KR101385077B1 - 에폭시 조성물용 잠재성 하드너 - Google Patents

에폭시 조성물용 잠재성 하드너 Download PDF

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Publication number
KR101385077B1
KR101385077B1 KR1020127000780A KR20127000780A KR101385077B1 KR 101385077 B1 KR101385077 B1 KR 101385077B1 KR 1020127000780 A KR1020127000780 A KR 1020127000780A KR 20127000780 A KR20127000780 A KR 20127000780A KR 101385077 B1 KR101385077 B1 KR 101385077B1
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South Korea
Prior art keywords
epoxy
particles
compound
adduct
ctbn
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Expired - Fee Related
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KR1020127000780A
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English (en)
Korean (ko)
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KR20120046158A (ko
Inventor
위룽 잉
존 제이. 맥나마라
징 량
룽-창 량
Original Assignee
트릴리온 사이언스 인코포레이티드
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Priority claimed from US12/497,040 external-priority patent/US8044154B2/en
Priority claimed from US12/762,892 external-priority patent/US8067484B2/en
Application filed by 트릴리온 사이언스 인코포레이티드 filed Critical 트릴리온 사이언스 인코포레이티드
Priority claimed from PCT/US2010/035905 external-priority patent/WO2010144236A1/en
Publication of KR20120046158A publication Critical patent/KR20120046158A/ko
Application granted granted Critical
Publication of KR101385077B1 publication Critical patent/KR101385077B1/ko
Assigned to 폴라로이드 비.브이. reassignment 폴라로이드 비.브이. 권리의 전부이전등록 Assignors: 트릴리온 사이언스 인코포레이티드
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/241—Preventing premature crosslinking by physical separation of components, e.g. encapsulation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Analytical Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Sealing Material Composition (AREA)
  • Adhesive Tapes (AREA)
KR1020127000780A 2009-06-12 2010-05-24 에폭시 조성물용 잠재성 하드너 Expired - Fee Related KR101385077B1 (ko)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US18654709P 2009-06-12 2009-06-12
US61/186,547 2009-06-12
US12/497,040 US8044154B2 (en) 2009-06-12 2009-07-02 Latent hardener for epoxy compositions
US12/497,040 2009-07-02
US31319910P 2010-03-12 2010-03-12
US61/313,199 2010-03-12
US12/762,892 2010-04-19
US12/762,892 US8067484B2 (en) 2010-03-12 2010-04-19 Latent hardener with improved barrier properties and compatibility
PCT/US2010/035905 WO2010144236A1 (en) 2009-06-12 2010-05-24 Latent hardener for epoxy compositions

Publications (2)

Publication Number Publication Date
KR20120046158A KR20120046158A (ko) 2012-05-09
KR101385077B1 true KR101385077B1 (ko) 2014-04-24

Family

ID=45045033

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127000780A Expired - Fee Related KR101385077B1 (ko) 2009-06-12 2010-05-24 에폭시 조성물용 잠재성 하드너

Country Status (4)

Country Link
JP (1) JP2012529555A (https=)
KR (1) KR101385077B1 (https=)
CN (1) CN102459394B (https=)
TW (1) TWI425023B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019078044A1 (ja) * 2017-10-18 2019-04-25 株式会社スリーボンド 熱伝導性樹脂組成物、硬化物および放熱方法
TWI715978B (zh) * 2019-05-15 2021-01-11 洽興營造有限公司 環保全聚脲核廢料桶
EP3998299A4 (en) 2019-07-12 2023-07-26 Samyang Corporation Anhydrous alcohol-alkylene glycol composition, anhydrous alcohol-based urethane-modified polyol composition, and uses of same for expoxy resin composition
CN117362590B (zh) * 2023-11-01 2024-05-07 湖北泊瑞高分子材料有限公司 一种超支化、柔性水性环氧树脂固化剂及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070095475A1 (en) * 2005-11-01 2007-05-03 L&L Products, Inc. Adhesive material and method of using same
US20080251757A1 (en) * 2005-02-23 2008-10-16 Hisanao Yamamoto Latent Hardener For Epoxy Resin and Epoxy Resin Composition

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5649780A (en) * 1979-09-29 1981-05-06 Nitto Electric Ind Co Ltd Resin molded bondable article
JPS62273224A (ja) * 1986-05-21 1987-11-27 Asahi Denka Kogyo Kk エポキシ樹脂硬化性組成物
DE19845607A1 (de) * 1998-10-06 2000-04-20 Henkel Teroson Gmbh Schlagfeste Epoxidharz-Zusammensetzungen
US20070270515A1 (en) * 2006-05-19 2007-11-22 Zephyros, Inc. Toughened polymeric material and method of forming and using same
JP5430059B2 (ja) * 2007-11-08 2014-02-26 株式会社Ａｄｅｋａ 粉末状エポキシ樹脂用潜在性硬化剤の製造方法、その方法によって得られた粉末状エポキシ樹脂用潜在性硬化剤、及びそれを用いた硬化性エポキシ樹脂用組成物
JP2008115400A (ja) * 2007-12-10 2008-05-22 Hitachi Chem Co Ltd 回路部材接続用接着剤
JP4492692B2 (ja) * 2007-12-17 2010-06-30 日立化成工業株式会社 回路部材接続用接着フィルム
JP2010150362A (ja) * 2008-12-25 2010-07-08 Sumitomo Electric Ind Ltd フィルム状接着剤及び異方導電性接着剤

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080251757A1 (en) * 2005-02-23 2008-10-16 Hisanao Yamamoto Latent Hardener For Epoxy Resin and Epoxy Resin Composition
US20070095475A1 (en) * 2005-11-01 2007-05-03 L&L Products, Inc. Adhesive material and method of using same

Also Published As

Publication number Publication date
TWI425023B (zh) 2014-02-01
TW201120085A (en) 2011-06-16
CN102459394A (zh) 2012-05-16
CN102459394B (zh) 2015-01-21
KR20120046158A (ko) 2012-05-09
JP2012529555A (ja) 2012-11-22

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