KR101388328B1 - 통합 ｔｈｔ 히트 스프레더 핀을 구비한 리드 프레임 기반 오버-몰딩 반도체 패키지와 그 제조 방법 - Google Patents

통합 ｔｈｔ 히트 스프레더 핀을 구비한 리드 프레임 기반 오버-몰딩 반도체 패키지와 그 제조 방법 Download PDF

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Publication number
KR101388328B1
KR101388328B1 KR1020087024213A KR20087024213A KR101388328B1 KR 101388328 B1 KR101388328 B1 KR 101388328B1 KR 1020087024213 A KR1020087024213 A KR 1020087024213A KR 20087024213 A KR20087024213 A KR 20087024213A KR 101388328 B1 KR101388328 B1 KR 101388328B1
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South Korea
Prior art keywords
heat spreader
tht
pad
lead frame
delete delete
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KR1020087024213A
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Korean (ko)
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KR20090004908A (ko
Inventor
로버트 바우어
안톤 콜벡
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프리스케일 세미컨덕터, 인크.
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020087024213A 2006-04-06 2007-03-12 통합 ｔｈｔ 히트 스프레더 핀을 구비한 리드 프레임 기반 오버-몰딩 반도체 패키지와 그 제조 방법 Active KR101388328B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/398,944 US7772036B2 (en) 2006-04-06 2006-04-06 Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing
US11/398,944 2006-04-06
PCT/US2007/063777 WO2007117819A2 (en) 2006-04-06 2007-03-12 Molded semiconductor package with integrated through hole heat spreader pin(s)

Publications (2)

Publication Number Publication Date
KR20090004908A KR20090004908A (ko) 2009-01-12
KR101388328B1 true KR101388328B1 (ko) 2014-04-22

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KR1020087024213A Active KR101388328B1 (ko) 2006-04-06 2007-03-12 통합 ｔｈｔ 히트 스프레더 핀을 구비한 리드 프레임 기반 오버-몰딩 반도체 패키지와 그 제조 방법

Country Status (6)

Country Link
US (2) US7772036B2 (https=)
EP (1) EP2005470B1 (https=)
JP (2) JP2009532912A (https=)
KR (1) KR101388328B1 (https=)
CN (1) CN101416305B (https=)
WO (1) WO2007117819A2 (https=)

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US8737073B2 (en) * 2011-02-09 2014-05-27 Tsmc Solid State Lighting Ltd. Systems and methods providing thermal spreading for an LED module
US8966747B2 (en) 2011-05-11 2015-03-03 Vlt, Inc. Method of forming an electrical contact
CN104900623B (zh) 2014-03-06 2018-11-30 恩智浦美国有限公司 露出管芯的功率半导体装置
CN103824821B (zh) * 2014-03-11 2016-04-06 湖南进芯电子科技有限公司 一种塑料密闭封装的开关电源模块及其制备方法
US9967984B1 (en) 2015-01-14 2018-05-08 Vlt, Inc. Power adapter packaging
DE102015200868A1 (de) * 2015-01-20 2016-07-21 Zf Friedrichshafen Ag Steuerelektronik
US10264664B1 (en) 2015-06-04 2019-04-16 Vlt, Inc. Method of electrically interconnecting circuit assemblies
US10785871B1 (en) 2018-12-12 2020-09-22 Vlt, Inc. Panel molded electronic assemblies with integral terminals
US11336167B1 (en) 2016-04-05 2022-05-17 Vicor Corporation Delivering power to semiconductor loads
US9892999B2 (en) 2016-06-07 2018-02-13 Globalfoundries Inc. Producing wafer level packaging using leadframe strip and related device
US9953904B1 (en) * 2016-10-25 2018-04-24 Nxp Usa, Inc. Electronic component package with heatsink and multiple electronic components
WO2018092185A1 (ja) * 2016-11-15 2018-05-24 三菱電機株式会社 半導体モジュール及び半導体装置
CN107889425A (zh) * 2017-10-30 2018-04-06 惠州市德赛西威汽车电子股份有限公司 一种连接器散热结构
CN110120292B (zh) 2018-02-05 2022-04-01 台达电子企业管理（上海）有限公司 磁性元件的散热结构及具有该散热结构的磁性元件
US11398417B2 (en) 2018-10-30 2022-07-26 Stmicroelectronics, Inc. Semiconductor package having die pad with cooling fins
US11515244B2 (en) * 2019-02-21 2022-11-29 Infineon Technologies Ag Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture
US10964628B2 (en) 2019-02-21 2021-03-30 Infineon Technologies Ag Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture
KR102227212B1 (ko) * 2019-06-24 2021-03-12 안상정 반도체 발광소자용 지지 기판을 제조하는 방법
DE102019211109A1 (de) * 2019-07-25 2021-01-28 Siemens Aktiengesellschaft Verfahren und Entwärmungskörper-Anordnung zur Entwärmung von Halbleiterchips mit integrierten elektronischen Schaltungen für leistungselektronische Anwendungen

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Also Published As

Publication number Publication date
US8659146B2 (en) 2014-02-25
KR20090004908A (ko) 2009-01-12
US7772036B2 (en) 2010-08-10
WO2007117819A3 (en) 2008-01-17
WO2007117819A2 (en) 2007-10-18
EP2005470B1 (en) 2019-12-18
CN101416305A (zh) 2009-04-22
EP2005470A4 (en) 2010-12-22
EP2005470A2 (en) 2008-12-24
JP2009532912A (ja) 2009-09-10
US20070238205A1 (en) 2007-10-11
CN101416305B (zh) 2010-09-29
US20100237479A1 (en) 2010-09-23
JP2014013908A (ja) 2014-01-23

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