KR101390517B1 - 리소그라피 시스템 및 물품 제조 방법 - Google Patents

리소그라피 시스템 및 물품 제조 방법 Download PDF

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Publication number
KR101390517B1
KR101390517B1 KR1020120094125A KR20120094125A KR101390517B1 KR 101390517 B1 KR101390517 B1 KR 101390517B1 KR 1020120094125 A KR1020120094125 A KR 1020120094125A KR 20120094125 A KR20120094125 A KR 20120094125A KR 101390517 B1 KR101390517 B1 KR 101390517B1
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KR
South Korea
Prior art keywords
lithographic
apparatuses
lithographic apparatus
substrate
vibration
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KR1020120094125A
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English (en)
Korean (ko)
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KR20130026385A (ko
Inventor
후미아끼 미즈따니
유따까 와따나베
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/265—Selective reaction with inorganic or organometallic reagents after image-wise exposure, e.g. silylation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7038—Alignment for proximity or contact printer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7096—Arrangement, mounting, housing, environment, cleaning or maintenance of apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020120094125A 2011-09-05 2012-08-28 리소그라피 시스템 및 물품 제조 방법 Active KR101390517B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011193277A JP5913872B2 (ja) 2011-09-05 2011-09-05 リソグラフィシステム及び物品の製造方法
JPJP-P-2011-193277 2011-09-05

Publications (2)

Publication Number Publication Date
KR20130026385A KR20130026385A (ko) 2013-03-13
KR101390517B1 true KR101390517B1 (ko) 2014-04-30

Family

ID=47752935

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120094125A Active KR101390517B1 (ko) 2011-09-05 2012-08-28 리소그라피 시스템 및 물품 제조 방법

Country Status (3)

Country Link
US (1) US9329505B2 (https=)
JP (1) JP5913872B2 (https=)
KR (1) KR101390517B1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6864447B2 (ja) * 2016-09-06 2021-04-28 キヤノン株式会社 リソグラフィ装置、および物品の製造方法
JP7458161B2 (ja) * 2019-09-24 2024-03-29 東京エレクトロン株式会社 検査装置の制御方法および検査装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001126977A (ja) * 1999-10-27 2001-05-11 Nikon Corp ステージ装置および露光装置ならびに回路デバイス製造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0419361A (ja) 1990-05-11 1992-01-23 Hitachi Ltd 内燃機関用点火コイル一体形配電器
DE69322983T2 (de) * 1992-02-21 1999-07-15 Canon K.K., Tokio/Tokyo System zum Steuern von Trägerplatten
JP3202308B2 (ja) 1992-02-21 2001-08-27 キヤノン株式会社 複合位置決め装置
JPH0888167A (ja) * 1994-09-20 1996-04-02 Canon Inc 可動体の位置決め制御装置及び定盤の姿勢制御装置及びそれらを使用した半導体露光装置
JPH08293459A (ja) * 1995-04-21 1996-11-05 Nikon Corp ステージ駆動制御方法及びその装置
JP2000120766A (ja) * 1998-10-13 2000-04-25 Canon Inc ハイブリッド式能動振動絶縁装置
JP2001146812A (ja) * 1999-11-19 2001-05-29 Canon Inc クリーンルーム用床パネルおよびデバイス製造方法
JP2002286083A (ja) * 2001-03-27 2002-10-03 Canon Inc 除振装置、デバイス製造装置、デバイス製造方法、半導体製造工場およびデバイス製造装置の保守方法
JP2003255550A (ja) * 2002-02-28 2003-09-10 Konica Corp 描画方法、その方法を実行するためのプログラム、プログラムを記録した記録媒体、基材の製造方法、描画システム、製造装置の除振システム、及び電子ビーム描画装置
US7327437B2 (en) 2004-12-07 2008-02-05 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006261605A (ja) * 2005-03-18 2006-09-28 Canon Inc 露光装置及び露光方法
DE502006008851D1 (de) 2006-11-08 2011-03-17 Integrated Dynamics Eng Gmbh Kombiniertes Motion-Control-System
NL1036167A1 (nl) * 2007-11-20 2009-05-25 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
JP2011187584A (ja) 2010-03-05 2011-09-22 Yokohama National Univ 位置決め装置の設計方法、位置決め装置の製造方法、位置決め装置、及び露光装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001126977A (ja) * 1999-10-27 2001-05-11 Nikon Corp ステージ装置および露光装置ならびに回路デバイス製造方法

Also Published As

Publication number Publication date
KR20130026385A (ko) 2013-03-13
JP2013055256A (ja) 2013-03-21
JP5913872B2 (ja) 2016-04-27
US9329505B2 (en) 2016-05-03
US20130057839A1 (en) 2013-03-07

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