KR101371863B1 - 도전성 페이스트 및 도전 패턴 - Google Patents

도전성 페이스트 및 도전 패턴 Download PDF

Info

Publication number
KR101371863B1
KR101371863B1 KR1020120031500A KR20120031500A KR101371863B1 KR 101371863 B1 KR101371863 B1 KR 101371863B1 KR 1020120031500 A KR1020120031500 A KR 1020120031500A KR 20120031500 A KR20120031500 A KR 20120031500A KR 101371863 B1 KR101371863 B1 KR 101371863B1
Authority
KR
South Korea
Prior art keywords
resin
conductive paste
silver powder
pattern
electrically conductive
Prior art date
Application number
KR1020120031500A
Other languages
English (en)
Korean (ko)
Other versions
KR20120112122A (ko
Inventor
마사끼 사사끼
Original Assignee
다이요 홀딩스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=46993075&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR101371863(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 다이요 홀딩스 가부시키가이샤 filed Critical 다이요 홀딩스 가부시키가이샤
Publication of KR20120112122A publication Critical patent/KR20120112122A/ko
Application granted granted Critical
Publication of KR101371863B1 publication Critical patent/KR101371863B1/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
    • H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Conductive Materials (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Manufacturing Of Electric Cables (AREA)
KR1020120031500A 2011-03-31 2012-03-28 도전성 페이스트 및 도전 패턴 KR101371863B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011078846 2011-03-31
JPJP-P-2011-078846 2011-03-31

Publications (2)

Publication Number Publication Date
KR20120112122A KR20120112122A (ko) 2012-10-11
KR101371863B1 true KR101371863B1 (ko) 2014-03-07

Family

ID=46993075

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120031500A KR101371863B1 (ko) 2011-03-31 2012-03-28 도전성 페이스트 및 도전 패턴

Country Status (4)

Country Link
JP (1) JP5899022B2 (ja)
KR (1) KR101371863B1 (ja)
CN (1) CN102737753B (ja)
TW (1) TWI532059B (ja)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI489342B (zh) * 2012-12-26 2015-06-21 Ind Tech Res Inst 凹版轉印組合物及凹版轉印製程
WO2014119463A1 (ja) * 2013-01-30 2014-08-07 Dic株式会社 導電性ペースト、導電性パターンの形成方法及び導電性パターン印刷物
CN103192070B (zh) * 2013-04-17 2015-07-08 苏州格林泰克科技有限公司 一种银/氯化银电极材料及其制备方法和电极
JP5949654B2 (ja) * 2013-05-14 2016-07-13 住友金属鉱山株式会社 銀粉およびその製造方法
JP6303367B2 (ja) * 2013-09-30 2018-04-04 東洋紡株式会社 導電性ペースト、導電性膜及びタッチパネル
CN104036844A (zh) * 2014-02-28 2014-09-10 深圳市银和新材料科技有限公司 环保型水溶性的太阳能电池正极银浆及其制备方法
US10672531B2 (en) * 2014-07-22 2020-06-02 Alpha Assembly Solutions Inc. Stretchable interconnects for flexible electronic surfaces
CN105405487A (zh) * 2014-08-29 2016-03-16 比亚迪股份有限公司 导电银浆及其制备方法、导电线路及其制备方法
CN104376894B (zh) * 2014-11-26 2017-04-05 江苏欧耐尔新型材料有限公司 太阳能电池导电正面银浆
CN104485153B (zh) * 2014-11-27 2017-02-08 江苏国瓷泓源光电科技有限公司 一种具有良好触变性的正银浆料及其制备方法
JP6368288B2 (ja) * 2015-08-07 2018-08-01 福田金属箔粉工業株式会社 フレーク状銀粒子の集合体及び該銀粒子の集合体を含有するペースト
CN105722254A (zh) * 2016-02-24 2016-06-29 东莞珂洛赫慕电子材料科技有限公司 一种柔性电热膜用光固化型电阻浆料及其制备方法
JP6600875B2 (ja) * 2016-03-08 2019-11-06 パレス化学株式会社 Ｒ−ｔ−ｂ系焼結磁石の製造方法
WO2018018136A1 (en) * 2016-07-28 2018-02-01 National Research Council Of Canada Copper ink and conductive solderable copper traces produced therefrom
JP7118582B2 (ja) * 2016-09-09 2022-08-16 東洋紡株式会社 展延性導電性組成物および三次元プリント配線板の製造方法
JP6734925B2 (ja) * 2016-09-16 2020-08-05 株式会社ノリタケカンパニーリミテド フレキシブル基板用銀ペースト
CN108682475A (zh) * 2018-03-22 2018-10-19 衢州顺络电子有限公司 导电浆料及导电干膜制备方法
CN112336636A (zh) * 2020-11-06 2021-02-09 深圳优芙尔生物科技有限公司 一种促进皮肤微循环的美容方法及其应用
CN112336648A (zh) * 2020-11-06 2021-02-09 深圳优芙尔生物科技有限公司 一种提升精华吸收率的微电流面膜及其制备方法
JP7185795B2 (ja) * 2021-03-10 2022-12-07 Ｄｏｗａエレクトロニクス株式会社 銀粉及びその製造方法
EP4306239A1 (en) * 2021-03-10 2024-01-17 DOWA Electronics Materials Co., Ltd. Silver powder and production method therefor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090009135A (ko) * 2007-07-18 2009-01-22 다이요 잉키 세이조 가부시키가이샤 도전성 페이스트, 및 상기 페이스트를 이용한 투광성 도전필름 및 그의 제조 방법
KR20090059297A (ko) * 2007-12-06 2009-06-11 제일모직주식회사 범프 형성용 페이스트 조성물

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4976642B2 (ja) * 2004-02-10 2012-07-18 三井金属鉱業株式会社 高結晶性銀粉及びその製造方法
JP2006002228A (ja) * 2004-06-18 2006-01-05 Dowa Mining Co Ltd 球状銀粉およびその製造方法
JP4934993B2 (ja) * 2005-05-25 2012-05-23 住友電気工業株式会社 導電性ペーストおよびそれを用いた配線基板
JP4943254B2 (ja) * 2007-07-18 2012-05-30 太陽ホールディングス株式会社 導電性ペースト組成物、および該組成物を用いた透光性導電フィルム並びにその製造方法
CN101752162B (zh) * 2008-11-27 2012-07-04 太阳控股株式会社 感光性导电糊剂及使用其形成的电极和等离子体显示板
KR20100085855A (ko) * 2009-01-20 2010-07-29 다이요 잉키 세이조 가부시키가이샤 도전성 페이스트 및 투광성 도전 필름과 그의 제조 방법
JP5526576B2 (ja) * 2009-03-31 2014-06-18 東洋インキＳｃホールディングス株式会社 導電性インキ
CN101986391A (zh) * 2010-12-10 2011-03-16 长沙族兴金属颜料有限公司 一种用于晶体硅太阳能电池片的正面银浆及其制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090009135A (ko) * 2007-07-18 2009-01-22 다이요 잉키 세이조 가부시키가이샤 도전성 페이스트, 및 상기 페이스트를 이용한 투광성 도전필름 및 그의 제조 방법
KR20090059297A (ko) * 2007-12-06 2009-06-11 제일모직주식회사 범프 형성용 페이스트 조성물

Also Published As

Publication number Publication date
CN102737753B (zh) 2016-07-06
CN102737753A (zh) 2012-10-17
JP2012216533A (ja) 2012-11-08
TWI532059B (zh) 2016-05-01
KR20120112122A (ko) 2012-10-11
JP5899022B2 (ja) 2016-04-06
TW201303894A (zh) 2013-01-16

Similar Documents

Publication Publication Date Title
KR101371863B1 (ko) 도전성 페이스트 및 도전 패턴
KR101392597B1 (ko) 도전성 페이스트
KR20130045326A (ko) 오프셋 인쇄용 도전성 페이스트
KR101118962B1 (ko) 도전성 잉크 및, 도전 패턴을 갖는 적층체와 그 제조 방법
KR102056658B1 (ko) 투명 도전 기판 및 그 제조 방법
TWI596172B (zh) Conductive liquid composition
JP5608501B2 (ja) 導電パターン形成用ペースト組成物、導電パターン及びその形成方法
KR101339618B1 (ko) 도전성 페이스트
TWI693160B (zh) 導電薄膜之製造方法及導電薄膜
JP6001265B2 (ja) 導電性ペースト
TW201833940A (zh) 導電性組成物
JP2016029638A (ja) レーザー加工用導電性ペースト
JP5995192B2 (ja) 導電性インク組成物
KR20130020367A (ko) 은 페이스트 조성물 및 이를 이용한 전극의 형성방법
KR101064846B1 (ko) 오프셋 인쇄용 페이스트 조성물 및 이를 이용한 평판표시장치
JP5899259B2 (ja) 導電性ペースト
US12094622B2 (en) Conductive resin composition, circuit board fabricated using conductive resin composition, and method of manufacturing circuit board
KR101049025B1 (ko) 도전성 페이스트, 및 상기 페이스트를 이용한 투광성 도전필름 및 그의 제조 방법
JP6705346B2 (ja) レーザー加工用導電性ペースト

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E90F Notification of reason for final refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20170217

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20180219

Year of fee payment: 5