KR101335302B1 - 리프트 핀 구동장치 및 이를 구비한 평판표시소자 제조장치 - Google Patents

리프트 핀 구동장치 및 이를 구비한 평판표시소자 제조장치 Download PDF

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Publication number
KR101335302B1
KR101335302B1 KR1020060111227A KR20060111227A KR101335302B1 KR 101335302 B1 KR101335302 B1 KR 101335302B1 KR 1020060111227 A KR1020060111227 A KR 1020060111227A KR 20060111227 A KR20060111227 A KR 20060111227A KR 101335302 B1 KR101335302 B1 KR 101335302B1
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KR
South Korea
Prior art keywords
lift
pin
drive
lift pin
chamber
Prior art date
Application number
KR1020060111227A
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English (en)
Korean (ko)
Other versions
KR20080042583A (ko
Inventor
손형규
Original Assignee
엘아이지에이디피 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘아이지에이디피 주식회사 filed Critical 엘아이지에이디피 주식회사
Priority to KR1020060111227A priority Critical patent/KR101335302B1/ko
Priority to US11/874,272 priority patent/US7988817B2/en
Priority to CN2007101812302A priority patent/CN101178502B/zh
Priority to TW096140675A priority patent/TWI370505B/zh
Publication of KR20080042583A publication Critical patent/KR20080042583A/ko
Application granted granted Critical
Publication of KR101335302B1 publication Critical patent/KR101335302B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
KR1020060111227A 2006-11-10 2006-11-10 리프트 핀 구동장치 및 이를 구비한 평판표시소자 제조장치 KR101335302B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020060111227A KR101335302B1 (ko) 2006-11-10 2006-11-10 리프트 핀 구동장치 및 이를 구비한 평판표시소자 제조장치
US11/874,272 US7988817B2 (en) 2006-11-10 2007-10-18 Lift pin driving device and a flat panel display manufacturing apparatus having same
CN2007101812302A CN101178502B (zh) 2006-11-10 2007-10-25 升降销驱动装置以及具有该装置的平板显示器制造设备
TW096140675A TWI370505B (en) 2006-11-10 2007-10-30 Lift pin driving device and a flat panel display manufacturing apparatus having same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060111227A KR101335302B1 (ko) 2006-11-10 2006-11-10 리프트 핀 구동장치 및 이를 구비한 평판표시소자 제조장치

Publications (2)

Publication Number Publication Date
KR20080042583A KR20080042583A (ko) 2008-05-15
KR101335302B1 true KR101335302B1 (ko) 2013-12-03

Family

ID=39404812

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060111227A KR101335302B1 (ko) 2006-11-10 2006-11-10 리프트 핀 구동장치 및 이를 구비한 평판표시소자 제조장치

Country Status (2)

Country Link
KR (1) KR101335302B1 (zh)
CN (1) CN101178502B (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011035199A (ja) * 2009-08-03 2011-02-17 Tokyo Electron Ltd 基板載置機構およびそれを用いた基板処理装置
JP5907681B2 (ja) * 2011-08-02 2016-04-26 東京エレクトロン株式会社 基板受け渡し方法
KR101417942B1 (ko) * 2012-07-03 2014-07-11 피에스케이 주식회사 웨이퍼 로더 및 이를 갖는 기판 처리 장치
CN104140062A (zh) * 2013-05-06 2014-11-12 北京北方微电子基地设备工艺研究中心有限责任公司 一种片盒垂直升降装置
US9839106B2 (en) * 2014-07-23 2017-12-05 Moxtek, Inc. Flat-panel-display, bottom-side, electrostatic-dissipation
US10524341B2 (en) 2015-05-08 2019-12-31 Moxtek, Inc. Flowing-fluid X-ray induced ionic electrostatic dissipation
CN106601930A (zh) * 2016-12-16 2017-04-26 合肥鑫晟光电科技有限公司 一种压合设备及压合方法
DE102018007307A1 (de) 2018-09-17 2020-03-19 Vat Holding Ag Stifthubvorrichtung
WO2020190991A1 (en) * 2019-03-18 2020-09-24 Mrsi Systems Llc Die bonding system with heated automatic collet changer
CN115948720B (zh) * 2023-03-14 2023-06-02 上海陛通半导体能源科技股份有限公司 薄膜沉积设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02113547A (ja) * 1988-10-21 1990-04-25 Mitsubishi Electric Corp 突出し装置
JPH0623636A (ja) * 1992-05-12 1994-02-01 Takeshi Yanagisawa ２次元運動機構
JP2002198353A (ja) * 2000-12-26 2002-07-12 Matsushita Electric Ind Co Ltd プラズマ処理装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4788994A (en) * 1986-08-13 1988-12-06 Dainippon Screen Mfg. Co. Wafer holding mechanism
US5226056A (en) * 1989-01-10 1993-07-06 Nihon Shinku Gijutsu Kabushiki Kaisha Plasma ashing method and apparatus therefor
JP2002064132A (ja) * 2000-08-22 2002-02-28 Tokyo Electron Ltd 被処理体の受け渡し方法、被処理体の載置機構及びプローブ装置
TW569288B (en) * 2001-06-19 2004-01-01 Tokyo Electron Ltd Substrate processing apparatus, liquid processing apparatus and liquid processing method
US7018555B2 (en) * 2002-07-26 2006-03-28 Dainippon Screen Mfg. Co., Ltd. Substrate treatment method and substrate treatment apparatus
US6789585B1 (en) * 2003-07-09 2004-09-14 Whirlpool Corporation Refrigerator and automated liquid dispenser therefor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02113547A (ja) * 1988-10-21 1990-04-25 Mitsubishi Electric Corp 突出し装置
JPH0623636A (ja) * 1992-05-12 1994-02-01 Takeshi Yanagisawa ２次元運動機構
JP2002198353A (ja) * 2000-12-26 2002-07-12 Matsushita Electric Ind Co Ltd プラズマ処理装置

Also Published As

Publication number Publication date
CN101178502A (zh) 2008-05-14
CN101178502B (zh) 2010-07-14
KR20080042583A (ko) 2008-05-15

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