KR101385443B1 - 반도체 칩 픽업 이송용 콜렛 - Google Patents

반도체 칩 픽업 이송용 콜렛 Download PDF

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Publication number
KR101385443B1
KR101385443B1 KR1020130110227A KR20130110227A KR101385443B1 KR 101385443 B1 KR101385443 B1 KR 101385443B1 KR 1020130110227 A KR1020130110227 A KR 1020130110227A KR 20130110227 A KR20130110227 A KR 20130110227A KR 101385443 B1 KR101385443 B1 KR 101385443B1
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KR
South Korea
Prior art keywords
plate
semiconductor chip
collet
vacuum
adsorption
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KR1020130110227A
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English (en)
Korean (ko)
Inventor
이향이
Original Assignee
이향이
주식회사 페코텍
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Publication date
Application filed by 이향이, 주식회사 페코텍 filed Critical 이향이
Priority to KR1020130110227A priority Critical patent/KR101385443B1/ko
Application granted granted Critical
Publication of KR101385443B1 publication Critical patent/KR101385443B1/ko
Priority to CN201410415237.6A priority patent/CN104465482B/zh
Priority to TW103128890A priority patent/TWI534944B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020130110227A 2013-09-13 2013-09-13 반도체 칩 픽업 이송용 콜렛 KR101385443B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020130110227A KR101385443B1 (ko) 2013-09-13 2013-09-13 반도체 칩 픽업 이송용 콜렛
CN201410415237.6A CN104465482B (zh) 2013-09-13 2014-08-21 用于拾起并且传递半导体芯片的夹头
TW103128890A TWI534944B (zh) 2013-09-13 2014-08-22 用於拾起並且傳遞半導體晶片的夾頭

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130110227A KR101385443B1 (ko) 2013-09-13 2013-09-13 반도체 칩 픽업 이송용 콜렛

Publications (1)

Publication Number Publication Date
KR101385443B1 true KR101385443B1 (ko) 2014-04-16

Family

ID=50657724

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130110227A KR101385443B1 (ko) 2013-09-13 2013-09-13 반도체 칩 픽업 이송용 콜렛

Country Status (3)

Country Link
KR (1) KR101385443B1 (zh)
CN (1) CN104465482B (zh)
TW (1) TWI534944B (zh)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101555667B1 (ko) * 2015-04-02 2015-10-06 전영욱 Led 칩 픽업용 콜렛
KR101577958B1 (ko) * 2015-03-31 2015-12-28 주식회사 케이앤에스 칩 이송용 콜렛 및 그 콜렛의 제조방법
KR101687021B1 (ko) * 2015-06-26 2016-12-22 주식회사 네오세미텍 다이 흡착 장치
KR101788564B1 (ko) * 2016-12-12 2017-10-20 임일환 반도체 칩 이송 장치 및 반도체 칩 이송 장치의 하부 어셈블리 제조 방법
EP3261424A4 (en) * 2015-02-17 2018-01-10 Fuji Machine Mfg. Co., Ltd. Suction attachment nozzle
KR101838444B1 (ko) * 2017-08-18 2018-03-13 이재성 가공식품이 포장된 포장용기 이송용 진공 흡착형 그리퍼
EP3456491A4 (en) * 2016-05-13 2020-01-22 BOE Technology Group Co., Ltd. MANIPULATOR ARM, MANIPULATOR AND BEARING DEVICE
KR20210001032A (ko) 2019-06-26 2021-01-06 한철희 반도체 칩 픽업 장치
KR102219128B1 (ko) * 2019-09-04 2021-02-24 한국기계연구원 전사필름, 전사필름을 이용한 전사방법 및 이를 이용하여 제조되는 전자제품
KR20210032893A (ko) * 2019-09-17 2021-03-25 파스포드 테크놀로지 주식회사 다이 본딩 장치, 박리 유닛, 콜릿 및 반도체 장치의 제조 방법
KR20210095348A (ko) * 2020-01-23 2021-08-02 주식회사 오킨스전자 라운드 형상의 접촉면을 구비한 마그네틱 콜렛
US11127609B2 (en) 2019-06-24 2021-09-21 Samsung Electronics Co., Ltd. Collet apparatus and method for fabricating a semiconductor device using the same
KR20220043696A (ko) * 2020-09-29 2022-04-05 (주)마이크로컨텍솔루션 반도체 칩 픽업용 콜렛
US20220115256A1 (en) * 2020-10-08 2022-04-14 SK Hynix Inc. Collet structure and semiconductor fabricating apparatus including the same
KR20220050382A (ko) * 2020-10-16 2022-04-25 이동환 반도체 칩 픽업 장치 및 반도체 칩 픽업 장치의 하부 픽업부 제조 방법
TWI803812B (zh) * 2020-01-23 2023-06-01 韓商奧金斯電子有限公司 磁性夾頭
WO2024005622A1 (ko) * 2022-07-01 2024-01-04 주식회사 엘지에너지솔루션 단위 셀 운반 시스템

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JP6889614B2 (ja) * 2017-05-31 2021-06-18 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
JP7145096B2 (ja) * 2019-02-12 2022-09-30 信越化学工業株式会社 微小構造体移載装置、スタンプヘッドユニット、微小構造体移載用スタンプ部品及び微小構造体集積部品の移載方法
CN110197813B (zh) * 2019-04-18 2021-11-05 广州市加简派电子科技有限公司 一种具有吸嘴更换功能的除尘型芯片拾取设备
US11993066B2 (en) * 2021-03-31 2024-05-28 Taiwan Semiconductor Manufacturing Company, Ltd. Chuck, lamination process, and manufacturing method of semiconductor package using the same
KR102435062B1 (ko) * 2021-12-20 2022-08-22 주식회사 미코세라믹스 본딩 헤드 및 이를 포함하는 본딩 장치

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KR200414775Y1 (ko) 2006-02-10 2006-04-24 한양정밀 (주) 칩 이송장치
KR200425068Y1 (ko) * 2006-04-28 2006-09-01 한양정밀 (주) 칩 이송장치
KR20100006154A (ko) * 2009-12-15 2010-01-18 조원준 반도체 칩 이송용 콜렛 및 이를 포함하는 반도체 칩 이송장치
JP2010129588A (ja) 2008-11-25 2010-06-10 Renesas Technology Corp 半導体集積回路装置の製造方法

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CN2470953Y (zh) * 2001-03-29 2002-01-09 中国科学院微电子中心 硅片抛光机头吸盘
JP3892703B2 (ja) * 2001-10-19 2007-03-14 富士通株式会社 半導体基板用治具及びこれを用いた半導体装置の製造方法
CN201060863Y (zh) * 2007-06-29 2008-05-14 上海蓝光科技有限公司 用于半导体制造中的真空吸嘴装置
KR101773779B1 (ko) * 2011-04-26 2017-09-12 주식회사 탑 엔지니어링 진공흡착장치
CN103000748B (zh) * 2011-09-08 2015-04-15 昊诚光电（太仓）有限公司 一种用于取放太阳能电池片的真空吸笔
CN103035553A (zh) * 2011-09-30 2013-04-10 深圳光启高等理工研究院 一种用于晶圆制造的传送手臂
CN202888144U (zh) * 2012-02-29 2013-04-17 矽菱企业股份有限公司 芯片吸放装置及其固定座与吸嘴

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Publication number Priority date Publication date Assignee Title
KR200414775Y1 (ko) 2006-02-10 2006-04-24 한양정밀 (주) 칩 이송장치
KR200425068Y1 (ko) * 2006-04-28 2006-09-01 한양정밀 (주) 칩 이송장치
JP2010129588A (ja) 2008-11-25 2010-06-10 Renesas Technology Corp 半導体集積回路装置の製造方法
KR20100006154A (ko) * 2009-12-15 2010-01-18 조원준 반도체 칩 이송용 콜렛 및 이를 포함하는 반도체 칩 이송장치

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3261424A4 (en) * 2015-02-17 2018-01-10 Fuji Machine Mfg. Co., Ltd. Suction attachment nozzle
US10398070B2 (en) 2015-02-17 2019-08-27 Fuji Corporation Suction nozzle
KR101577958B1 (ko) * 2015-03-31 2015-12-28 주식회사 케이앤에스 칩 이송용 콜렛 및 그 콜렛의 제조방법
KR101555667B1 (ko) * 2015-04-02 2015-10-06 전영욱 Led 칩 픽업용 콜렛
KR101687021B1 (ko) * 2015-06-26 2016-12-22 주식회사 네오세미텍 다이 흡착 장치
EP3456491A4 (en) * 2016-05-13 2020-01-22 BOE Technology Group Co., Ltd. MANIPULATOR ARM, MANIPULATOR AND BEARING DEVICE
US10882192B2 (en) 2016-05-13 2021-01-05 Boe Technology Group Co., Ltd. Manipulator arm, manipulator and carrying device
KR101788564B1 (ko) * 2016-12-12 2017-10-20 임일환 반도체 칩 이송 장치 및 반도체 칩 이송 장치의 하부 어셈블리 제조 방법
KR101838444B1 (ko) * 2017-08-18 2018-03-13 이재성 가공식품이 포장된 포장용기 이송용 진공 흡착형 그리퍼
US11127609B2 (en) 2019-06-24 2021-09-21 Samsung Electronics Co., Ltd. Collet apparatus and method for fabricating a semiconductor device using the same
KR20210001032A (ko) 2019-06-26 2021-01-06 한철희 반도체 칩 픽업 장치
KR102219128B1 (ko) * 2019-09-04 2021-02-24 한국기계연구원 전사필름, 전사필름을 이용한 전사방법 및 이를 이용하여 제조되는 전자제품
WO2021045543A1 (ko) * 2019-09-04 2021-03-11 한국기계연구원 전사필름, 전사필름을 이용한 전사방법 및 이를 이용하여 제조되는 전자제품
KR20210032893A (ko) * 2019-09-17 2021-03-25 파스포드 테크놀로지 주식회사 다이 본딩 장치, 박리 유닛, 콜릿 및 반도체 장치의 제조 방법
KR102430326B1 (ko) 2019-09-17 2022-08-08 파스포드 테크놀로지 주식회사 다이 본딩 장치, 박리 유닛, 콜릿 및 반도체 장치의 제조 방법
KR20210095348A (ko) * 2020-01-23 2021-08-02 주식회사 오킨스전자 라운드 형상의 접촉면을 구비한 마그네틱 콜렛
KR102382855B1 (ko) * 2020-01-23 2022-04-05 주식회사 오킨스전자 라운드 형상의 접촉면을 구비한 마그네틱 콜렛
TWI803812B (zh) * 2020-01-23 2023-06-01 韓商奧金斯電子有限公司 磁性夾頭
KR20220043696A (ko) * 2020-09-29 2022-04-05 (주)마이크로컨텍솔루션 반도체 칩 픽업용 콜렛
KR102469766B1 (ko) 2020-09-29 2022-11-23 (주)마이크로컨텍솔루션 반도체 칩 픽업용 콜렛
US20220115256A1 (en) * 2020-10-08 2022-04-14 SK Hynix Inc. Collet structure and semiconductor fabricating apparatus including the same
KR20220050382A (ko) * 2020-10-16 2022-04-25 이동환 반도체 칩 픽업 장치 및 반도체 칩 픽업 장치의 하부 픽업부 제조 방법
KR102482139B1 (ko) 2020-10-16 2022-12-29 케이탑아이앤씨 주식회사 반도체 칩 픽업 장치 및 반도체 칩 픽업 장치의 하부 픽업부 제조 방법
WO2024005622A1 (ko) * 2022-07-01 2024-01-04 주식회사 엘지에너지솔루션 단위 셀 운반 시스템

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