
  • the first main surface side is the z-axis direction positive side
  • the second main surface side is the z-axis direction negative side
  • the deviation angle ⁇ from the normal line of the end surface of the x-axis viewed from the z-axis direction plus side assumes a positive value counterclockwise
  • the cutting method of the glass plate as described in said (1) Forming a chamfer on the end face, The cutting method of the glass plate as described in said (1). (5) forming a protrusion on the cut end surface of the glass plate on the positive side in the y-axis direction; The cutting method of the glass plate as described in said (4). (6) The method further includes a step of dividing the glass plate along the scribe line by applying a bending force to the glass plate on which the scribe line is formed. The method for cutting a glass plate according to any one of the above (1) to (5). (7) The optical axis of the laser beam is parallel to the normal direction of the first main surface. The method for cutting a glass plate according to any one of the above (1) to (6).
  • the method further includes the step of forming an initial crack serving as a starting point of the scribe line on the end face.
  • the wavelength of the laser beam is 250 to 5000 nm.
  • FIG. 4 is an axial sectional view taken along line IV-IV in FIG. 2.
  • FIG. 5 is a cross-sectional view taken along line VV in FIG. 2. It is sectional drawing of the cooling nozzle used for the cutting
  • FIG. 6 is a plan view of the glass plate 10 schematically showing test conditions of Test Examples 11 to 14 in which the deviation angle ⁇ in the laser scanning direction (x-axis direction) with respect to the normal direction of the end face 13 is a positive value.
  • FIG. 6 is a plan view of the glass plate 10 schematically showing test conditions of Test Examples 15 to 18 in which the deviation angle ⁇ in the laser scanning direction (x-axis direction) with respect to the normal direction of the end face 13 is a negative value.
  • FIG. It is the photograph which observed the cut part of Test Example 11, 14, 15, 18 from the x-axis direction minus side. It is the photograph which observed the cut part of Test example 31 from the x-axis direction minus side. It is the photograph which observed the cut part of Test example 32 from the x-axis direction minus side.
  • FIG. 1 is a perspective view for explaining a method of forming scribe lines on the upper and lower surfaces of a glass plate.
  • FIG. 2 is a plan view showing a beam shape of laser light on the upper surface of the glass plate of FIG.
  • FIG. 3 is a plan view showing a beam shape of laser light on the lower surface of the glass plate of FIG. 4 is a cross-sectional view taken along line IV-IV in FIG.
  • FIG. 5 is a sectional view taken along line VV in FIG.
  • the arrow direction indicates the displacement direction of the irradiation position of the laser beam on the glass plate.
  • the arrow direction indicates the direction of action of stress. 4 and 5, the thermal deformation of the glass plate is exaggerated. The state of thermal deformation of the glass plate can be confirmed by finite element analysis.
  • both main surfaces (upper surface 11 and lower surface 12) of the glass plate 10 are both parallel to the xy plane.
  • the laser light is irradiated in the z-axis minus direction and scanned in the x-axis plus direction.
  • the optical axis of the laser beam is parallel to the z axis.
  • the glass plate cutting method includes a scribing step of forming scribe lines 31 and 32 on the glass plate 10.
  • the kind of glass of the glass plate 10 is not specifically limited, For example, soda-lime glass, an alkali free glass, etc. are mentioned.
  • the thickness of the glass plate 10 is appropriately set according to the use of the glass plate 10, and is, for example, 0.005 cm to 2.5 cm.
  • the glass plate 10 may be either non-tempered glass or tempered glass, but non-tempered glass is preferred.
  • the glass plate 10 is locally heated by the laser light 20 that passes through the glass plate 10 from the upper surface 11 side to the lower surface 12 side, and the irradiation position of the laser light 20 on the glass plate 10 is displaced.
  • the scribe lines 31 are formed on the lower surface 12 of the glass plate 10 at the same time as the scribe lines 31 are formed on the upper surface 11 of the glass plate 10 due to the thermal stress generated in the glass plate 10.
  • the scribe line 31 is also formed on the upper surface 11 of the glass plate 10, the cutting accuracy on the upper surface 11 and the lower surface 12 of the glass plate 10 is good. Furthermore, in the present embodiment, the scribe lines are simultaneously formed on the upper surface 11 and the lower surface 12 of the glass plate 10 with one laser beam 20, so that the scribe lines formed on the upper surface 11 and the lower surface 12 of the glass plate 10 are formed. The positional relationship tends to be a desired positional relationship.
  • the scribe line 32 formed on the lower surface 12 of the glass plate 10 tends to overlap. Therefore, the fractured surface of the glass plate 10 tends to be perpendicular to the upper surface 11 and the lower surface 12 of the glass plate 10.
  • the initial crack 33 which becomes the starting point of the scribe lines 31 and 32 may be formed in advance on the end surface 13 of the glass plate 10 as shown in FIG.
  • the initial crack 33 may reach the upper surface 11 and the lower surface 12 of the glass plate 10, and may also be formed on the upper surface 11 and the lower surface 12 of the glass plate 10.
  • the initial crack 33 is a common starting point for the scribe lines 31 and 32.
  • an initial crack when an initial crack is formed in the end surface 13 of the glass plate 10, it may reach only the upper surface 11 of the glass plate 10, may reach only the lower surface 12 of the glass plate 10, or the glass plate 10 The upper surface 11 and the lower surface 12 may not be reached. Further, the initial crack may be formed on each of the upper surface 11 and the lower surface 12 of the glass plate 10, and in this case, it may reach the end surface 13 or may not reach the end surface 13. The initial crack may be formed on at least one of both the upper surface 11 and the lower surface 12 of the glass plate 10 and the end surface 13 of the glass plate 10.
  • the formation method of the initial crack 33 may be a general method, for example, a method using a cutter, a file, a laser, or the like.
  • a method using a cutter, a file, a laser, or the like When the end surface 13 of the glass plate 10 is ground with a grindstone, microcracks formed by grinding can be used as initial cracks.
  • Part of the upper surface 11 of the glass plate 10 is heated by the laser beam 20 and bulges upward and symmetrically about the movement locus of the irradiation position of the laser beam 20 as shown in FIGS.
  • a tensile stress in a direction orthogonal to the direction of displacement of the irradiation position of the laser beam 20 is generated. Due to this tensile stress, the crack starting from the initial crack 33 extends along the movement locus of the irradiation position of the laser beam 20, and the scribe line 31 is formed.
  • the tip of the scribe line 31 is at the irradiation position of the laser beam 20 on the upper surface 11 of the glass plate 10 or in the vicinity of the front thereof.
  • a part of the lower surface 12 of the glass plate 10 is heated by the laser beam 20, and as shown in FIGS. 4 and 5, protrudes downward symmetrically about the movement locus of the irradiation position of the laser beam 20. Swell. In the portion that bulges downward, a tensile stress in a direction orthogonal to the direction of displacement of the irradiation position of the laser beam 20 is generated. Due to the tensile stress, the crack starting from the initial crack 33 extends along the movement locus of the irradiation position of the laser beam 20, and the scribe line 32 is formed. The tip of the scribe line 32 is at the irradiation position of the laser beam 20 on the lower surface 12 of the glass plate 10 or in the vicinity of the front thereof.
  • the scribe lines 31 and 32 both extend with the displacement of the irradiation position of the laser beam 20 on the glass plate 10.
  • the displacement of the irradiation position of the laser beam 20 on the glass plate 10 is performed by the movement or rotation of the support of the glass plate 10 relative to the frame of the cutting device, or the movement of the light source 22 of the laser beam 20, even if both are performed. Good. Further, the displacement of the irradiation position of the laser beam 20 on the glass plate 10 may be performed by rotation of a galvanometer mirror that reflects the laser beam 20 emitted from the light source 22 toward the glass plate 10.
  • Whether or not a scribe line can be formed on each of the upper surface 11 and the lower surface 12 of the glass plate 10 is mainly determined by the formation position of the initial crack 33 and the irradiation condition of the laser beam 20.
  • the irradiation conditions of the laser beam 20 include, for example, (1) the output of the light source 22, (2) the transmittance of the laser beam 20 with respect to the glass plate 10, and (3) the beam of the laser beam 20 on the upper surface 11 and the lower surface 12 of the glass plate 10. (4) Ratio (P1 / P2) of the power density (P1) of the laser beam 20 on the upper surface 11 of the glass plate 10 and the power density (P2) of the laser beam 20 on the lower surface 12 of the glass plate 10 It is done.
  • the product of ( ⁇ ⁇ M) is preferably larger than 0 and not larger than 3.0.
  • the internal transmittance of the laser beam 20 with respect to the glass plate 10 is high, and the lower surface 12 of the glass plate 10 can be sufficiently heated.
  • ⁇ ⁇ M is more preferably 2.3 or less (internal transmittance of 10% or more), and further preferably 1.6 or less (internal transmittance of 20% or more).
  • ⁇ ⁇ M is too small, the internal transmittance is too high and the absorption efficiency is too low. Therefore, it is preferably 0.002 or more (internal transmittance 99.8% or less), more preferably 0.01 or more (internal transmittance). 99% or less), more preferably 0.02 or more (internal transmittance of 98% or less).
  • the internal transmittance is a transmittance when there is no reflection on the upper surface 11 of the glass plate 10.
  • the heating temperature of the glass plate 10 is a temperature below the annealing point of glass.
  • the heating temperature of the glass plate exceeds the temperature of the annealing point of the glass, the glass is viscously flowed, the thermal stress is relaxed, and the scribe lines 31 and 32 are difficult to form.
  • the distance (M) that the laser beam 20 moves from the upper surface 11 to the lower surface 12 of the glass plate 10 is the same as the thickness (t) of the glass plate 10. Value.
  • the laser beam 20 is incident obliquely on the upper surface 11 of the glass plate 10
  • the laser beam 20 is refracted according to Snell's law. Therefore, when the refraction angle is ⁇ , the laser beam 20 moves from the upper surface 11 to the lower surface 12 of the glass plate 10.
  • a near-infrared (hereinafter simply referred to as “near-infrared”) laser having a wavelength of 800 to 1100 nm is used.
  • the near-infrared laser for example, a Yb fiber laser (wavelength: 1000 to 1100 nm), a Yb disk laser (wavelength: 1000 to 1100 nm), an Nd: YAG laser (wavelength: 1064 nm), a high-power semiconductor laser (wavelength: 808 to 980 nm) ).
  • These near-infrared lasers are high-powered and inexpensive, and it is easy to adjust ⁇ ⁇ M within a desired range.
  • a high-power and inexpensive near-infrared laser is used as the light source 22, but a light source having a wavelength of 250 to 5000 nm can be used.
  • a light source having a wavelength of 250 to 5000 nm can be used.
  • UV laser wavelength: 355 nm
  • green laser wavelength: 532 nm
  • Ho: YAG laser wavelength: 2080 nm
  • Er YAG laser (2940 nm)
  • laser using a mid-infrared light parametric oscillator (wavelength: 2600) To 3450 nm).
  • the oscillation method of the laser beam 20 is not limited, and either a CW laser that continuously oscillates the laser beam or a pulse laser that oscillates the laser beam intermittently can be used.
  • the intensity distribution of the laser beam 20 is not limited, and may be a Gaussian type or a top hat type.
  • the absorption coefficient ( ⁇ ) increases as the content of iron (Fe), the content of cobalt (Co), and the content of copper (Cu) in the glass plate 10 increase.
  • the absorption coefficient ( ⁇ ) increases in the vicinity of the absorption wavelength of the rare earth atom as the content of the rare earth element (for example, Yb) in the glass plate 10 increases.
  • the adjustment of the absorption coefficient ( ⁇ ) uses iron from the viewpoints of glass transparency and cost, and cobalt, copper, and rare earth elements may not be substantially contained in the glass plate 10.
  • the smaller the beam diameter W2 in the y-axis direction of the laser beam 20 on the lower surface 12, the steeper the portion that bulges downward, and the direction (y-axis) perpendicular to the displacement direction (x-axis direction) of the laser beam 20 Direction) tensile stress is large.
  • the laser beam 20 preferably has a beam diameter W1 in the y-axis direction on the upper surface 11 equal to or less than the plate thickness of the glass plate 10. Further, the laser beam 20 preferably has a beam diameter W2 in the y-axis direction on the lower surface 12 equal to or less than the plate thickness of the glass plate 10. A portion bulging upward on the upper surface 11 of the glass plate 10 and a portion bulging downward on the lower surface 12 of the glass plate 10 are sufficiently steep, and scribe lines are formed on the upper surface 11 and the lower surface 12 of the glass plate 10. Sufficient tensile stress is generated to do this.
  • the beam diameter L1 in the displacement direction (x-axis direction) of the laser beam 20 on the upper surface 11 and the beam diameter L2 in the displacement direction (x-axis direction) of the laser beam 20 on the lower surface 12 are not particularly limited. If L1 and L2 are short, the curved scribe lines 31 and 32 can be easily formed. Moreover, if L1 and L2 are long, when the heating time of the specific position in the glass plate 10 is the same, the displacement speed of the irradiation position of the laser beam 20 in the glass plate 10 is fast, and the scribe lines 31 and 32 can be formed in a short time. .
  • the beam shape of the laser beam 20 on the upper surface 11 and the lower surface 12 of the glass plate 10 is not particularly limited, but is preferably circular.
  • the width of the locus of the irradiation position of the laser beam 20 is constant, and the position accuracy of the scribe line is good.
  • the intensity (W) of the laser beam 20 is attenuated according to Lambert-Beer's law.
  • transmits is mainly determined by the power density (unit [W / cm ⁇ 2 >]) of the laser beam 20, etc.
  • the laser beam 20 has a ratio (P1 / P2) of the power density (P1) on the upper surface 11 of the glass plate 10 and the power density (P2) on the lower surface 12 of the glass plate 10 to 0.5-2. 0 is preferred.
  • S1 represents the irradiation area of the laser beam 20 on the upper surface 11 of the glass plate 10
  • S2 represents the irradiation area of the laser beam 20 on the lower surface 12 of the glass plate 10.
  • P1 / P2 When P1 / P2 is 0.5 to 2.0, the temperature of the irradiation position of the laser beam 20 on the upper surface 11 of the glass plate 10 and the temperature of the irradiation position of the laser beam 20 on the lower surface 12 of the glass plate 10 are the same. It will be about. Accordingly, the portion that bulges upward on the upper surface 11 of the glass plate 10 and the portion that bulges downward on the lower surface 12 of the glass plate 10 are steep to the same extent. As a result, the depth of the scribe line 31 formed on the upper surface 11 of the glass plate 10 and the depth of the scribe line 32 formed on the lower surface 12 of the glass plate 10 are approximately the same depth.
  • P1 / P2 is more preferably 0.6 or more, and further preferably 0.67 or more. Further, P1 / P2 is more preferably 1.67 or less, and further preferably 1.5 or less.
  • a condensing lens or the like (not shown) is disposed between the glass plate 10 and the like.
  • S1 / S2 is larger than 1.
  • the method for cutting the glass plate may further include a breaking step in which an external force is applied to the glass plate 10 and the glass plate 10 is cut along the scribe lines 31 and 32.
  • a glass plate can be cut.
  • the scribe lines 31 and 32 are coupled to each other by adjusting the irradiation condition of the laser light 20 and changing the generated thermal stress. You can also. That is, a full cut can be performed only by laser irradiation without going through a break process.
  • the tensile stress is generated in the entire plate thickness behind the irradiation position of the laser beam 20.
  • This tensile stress is formed behind the irradiation position of the laser beam 20 as a reaction force of the compressive stress generated by heating at the irradiation position of the laser beam 20. Therefore, when the tensile stress behind the irradiation position of the laser beam 20 is larger, the scribe line 31 on the upper surface 11 side and the scribe line 32 on the lower surface 12 side extend in the plate thickness inside direction and are combined.
  • the shape of the crack formed by combining the scribe lines 31 and 32 is determined by the difference in the thermal stress field and the rigidity of the glass plate 10.
  • Whether or not the scribe lines 31 and 32 are coupled by the thermal stress based on the irradiation of the laser beam 20 is mainly determined by the transmittance of the laser beam 20 with respect to the glass plate 10 and the output of the light source 22.
  • the scribe lines 31 and 32 are coupled.
  • the glass plate 10 may be irradiated with heating light emitted from a heating light source different from the light source 22 in order to combine the scribe lines 31 and 32.
  • the cutting of the glass plate 10 according to the present embodiment has better cutting accuracy on the upper surface 11 and the lower surface 12 of the glass plate 10 than the full cut disclosed in Patent Document 1.
  • tensile stress is generated by cooling the rear of the irradiation position of the laser beam with a refrigerant, and a crack penetrating the glass plate 10 in the thickness direction is formed by this tensile stress. That is, in Patent Document 1, no scribe line is formed by laser light irradiation.
  • the scribe lines 31 and 32 are formed by the tensile stress generated at the irradiation position of the laser beam 20 on the upper surface 11 and the lower surface 12 of the glass plate 10. Therefore, the tip positions of the scribe lines 31 and 32 are close to the irradiation position of the laser light 20, and the positions of the scribe lines 31 and 32 and the locus of the laser light 20 are likely to coincide with each other. Therefore, the positional accuracy of the scribe lines 31 and 32 formed on the upper surface 11 and the lower surface 12 of the glass plate 10 is good, and the cutting accuracy on the upper surface 11 and the lower surface 12 of the glass plate 10 is good.
  • FIG. 6 is a cross-sectional view of a cooling nozzle used for cutting a glass plate. Gas is blown to the upper surface 11 of the glass plate 10 by the cooling nozzle 28 shown in FIG. As shown in FIG. 6, the cooling nozzle 28 is formed with a tapered cavity so that gas (air, nitrogen, etc.) flows in the direction of the arrow.
  • the axis of the cooling nozzle 28 coincides with the optical axis of the laser beam 20, and the laser beam 20 collected by the lens 25 passes through the inside of the cooling nozzle 28 and is provided at the tip of the cooling nozzle 28.
  • the light is emitted from an opening having a diameter ⁇ n. Further, it can move in synchronization with the movement of the irradiation region of the laser beam 20 (that is, at the same scanning speed as the laser beam). With such a configuration, the laser irradiation unit is cooled by the gas. It is preferable to cool an area wider than the laser irradiation part. By this cooling, tensile stress is easily generated in the laser light irradiation region. That is, a scribe line is easily generated and stable processing is possible.
  • the cooling gas flow rate, the diameter ⁇ n of the opening of the cooling nozzle 28, and the gap G2 between the tip of the cooling nozzle 28 and the upper surface 11 of the glass plate 10 can be arbitrarily determined.
  • the cooling capability in the upper surface 11 of the glass plate 10 improves, so that the gap G2 between the front-end
  • FIG. 7 is a plan view of the glass plate 10 as viewed from the upper surface 11 side.
  • the glass plate 10 is divided into a main body portion 10 a on the positive side in the y-axis direction and a cut-out portion 10 b on the negative side in the y-axis direction by scanning the laser beam in the positive direction in the x-axis.
  • FIG. 8 is a side view of the glass plate 10 cut along the scribe line formed by the laser scanning shown in FIG. 7 as viewed from the end face 13 side (the negative side in the x-axis direction). Note that the xyz coordinates in FIGS. 7 and 8 coincide with those in FIG.
  • the laser beam is perpendicular to the end surface 13 (normal direction of the end surface 13) when viewed from the upper surface 11 side (z-axis direction plus side) in the normal direction of the upper surface 11 (or the lower surface 12). To scan). That is, the laser scanning direction coincided with the normal direction of the end face 13.
  • the laser beam is scanned while being shifted from the normal direction of the end face 13 when viewed from the normal direction of the upper surface 11.
  • the deviation angle between the normal line of the end surface 13 and the straight line (x axis) formed by the laser scanning direction is defined as ⁇ .
  • the shift angle ⁇ is positive when shifted counterclockwise with respect to the normal of the end face 13 and negative when shifted counterclockwise. That is, the absolute value of the deviation angle ⁇ is less than 90 °.
  • FIG. 7 shows a case where the value of the deviation angle ⁇ of the x-axis (straight line formed by the laser scanning direction) with respect to the normal of the end face 13 is positive, that is, 0 ° ⁇ ⁇ 90 °.
  • the value of the deviation angle ⁇ is not particularly limited, but can be set to 5 ° ⁇ ⁇ ⁇ 30 °, for example, 5 ° ⁇ ⁇ ⁇ 15 °, 5 ° ⁇ ⁇ ⁇ 10 °, 10 ° ⁇ You may set in the range of ⁇ ⁇ 30 °, 10 ° ⁇ ⁇ ⁇ 15 °, 15 ° ⁇ ⁇ ⁇ 30 °, and the like.
  • the scribe lines 31 and 32 are formed on the upper surface 11 and the lower surface 12 of the glass plate 10, and the chamfered portion 10c is formed on the cut end surface. can do.
  • the y-axis direction plus side The chamfered portion 10c can be formed on the glass plate.
  • the scribe lines 31 and 32 extend in the depth direction of the glass plate 10 in a tilted manner toward the minus side of the y-axis direction, not the z-axis direction (perpendicular to the main surface).
  • the scribe lines 31 and 32 inclined in the depth direction are chamfered portions 10c. That is, the method for cutting a glass plate according to the present embodiment can perform chamfering simultaneously with the introduction of the scribe line, and thus has higher productivity than the conventional method for cutting a glass plate.
  • FIGS. 9 and 10 show a case where the value of the deviation angle ⁇ of the x-axis (straight line constituting the laser scanning direction) with respect to the normal of the end face 13 is negative, that is, ⁇ 90 ° ⁇ ⁇ 0 °.
  • the value of the deviation angle ⁇ is not particularly limited. For example, it can be set to ⁇ 30 ° ⁇ ⁇ ⁇ 5 °, or ⁇ 30 ° ⁇ ⁇ ⁇ ⁇ 10 °, ⁇ 30 ° ⁇ ⁇ ⁇ ⁇ .
  • FIG. 9 is a plan view of the glass plate 10 as viewed from the upper surface 11 side.
  • the glass plate 10 is divided into a main body portion 10a on the negative side in the y-axis direction and a cut-out portion 10b on the positive side in the y-axis direction, by scanning with laser light in the positive direction in the x-axis direction as in FIG. Is done. That is, in FIG.
  • FIG. 10 is a side view of the glass plate 10 cut along the scribe lines 31 and 32 formed by the laser scanning shown in FIG. 9 when viewed from the end face 13 side (x-axis direction minus side).
  • the xyz coordinates in FIGS. 9 and 10 are the same as those in FIG.
  • the chamfered portion 10c is formed on the main body portion 10a on the negative side in the y-axis direction.
  • the protrusion 10d is formed in the cut portion 10b on the positive side in the y-axis direction.
  • the chamfered portion 10c can be formed on the glass plate on the negative side in the y-axis direction.
  • the scribe lines 31 and 32 extend in the depth direction of the glass plate 10 while being inclined toward the positive side in the y-axis direction instead of the z-axis direction (perpendicular to the main surface).
  • the scribe lines 31 and 32 inclined in the depth direction are chamfered portions 10c. That is, the method for cutting a glass plate according to the present embodiment can perform chamfering simultaneously with the introduction of the scribe line, and thus has higher productivity than the conventional method for cutting a glass plate.
  • FIGS. 11 and 12 are similar to FIGS. 9 and 10 in the case where the value of the deviation angle ⁇ of the x axis (straight line formed by the laser scanning direction) with respect to the normal of the end face 13 is negative, that is, ⁇ 90 ° ⁇ .
  • the case of ⁇ 0 ° is shown.
  • the value of the deviation angle ⁇ is not particularly limited.
  • FIG. 11 is a plan view of the glass plate 10 viewed from the upper surface 11 side. In the example of FIG.
  • FIG. 12 is a side view of the glass plate 10 cut along the scribe lines 31 and 32 formed by the laser scanning shown in FIG. 11 when viewed from the end face 13 side (x-axis direction minus side).
  • the xyz coordinate in FIG. 11, FIG. 12 corresponds with FIG.
  • the chamfered portion 10c is formed on the glass plate on the negative side in the y-axis direction.
  • a protrusion 10d is formed on the main body portion 10a on the plus side in the y-axis direction, and a chamfered portion 10c is formed on the cut-out portion 10b on the minus side in the y-axis direction.
  • the protruding portion 10d can be formed on the cut end surface of the main body portion 10a instead of the chamfered portion 10c.
  • the scribe lines 31 and 32 extend in the depth direction of the glass plate 10 while being inclined toward the positive side in the y-axis direction instead of the z-axis direction (perpendicular to the main surface).
  • the scribe lines 31 and 32 inclined in the depth direction become the protrusions 10d. That is, the glass plate cutting method according to the present embodiment can form a protrusion on the cut end face simultaneously with the introduction of the scribe line. Therefore, it is excellent in productivity of such an end surface-shaped glass plate.
  • the glass plate which has a projection part in an end surface in this way is useful for the use which fixes the said end surface to a resin material, for example. By having the protrusion, it is easy to fix to the resin material.
  • the laser beam is shifted from the normal direction of the end face 13 to scan, thereby simultaneously introducing the scribe lines 31 and 32 into the glass plate 10.
  • the chamfered portion 10 c can be formed on the cut end surface of the glass plate 10. Therefore, the cutting method of the glass plate which concerns on Embodiment 1 is excellent in productivity compared with the cutting method of the conventional glass plate. Specifically, by setting the deviation angle ⁇ of the x-axis (straight line formed by the laser scanning direction) with respect to the normal of the end face 13 to a positive value, of the two divided glass plates, the y-axis direction plus side The chamfered portion 10c can be formed on the glass plate.
  • the glass plate on the minus side in the y-axis direction is used.
  • a chamfered portion 10c can be formed.
  • Example 1 In Example 1, the deviation angle ⁇ of the x axis (straight line constituting the laser scanning direction) with respect to the normal of the end face 13 was changed in Test Examples 11 to 19, and the shape of the cut end face was investigated. The method of defining the deviation angle ⁇ is as described in the embodiment.
  • the beam shape of the laser light was circular on the upper and lower surfaces of the glass plate 10.
  • the laser beam was scanned from one long side of the glass plate 10 to the other long side in parallel with the short side of the glass plate 10.
  • the distance d from the short side of the glass plate 10 at the laser scanning position was 15 mm in all cases.
  • the initial crack was formed in the end surface 13 of the glass plate 10 so that it might reach the lower surface 12 from the upper surface 11 of the glass plate 10 using the wheel cutter.
  • scribe lines 31 and 32 were introduced into the upper and lower surfaces by laser light irradiation, and then cleaved by applying a bending force.
  • FIG. 13 is a plan view of the glass plate 10 schematically showing the test conditions of Test Examples 11 to 14 in which the deviation angle ⁇ of the x-axis (straight line constituting the laser scanning direction) with respect to the normal of the end face 13 is a positive value. It is.
  • the shift angle ⁇ 30 °
  • the shift angle ⁇ 15 °
  • the shift angle ⁇ 10 °
  • the shift angle ⁇ 5 °.
  • FIG. 14 shows the glass plate 10 schematically showing the test conditions of Test Examples 15 to 18 in which the deviation angle ⁇ of the x-axis (straight line constituting the laser scanning direction) with respect to the normal of the end face 13 is a negative value. It is a top view.
  • FIG. 15 is a photograph of the cut parts of Test Examples 11, 14, 15, and 18 observed from the minus side in the x-axis direction. Note that the xyz coordinates in FIG. 15 coincide with those in FIG.
  • Test Examples 15 to 18 in which the deviation angle ⁇ of the x-axis (straight line constituting the laser scanning direction) with respect to the normal of the end face 13 is a negative value, the y-axis direction of the two divided glass plates is used.
  • a chamfered portion 10c was formed on the negative glass plate, and a protrusion 10d was formed on the positive glass plate in the y-axis direction.
  • FIG. 15 representatively shows photographs of the cut portions of Test Examples 15 and 18. There was no significant difference in the size of the chamfered portion 10c due to the change in the shift angle ⁇ . In Test Example 19, it was not determined in which of the two divided glass plates the chamfered portion 10c was formed.
  • Example 1 the laser beam is scanned while being shifted from the normal direction of the end face 13, thereby introducing the scribe lines 31 and 32 into the glass plate 10 and simultaneously forming the chamfered portion 10 c on the cut end face of the glass plate 10. I was able to. Therefore, the cutting method of the glass plate which concerns on Example 1 is excellent in productivity compared with the cutting method of the conventional glass plate.
  • Example 2 Next, also in Example 2, in Test Examples 21 to 23, the deviation angle ⁇ of the x axis (straight line constituting the laser scanning direction) with respect to the normal line of the end face 13 was changed, and the shape of the cut end face was investigated.
  • the scribe lines 31 and 32 were introduced by laser light irradiation, and then manually cleaved.
  • the laser power absorbed by the glass plate is increased and a full cut is performed only by laser light irradiation.
  • the scribe lines 31 and 32 are formed on the upper and lower surfaces by laser light irradiation. And these two scribe lines 31 and 32 couple
  • the laser beam is perpendicular to the upper surface of a trapezoidal glass plate (long side 100 mm, short side 50 mm, plate thickness 3.1 mm, green colored transparent soda lime silica glass manufactured by Asahi Glass Co., Ltd.). It was made to enter.
  • a Yb fiber laser (wavelength: 1070 nm) was used as a laser light source.
  • the absorption coefficient ( ⁇ ) of the glass plate with respect to the laser beam was 2.86 cm ⁇ 1 , and ⁇ ⁇ M was 0.89 (that is, the internal transmittance was 41.2%).
  • the laser output was 50 W
  • the upper surface beam diameter of the laser light was 3.38 mm
  • the lower surface beam diameter was 2.17 mm
  • the scanning speed was 10 mm / s.
  • the deviation angle ⁇ was set to 10 °.
  • the deviation angle ⁇ ⁇ 10 °.
  • Example 1 the test results are described below assuming that the main surface of the glass plate 10 is parallel to the xy plane, the laser beam is irradiated in the z-axis minus direction, and scanned in the x-axis plus direction.
  • Test Example 21 in which the deviation angle ⁇ of the x-axis (straight line formed by the laser scanning direction) with respect to the normal of the end surface is a positive value, of the two divided glass plates, the y-axis direction A chamfered portion 10c was formed on the plus side glass plate, and a projection 10d was formed on the minus side glass plate in the y-axis direction.
  • Test Example 22 in which the deviation angle ⁇ of the x-axis (straight line formed by the laser scanning direction) with respect to the normal of the end surface is a negative value, of the two divided glass plates, the glass plate on the negative side in the y-axis direction The chamfered portion 10c was formed on the glass plate, and the protruding portion 10d was formed on the glass plate on the positive side in the y-axis direction. In Test Example 23, it was not determined which of the two divided glass plates was formed with the chamfered portion 10c.
  • the glass plate cutting method according to Example 2 is also more productive than the conventional glass plate cutting method.
  • Example 3 In Example 3, the shape of the cut end face was investigated by changing the laser output, the upper surface beam diameter, the lower surface beam diameter, and the scanning speed of Test Example 31 and Test Example 32.
  • the scribe lines 31 and 32 were introduced by laser light irradiation, and then manually cleaved.
  • a laser beam was vertically incident on the upper surface of a trapezoidal glass plate (long side 100 mm, short side 50 mm, plate thickness 2.8 mm, soda lime glass manufactured by Asahi Glass Co., Ltd.).
  • a Yb fiber laser (wavelength: 1070 nm) was used as a laser light source.
  • the absorption coefficient ( ⁇ ) of the glass plate with respect to the laser beam was 0.57 m ⁇ 1 , and ⁇ ⁇ M was 0.063 (that is, the internal transmittance was 94%).
  • the deviation angle ⁇ was 20 °.
  • the laser output was 390 W
  • the upper surface beam diameter of the laser light was 1.7 mm
  • the lower surface beam diameter was 1.78 mm
  • the scanning speed was 30 mm / s.
  • the laser output was 440 W
  • the upper surface beam diameter of the laser light was 0.4 mm
  • the lower surface beam diameter was 0.48 mm
  • the scanning speed was 70 mm / s.
  • FIG. 16 is a photograph of the cut part of Test Example 31 observed from the minus side in the x-axis direction.
  • FIG. 17 is a photograph of the cut part of Test Example 32 observed from the minus side in the x-axis direction. Note that the xyz coordinates in FIGS. 16 and 17 are the same as those in FIG.
  • connection angle C1 between the upper and lower surfaces and the end surface of Test Example 31 shown in FIG. It can be seen from Test Example 31 and Test Example 32 that the connection angle can be adjusted by the size of the laser beam diameter and the irradiation power on the upper and lower surfaces of the glass plate.
  • the glass plate 10 may be either a flat plate or a curved plate, and may be any one of a template glass with a concavo-convex pattern on the surface, a meshed glass containing a metal net or wire inside, a laminated glass, and a tempered glass. May be.
  • the end surface 13 may be curved. In that case, a deviation angle ⁇ in the laser scanning direction with respect to the normal direction of the end surface at the scribe start point (laser scanning start point) located on the end surface 13 may be considered.

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  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
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Abstract

La présente invention concerne un procédé de découpe de feuille de verre à productivité élevée. Un procédé de découpe de feuille de verre selon un mode de réalisation de la présente invention comprend une étape au cours de laquelle une lumière laser (20) est balayée tout en étant transmise depuis une première surface principale (11) vers une seconde surface principale (12) de la feuille de verre (10), ce qui entraîne la formation de lignes tracées (31, 32) sur la première surface principale (11) et la seconde surface principale (12) de la feuille de verre (10), le sens de balayage de la lumière laser (20), vu depuis la direction perpendiculaire à la première surface principale (11), étant déplacé à partir de la direction perpendiculaire à une surface d'extrémité (13) contenant le point de départ du balayage auquel démarre le balayage de la lumière laser (20) sur la feuille de verre (10).
PCT/JP2014/060424 2013-04-15 2014-04-10 Procédé de découpe de feuille de verre WO2014171396A1 (fr)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018020955A (ja) * 2016-08-05 2018-02-08 三星ダイヤモンド工業株式会社 プレクラッキング過程を含むガラス基板分断方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009011246A1 (fr) * 2007-07-13 2009-01-22 Mitsuboshi Diamond Industrial Co., Ltd. Procédé pour traiter un substrat en matériau cassant et appareil de formation de fissure utilisé dans le procédé
JP2010264471A (ja) * 2009-05-14 2010-11-25 Norio Karube 広領域非均一温度分布による脆性材料の熱応力割断
WO2012006736A2 (fr) * 2010-07-12 2012-01-19 Filaser Inc. Procédé de traitement de matériau par filamentation laser
JP2012209635A (ja) * 2011-03-29 2012-10-25 Seiko Instruments Inc 接合ガラスの切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計
JP2012527400A (ja) * 2009-05-21 2012-11-08 コーニング インコーポレイテッド 脆性材料シートの分割方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009011246A1 (fr) * 2007-07-13 2009-01-22 Mitsuboshi Diamond Industrial Co., Ltd. Procédé pour traiter un substrat en matériau cassant et appareil de formation de fissure utilisé dans le procédé
JP2010264471A (ja) * 2009-05-14 2010-11-25 Norio Karube 広領域非均一温度分布による脆性材料の熱応力割断
JP2012527400A (ja) * 2009-05-21 2012-11-08 コーニング インコーポレイテッド 脆性材料シートの分割方法
WO2012006736A2 (fr) * 2010-07-12 2012-01-19 Filaser Inc. Procédé de traitement de matériau par filamentation laser
JP2012209635A (ja) * 2011-03-29 2012-10-25 Seiko Instruments Inc 接合ガラスの切断方法、パッケージの製造方法、パッケージ、圧電振動子、発振器、電子機器及び電波時計

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018020955A (ja) * 2016-08-05 2018-02-08 三星ダイヤモンド工業株式会社 プレクラッキング過程を含むガラス基板分断方法

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