KR101324052B1 - 반사방지 코팅 재료 - Google Patents

반사방지 코팅 재료 Download PDF

Info

Publication number
KR101324052B1
KR101324052B1 KR1020087019774A KR20087019774A KR101324052B1 KR 101324052 B1 KR101324052 B1 KR 101324052B1 KR 1020087019774 A KR1020087019774 A KR 1020087019774A KR 20087019774 A KR20087019774 A KR 20087019774A KR 101324052 B1 KR101324052 B1 KR 101324052B1
Authority
KR
South Korea
Prior art keywords
value
antireflective coating
delete delete
electronic device
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020087019774A
Other languages
English (en)
Korean (ko)
Other versions
KR20080094686A (ko
Inventor
펭-페이 푸
에릭 스콧 모이어
Original Assignee
다우 코닝 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다우 코닝 코포레이션 filed Critical 다우 코닝 코포레이션
Publication of KR20080094686A publication Critical patent/KR20080094686A/ko
Application granted granted Critical
Publication of KR101324052B1 publication Critical patent/KR101324052B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/02Polysilicates
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0752Silicon-containing compounds in non photosensitive layers or as additives, e.g. for dry lithography
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/09Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31652Of asbestos
    • Y10T428/31663As siloxane, silicone or silane

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Structural Engineering (AREA)
  • Architecture (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Silicon Polymers (AREA)
  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Formation Of Insulating Films (AREA)
KR1020087019774A 2006-02-13 2006-12-07 반사방지 코팅 재료 Expired - Fee Related KR101324052B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US77261906P 2006-02-13 2006-02-13
US60/772,619 2006-02-13
PCT/US2006/046810 WO2007094848A2 (en) 2006-02-13 2006-12-07 Antireflective coating material

Publications (2)

Publication Number Publication Date
KR20080094686A KR20080094686A (ko) 2008-10-23
KR101324052B1 true KR101324052B1 (ko) 2013-11-01

Family

ID=38371944

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087019774A Expired - Fee Related KR101324052B1 (ko) 2006-02-13 2006-12-07 반사방지 코팅 재료

Country Status (7)

Country Link
US (1) US8263312B2 (https=)
EP (1) EP1989593A2 (https=)
JP (1) JP4881396B2 (https=)
KR (1) KR101324052B1 (https=)
CN (1) CN101371196B (https=)
TW (1) TWI406099B (https=)
WO (1) WO2007094848A2 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7756384B2 (en) * 2004-11-08 2010-07-13 Dow Corning Corporation Method for forming anti-reflective coating
US20070212886A1 (en) * 2006-03-13 2007-09-13 Dong Seon Uh Organosilane polymers, hardmask compositions including the same and methods of producing semiconductor devices using organosilane hardmask compositions
JP4945460B2 (ja) * 2008-01-04 2012-06-06 株式会社東芝 反射防止構造の形成方法および反射防止構造
WO2009088600A1 (en) * 2008-01-08 2009-07-16 Dow Corning Toray Co., Ltd. Silsesquioxane resins
KR20100114075A (ko) * 2008-01-15 2010-10-22 다우 코닝 코포레이션 실세스퀴옥산 수지
CN101990551B (zh) * 2008-03-04 2012-10-03 陶氏康宁公司 倍半硅氧烷树脂
KR101541939B1 (ko) * 2008-03-05 2015-08-04 다우 코닝 코포레이션 실세스퀴옥산 수지
US8293354B2 (en) * 2008-04-09 2012-10-23 The Regents Of The University Of Michigan UV curable silsesquioxane resins for nanoprint lithography
KR101690159B1 (ko) * 2008-12-10 2016-12-27 다우 코닝 코포레이션 변환가능한 반사방지 코팅
EP2373722A4 (en) 2008-12-10 2013-01-23 Dow Corning SILSESQUIOXAN RESINS
US20110236835A1 (en) * 2008-12-10 2011-09-29 Peng-Fei Fu Silsesquioxane Resins
US9353268B2 (en) 2009-04-30 2016-05-31 Enki Technology, Inc. Anti-reflective and anti-soiling coatings for self-cleaning properties
US9376593B2 (en) * 2009-04-30 2016-06-28 Enki Technology, Inc. Multi-layer coatings
US20110305787A1 (en) * 2010-06-11 2011-12-15 Satoshi Ishii Stamper for transfer of microscopic structure and transfer apparatus of microscopic structure
EP2588287A4 (en) * 2010-07-01 2018-01-17 Inmold Biosystems A/S Method and apparatus for producing a nanostructured or smooth polymer article
US9598586B2 (en) 2014-07-14 2017-03-21 Enki Technology, Inc. Coating materials and methods for enhanced reliability
US9376589B2 (en) 2014-07-14 2016-06-28 Enki Technology, Inc. High gain durable anti-reflective coating with oblate voids
TWI592760B (zh) * 2014-12-30 2017-07-21 羅門哈斯電子材料韓國有限公司 與經外塗佈之光致抗蝕劑一起使用之塗層組合物
US10597495B2 (en) * 2016-02-19 2020-03-24 Dow Silicones Corporation Aged polymeric silsesquioxanes

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000510520A (ja) * 1997-04-21 2000-08-15 アライドシグナル・インコーポレーテッド 高有機含量のオルガノヒドリドシロキサン樹脂
US6177143B1 (en) * 1999-01-06 2001-01-23 Allied Signal Inc Electron beam treatment of siloxane resins
US6448331B1 (en) * 1997-07-15 2002-09-10 Asahi Kasei Kabushiki Kaisha Alkoxysilane/organic polymer composition for thin insulating film production and use thereof
JP2002284997A (ja) * 2000-10-10 2002-10-03 Shipley Co Llc 多孔性有機ポリシリカ誘電体形成用の組成物

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4587138A (en) 1984-11-09 1986-05-06 Intel Corporation MOS rear end processing
US5010159A (en) 1989-09-01 1991-04-23 Dow Corning Corporation Process for the synthesis of soluble, condensed hydridosilicon resins containing low levels of silanol
US5100503A (en) 1990-09-14 1992-03-31 Ncr Corporation Silica-based anti-reflective planarizing layer
US5210168A (en) 1992-04-02 1993-05-11 Dow Corning Corporation Process for forming siloxane bonds
EP0568476B1 (en) 1992-04-30 1995-10-11 International Business Machines Corporation Silicon-containing positive resist and method of using the same in thin film packaging technology
JPH0656560A (ja) 1992-08-10 1994-03-01 Sony Corp Sog組成物及びそれを用いた半導体装置の製造方法
US5441765A (en) 1993-09-22 1995-08-15 Dow Corning Corporation Method of forming Si-O containing coatings
JP3499032B2 (ja) 1995-02-02 2004-02-23 ダウ コーニング アジア株式会社 放射線硬化性組成物、その硬化方法及びパターン形成方法
JP3324360B2 (ja) 1995-09-25 2002-09-17 信越化学工業株式会社 ポリシロキサン化合物及びポジ型レジスト材料
JPH09124794A (ja) 1995-11-06 1997-05-13 Dow Corning Asia Ltd 有機光機能材を含有するポリシロキサン樹脂組成物及びそれから得られる透明な光機能素子
JP3192947B2 (ja) 1995-11-16 2001-07-30 東京応化工業株式会社 シリカ系被膜形成用塗布液の製造方法
JPH1184640A (ja) * 1997-09-05 1999-03-26 Tokyo Ohka Kogyo Co Ltd 反射防止膜形成用塗布液
US6057239A (en) 1997-12-17 2000-05-02 Advanced Micro Devices, Inc. Dual damascene process using sacrificial spin-on materials
US6344284B1 (en) 1998-04-10 2002-02-05 Organic Display Technology Organic electroluminescent materials and devices made from such materials
US6156640A (en) 1998-07-14 2000-12-05 United Microelectronics Corp. Damascene process with anti-reflection coating
US6087064A (en) 1998-09-03 2000-07-11 International Business Machines Corporation Silsesquioxane polymers, method of synthesis, photoresist composition, and multilayer lithographic method
US6461955B1 (en) 1999-04-29 2002-10-08 Texas Instruments Incorporated Yield improvement of dual damascene fabrication through oxide filling
US6281285B1 (en) 1999-06-09 2001-08-28 Dow Corning Corporation Silicone resins and process for synthesis
US6824879B2 (en) * 1999-06-10 2004-11-30 Honeywell International Inc. Spin-on-glass anti-reflective coatings for photolithography
US6268457B1 (en) 1999-06-10 2001-07-31 Allied Signal, Inc. Spin-on glass anti-reflective coatings for photolithography
JP2003502449A (ja) 1999-06-10 2003-01-21 ハネウエル・インターナシヨナル・インコーポレーテツド フォトリソグラフィ用スピンオンガラス反射防止コーティング
US6890448B2 (en) 1999-06-11 2005-05-10 Shipley Company, L.L.C. Antireflective hard mask compositions
US6329118B1 (en) 1999-06-21 2001-12-11 Intel Corporation Method for patterning dual damascene interconnects using a sacrificial light absorbing material
US6982006B1 (en) 1999-10-19 2006-01-03 Boyers David G Method and apparatus for treating a substrate with an ozone-solvent solution
US6359096B1 (en) 1999-10-25 2002-03-19 Dow Corning Corporation Silicone resin compositions having good solution solubility and stability
KR100355604B1 (ko) 1999-12-23 2002-10-12 주식회사 하이닉스반도체 난반사 방지막용 중합체와 그 제조방법
JP3795333B2 (ja) 2000-03-30 2006-07-12 東京応化工業株式会社 反射防止膜形成用組成物
US6420088B1 (en) 2000-06-23 2002-07-16 International Business Machines Corporation Antireflective silicon-containing compositions as hardmask layer
US20030176614A1 (en) 2000-06-30 2003-09-18 Nigel Hacker Organohydridosiloxane resins with high organic content
US6368400B1 (en) 2000-07-17 2002-04-09 Honeywell International Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography
JP4141625B2 (ja) 2000-08-09 2008-08-27 東京応化工業株式会社 ポジ型レジスト組成物およびそのレジスト層を設けた基材
EP1197511A1 (en) 2000-10-10 2002-04-17 Shipley Company LLC Antireflective composition
US6589711B1 (en) 2001-04-04 2003-07-08 Advanced Micro Devices, Inc. Dual inlaid process using a bilayer resist
US6746530B2 (en) 2001-08-02 2004-06-08 Chunghwa Pictures Tubes, Ltd. High contrast, moisture resistant antistatic/antireflective coating for CRT display screen
US20030096090A1 (en) 2001-10-22 2003-05-22 Boisvert Ronald Paul Etch-stop resins
EP1478682A4 (en) 2001-11-15 2005-06-15 Honeywell Int Inc ANTIREFLECTIVE LAYERS FOR PHOTOLITHOGRAPHY AND METHODS OF PREPARATION THEREOF
WO2003044600A1 (en) 2001-11-15 2003-05-30 Honeywell International Inc. Spin-on anti-reflective coatings for photolithography
JP2005509710A (ja) 2001-11-16 2005-04-14 ハネウェル・インターナショナル・インコーポレーテッド フォトリソグラフィ用のスピンオングラス反射防止性コーティング
US6730454B2 (en) 2002-04-16 2004-05-04 International Business Machines Corporation Antireflective SiO-containing compositions for hardmask layer
WO2004044025A2 (en) * 2002-11-12 2004-05-27 Honeywell International Inc Anti-reflective coatings for photolithography and methods of preparation thereof
JP4244315B2 (ja) * 2002-12-02 2009-03-25 東京応化工業株式会社 レジストパターン形成用材料
KR20050084283A (ko) 2002-12-02 2005-08-26 토쿄오오카코교 가부시기가이샤 래더형 실리콘 공중합체
TW200505966A (en) 2003-04-02 2005-02-16 Dow Global Technologies Inc Organosilicate resin formulation for use in microelectronic devices
ATE377036T1 (de) 2003-05-23 2007-11-15 Dow Corning Siloxan-harz basierte anti- reflektionsbeschichtung mit hoher nassätzgeschwindigkeit
CN101073039B (zh) 2004-12-17 2011-12-14 陶氏康宁公司 形成抗反射涂层的方法
DE602005008100D1 (de) 2004-12-17 2008-08-21 Dow Corning Verfahren zur ausbildung einer antireflexionsbeschichtung
ATE486098T1 (de) 2004-12-17 2010-11-15 Dow Corning Siloxanharzbeschichtung
WO2006065316A1 (en) 2004-12-17 2006-06-22 Dow Corning Corporation Method for forming anti-reflective coating

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000510520A (ja) * 1997-04-21 2000-08-15 アライドシグナル・インコーポレーテッド 高有機含量のオルガノヒドリドシロキサン樹脂
US6448331B1 (en) * 1997-07-15 2002-09-10 Asahi Kasei Kabushiki Kaisha Alkoxysilane/organic polymer composition for thin insulating film production and use thereof
US6177143B1 (en) * 1999-01-06 2001-01-23 Allied Signal Inc Electron beam treatment of siloxane resins
JP2002284997A (ja) * 2000-10-10 2002-10-03 Shipley Co Llc 多孔性有機ポリシリカ誘電体形成用の組成物

Also Published As

Publication number Publication date
US20080318436A1 (en) 2008-12-25
TWI406099B (zh) 2013-08-21
KR20080094686A (ko) 2008-10-23
JP4881396B2 (ja) 2012-02-22
WO2007094848A3 (en) 2007-12-06
US8263312B2 (en) 2012-09-11
WO2007094848A2 (en) 2007-08-23
JP2009527021A (ja) 2009-07-23
TW200739270A (en) 2007-10-16
CN101371196A (zh) 2009-02-18
CN101371196B (zh) 2012-07-04
EP1989593A2 (en) 2008-11-12

Similar Documents

Publication Publication Date Title
KR101275649B1 (ko) 반사방지 피막의 형성방법
TWI406099B (zh) 抗反射塗料材料
EP2250213B1 (en) Silsesquioxane resins
EP1846479B1 (en) Siloxane resin coating
JP4995096B2 (ja) 反射防止膜の形成方法、レジスト画像の形成方法、パターンの形成方法、電子デバイスの製造方法及びarc組成物
JP5587791B2 (ja) シルセスキオキサン樹脂
EP1825329B1 (en) Method for forming anti-reflective coating
US7756384B2 (en) Method for forming anti-reflective coating
US8653217B2 (en) Method for forming anti-reflective coating
WO2007094849A2 (en) Antireflective coating material

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20161026

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20161026

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18 Changes to party contact information recorded

Free format text: ST27 STATUS EVENT CODE: A-5-5-R10-R18-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000