KR101346048B1 - 기판 검사 장치 - Google Patents

기판 검사 장치 Download PDF

Info

Publication number
KR101346048B1
KR101346048B1 KR1020070025525A KR20070025525A KR101346048B1 KR 101346048 B1 KR101346048 B1 KR 101346048B1 KR 1020070025525 A KR1020070025525 A KR 1020070025525A KR 20070025525 A KR20070025525 A KR 20070025525A KR 101346048 B1 KR101346048 B1 KR 101346048B1
Authority
KR
South Korea
Prior art keywords
substrate
board
conveyance
inspection
conveying means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020070025525A
Other languages
English (en)
Korean (ko)
Other versions
KR20070094506A (ko
Inventor
마사루 마쓰모토
노부오 후지사키
Original Assignee
올림푸스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 올림푸스 가부시키가이샤 filed Critical 올림푸스 가부시키가이샤
Publication of KR20070094506A publication Critical patent/KR20070094506A/ko
Application granted granted Critical
Publication of KR101346048B1 publication Critical patent/KR101346048B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020070025525A 2006-03-16 2007-03-15 기판 검사 장치 Expired - Fee Related KR101346048B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006072772A JP2007248291A (ja) 2006-03-16 2006-03-16 基板検査装置
JPJP-P-2006-00072772 2006-03-16

Publications (2)

Publication Number Publication Date
KR20070094506A KR20070094506A (ko) 2007-09-20
KR101346048B1 true KR101346048B1 (ko) 2013-12-31

Family

ID=38592757

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070025525A Expired - Fee Related KR101346048B1 (ko) 2006-03-16 2007-03-15 기판 검사 장치

Country Status (4)

Country Link
JP (1) JP2007248291A (enrdf_load_stackoverflow)
KR (1) KR101346048B1 (enrdf_load_stackoverflow)
CN (1) CN101038260B (enrdf_load_stackoverflow)
TW (1) TW200741197A (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009085865A (ja) * 2007-10-02 2009-04-23 Olympus Corp 基板検査装置
WO2009099142A1 (ja) * 2008-02-06 2009-08-13 Nikon Corporation 表面検査装置および表面検査方法
TWI381257B (zh) * 2008-07-07 2013-01-01 Race Ahead Technology Co Ltd 自動調整照明強度的基材檢測裝置及方法
CN101936916A (zh) * 2009-07-02 2011-01-05 法国圣-戈班玻璃公司 检测分离的低刚度的透明或半透明体的缺陷的设备和方法
KR101570169B1 (ko) 2014-05-09 2015-11-20 세메스 주식회사 광 배향막 형성 장치
TWI585395B (zh) * 2015-01-27 2017-06-01 政美應用股份有限公司 面板檢測裝置與方法
CN109860080A (zh) * 2018-12-28 2019-06-07 浙江中晶新能源有限公司 一种硅片的定位输送装置
CN111377143A (zh) * 2020-03-24 2020-07-07 杭州酿蜜科技有限公司 一种用于超薄玻璃针对运输的包装设备
CN112192301B (zh) * 2020-10-16 2025-07-04 江苏立导科技有限公司 角度纠偏装置
CN112595722B (zh) * 2021-03-02 2021-06-08 苏州天准科技股份有限公司 一种分段式气浮平台、平台模组和检测设备
TWI870602B (zh) * 2021-06-24 2025-01-21 由田新技股份有限公司 氣浮式輸送平台及其檢測系統
KR102729416B1 (ko) * 2021-12-17 2024-11-13 세메스 주식회사 기판 처리 장치 및 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004345744A (ja) 2003-05-20 2004-12-09 Hitachi Zosen Corp 空気浮上装置および空気浮上式搬送装置
JP2005528586A (ja) * 2001-12-27 2005-09-22 オーボテック リミテッド 浮揚物品搬送システム及び搬送方法
KR20090015792A (ko) * 2007-08-09 2009-02-12 후지쯔 가부시끼가이샤 연마 장치, 기판 및 전자기기의 제조 방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE756333A (fr) * 1969-09-19 1971-03-18 Pilkington Brothers Ltd Perfectionnements relatifs au transport de feuilles de verre
KR100582344B1 (ko) * 2003-12-09 2006-05-22 삼성코닝정밀유리 주식회사 유리기판의 검사장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005528586A (ja) * 2001-12-27 2005-09-22 オーボテック リミテッド 浮揚物品搬送システム及び搬送方法
JP2004345744A (ja) 2003-05-20 2004-12-09 Hitachi Zosen Corp 空気浮上装置および空気浮上式搬送装置
KR20090015792A (ko) * 2007-08-09 2009-02-12 후지쯔 가부시끼가이샤 연마 장치, 기판 및 전자기기의 제조 방법

Also Published As

Publication number Publication date
CN101038260B (zh) 2011-04-20
KR20070094506A (ko) 2007-09-20
TW200741197A (en) 2007-11-01
JP2007248291A (ja) 2007-09-27
CN101038260A (zh) 2007-09-19

Similar Documents

Publication Publication Date Title
KR101346048B1 (ko) 기판 검사 장치
TWI631649B (zh) 基板更換裝置、曝光裝置、基板更換方法、曝光方法、平面面板顯示器之製造方法、以及元件製造方法
JP4842422B2 (ja) シート材料の検査方法
CN100578301C (zh) 测试治具及应用该测试治具的点灯测试机台
JP5344545B2 (ja) 基板保持装置
CN101144920B (zh) 基板检查装置
KR100835537B1 (ko) 유리기판의 에지 검사장치
JP5005945B2 (ja) 基板検査装置
CN211669102U (zh) 基板检查装置
JP2017198959A (ja) 処理装置
JP4951271B2 (ja) 基板検査装置
KR200452846Y1 (ko) 인쇄회로기판 비전검사장치
JP2006329714A (ja) レンズ検査装置
KR20190079200A (ko) 마스크 검사용 조명 장치 및 이를 이용한 마스크 검사 장치
TWI391649B (zh) 面板缺陷之點燈測試機台及面板缺陷之點燈測試方法
KR20190079199A (ko) 마스크 지지 장치 및 이를 이용한 마스크 정렬 방법
CN117470866A (zh) 应用于光罩检查机的载台机构
JP5325406B2 (ja) 基板検査装置
JP5928771B2 (ja) 基板検査装置および基板検査方法
JP2012076876A (ja) 物体保持装置の清掃システム、物体保持装置の清掃装置、及び物体保持装置の清掃方法
CN100485369C (zh) 保持装置
JP2006066747A (ja) 基板の位置決め装置及び位置決め方法
JP2013062363A (ja) 基板搬送装置
CN216208527U (zh) 检测机构及检测设备
JP4477573B2 (ja) 基板検査装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20161224

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20161224