KR101324052B1 - 반사방지 코팅 재료 - Google Patents
반사방지 코팅 재료 Download PDFInfo
- Publication number
- KR101324052B1 KR101324052B1 KR1020087019774A KR20087019774A KR101324052B1 KR 101324052 B1 KR101324052 B1 KR 101324052B1 KR 1020087019774 A KR1020087019774 A KR 1020087019774A KR 20087019774 A KR20087019774 A KR 20087019774A KR 101324052 B1 KR101324052 B1 KR 101324052B1
- Authority
- KR
- South Korea
- Prior art keywords
- value
- antireflective coating
- delete delete
- electronic device
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/02—Polysilicates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0752—Silicon-containing compounds in non photosensitive layers or as additives, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Structural Engineering (AREA)
- Architecture (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Silicon Polymers (AREA)
- Paints Or Removers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Surface Treatment Of Optical Elements (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US77261906P | 2006-02-13 | 2006-02-13 | |
| US60/772,619 | 2006-02-13 | ||
| PCT/US2006/046810 WO2007094848A2 (en) | 2006-02-13 | 2006-12-07 | Antireflective coating material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20080094686A KR20080094686A (ko) | 2008-10-23 |
| KR101324052B1 true KR101324052B1 (ko) | 2013-11-01 |
Family
ID=38371944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020087019774A Expired - Fee Related KR101324052B1 (ko) | 2006-02-13 | 2006-12-07 | 반사방지 코팅 재료 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8263312B2 (https=) |
| EP (1) | EP1989593A2 (https=) |
| JP (1) | JP4881396B2 (https=) |
| KR (1) | KR101324052B1 (https=) |
| CN (1) | CN101371196B (https=) |
| TW (1) | TWI406099B (https=) |
| WO (1) | WO2007094848A2 (https=) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7756384B2 (en) * | 2004-11-08 | 2010-07-13 | Dow Corning Corporation | Method for forming anti-reflective coating |
| US20070212886A1 (en) * | 2006-03-13 | 2007-09-13 | Dong Seon Uh | Organosilane polymers, hardmask compositions including the same and methods of producing semiconductor devices using organosilane hardmask compositions |
| JP4945460B2 (ja) * | 2008-01-04 | 2012-06-06 | 株式会社東芝 | 反射防止構造の形成方法および反射防止構造 |
| WO2009088600A1 (en) * | 2008-01-08 | 2009-07-16 | Dow Corning Toray Co., Ltd. | Silsesquioxane resins |
| KR20100114075A (ko) * | 2008-01-15 | 2010-10-22 | 다우 코닝 코포레이션 | 실세스퀴옥산 수지 |
| CN101990551B (zh) * | 2008-03-04 | 2012-10-03 | 陶氏康宁公司 | 倍半硅氧烷树脂 |
| KR101541939B1 (ko) * | 2008-03-05 | 2015-08-04 | 다우 코닝 코포레이션 | 실세스퀴옥산 수지 |
| US8293354B2 (en) * | 2008-04-09 | 2012-10-23 | The Regents Of The University Of Michigan | UV curable silsesquioxane resins for nanoprint lithography |
| KR101690159B1 (ko) * | 2008-12-10 | 2016-12-27 | 다우 코닝 코포레이션 | 변환가능한 반사방지 코팅 |
| EP2373722A4 (en) | 2008-12-10 | 2013-01-23 | Dow Corning | SILSESQUIOXAN RESINS |
| US20110236835A1 (en) * | 2008-12-10 | 2011-09-29 | Peng-Fei Fu | Silsesquioxane Resins |
| US9353268B2 (en) | 2009-04-30 | 2016-05-31 | Enki Technology, Inc. | Anti-reflective and anti-soiling coatings for self-cleaning properties |
| US9376593B2 (en) * | 2009-04-30 | 2016-06-28 | Enki Technology, Inc. | Multi-layer coatings |
| US20110305787A1 (en) * | 2010-06-11 | 2011-12-15 | Satoshi Ishii | Stamper for transfer of microscopic structure and transfer apparatus of microscopic structure |
| EP2588287A4 (en) * | 2010-07-01 | 2018-01-17 | Inmold Biosystems A/S | Method and apparatus for producing a nanostructured or smooth polymer article |
| US9598586B2 (en) | 2014-07-14 | 2017-03-21 | Enki Technology, Inc. | Coating materials and methods for enhanced reliability |
| US9376589B2 (en) | 2014-07-14 | 2016-06-28 | Enki Technology, Inc. | High gain durable anti-reflective coating with oblate voids |
| TWI592760B (zh) * | 2014-12-30 | 2017-07-21 | 羅門哈斯電子材料韓國有限公司 | 與經外塗佈之光致抗蝕劑一起使用之塗層組合物 |
| US10597495B2 (en) * | 2016-02-19 | 2020-03-24 | Dow Silicones Corporation | Aged polymeric silsesquioxanes |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000510520A (ja) * | 1997-04-21 | 2000-08-15 | アライドシグナル・インコーポレーテッド | 高有機含量のオルガノヒドリドシロキサン樹脂 |
| US6177143B1 (en) * | 1999-01-06 | 2001-01-23 | Allied Signal Inc | Electron beam treatment of siloxane resins |
| US6448331B1 (en) * | 1997-07-15 | 2002-09-10 | Asahi Kasei Kabushiki Kaisha | Alkoxysilane/organic polymer composition for thin insulating film production and use thereof |
| JP2002284997A (ja) * | 2000-10-10 | 2002-10-03 | Shipley Co Llc | 多孔性有機ポリシリカ誘電体形成用の組成物 |
Family Cites Families (48)
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|---|---|---|---|---|
| US4587138A (en) | 1984-11-09 | 1986-05-06 | Intel Corporation | MOS rear end processing |
| US5010159A (en) | 1989-09-01 | 1991-04-23 | Dow Corning Corporation | Process for the synthesis of soluble, condensed hydridosilicon resins containing low levels of silanol |
| US5100503A (en) | 1990-09-14 | 1992-03-31 | Ncr Corporation | Silica-based anti-reflective planarizing layer |
| US5210168A (en) | 1992-04-02 | 1993-05-11 | Dow Corning Corporation | Process for forming siloxane bonds |
| EP0568476B1 (en) | 1992-04-30 | 1995-10-11 | International Business Machines Corporation | Silicon-containing positive resist and method of using the same in thin film packaging technology |
| JPH0656560A (ja) | 1992-08-10 | 1994-03-01 | Sony Corp | Sog組成物及びそれを用いた半導体装置の製造方法 |
| US5441765A (en) | 1993-09-22 | 1995-08-15 | Dow Corning Corporation | Method of forming Si-O containing coatings |
| JP3499032B2 (ja) | 1995-02-02 | 2004-02-23 | ダウ コーニング アジア株式会社 | 放射線硬化性組成物、その硬化方法及びパターン形成方法 |
| JP3324360B2 (ja) | 1995-09-25 | 2002-09-17 | 信越化学工業株式会社 | ポリシロキサン化合物及びポジ型レジスト材料 |
| JPH09124794A (ja) | 1995-11-06 | 1997-05-13 | Dow Corning Asia Ltd | 有機光機能材を含有するポリシロキサン樹脂組成物及びそれから得られる透明な光機能素子 |
| JP3192947B2 (ja) | 1995-11-16 | 2001-07-30 | 東京応化工業株式会社 | シリカ系被膜形成用塗布液の製造方法 |
| JPH1184640A (ja) * | 1997-09-05 | 1999-03-26 | Tokyo Ohka Kogyo Co Ltd | 反射防止膜形成用塗布液 |
| US6057239A (en) | 1997-12-17 | 2000-05-02 | Advanced Micro Devices, Inc. | Dual damascene process using sacrificial spin-on materials |
| US6344284B1 (en) | 1998-04-10 | 2002-02-05 | Organic Display Technology | Organic electroluminescent materials and devices made from such materials |
| US6156640A (en) | 1998-07-14 | 2000-12-05 | United Microelectronics Corp. | Damascene process with anti-reflection coating |
| US6087064A (en) | 1998-09-03 | 2000-07-11 | International Business Machines Corporation | Silsesquioxane polymers, method of synthesis, photoresist composition, and multilayer lithographic method |
| US6461955B1 (en) | 1999-04-29 | 2002-10-08 | Texas Instruments Incorporated | Yield improvement of dual damascene fabrication through oxide filling |
| US6281285B1 (en) | 1999-06-09 | 2001-08-28 | Dow Corning Corporation | Silicone resins and process for synthesis |
| US6824879B2 (en) * | 1999-06-10 | 2004-11-30 | Honeywell International Inc. | Spin-on-glass anti-reflective coatings for photolithography |
| US6268457B1 (en) | 1999-06-10 | 2001-07-31 | Allied Signal, Inc. | Spin-on glass anti-reflective coatings for photolithography |
| JP2003502449A (ja) | 1999-06-10 | 2003-01-21 | ハネウエル・インターナシヨナル・インコーポレーテツド | フォトリソグラフィ用スピンオンガラス反射防止コーティング |
| US6890448B2 (en) | 1999-06-11 | 2005-05-10 | Shipley Company, L.L.C. | Antireflective hard mask compositions |
| US6329118B1 (en) | 1999-06-21 | 2001-12-11 | Intel Corporation | Method for patterning dual damascene interconnects using a sacrificial light absorbing material |
| US6982006B1 (en) | 1999-10-19 | 2006-01-03 | Boyers David G | Method and apparatus for treating a substrate with an ozone-solvent solution |
| US6359096B1 (en) | 1999-10-25 | 2002-03-19 | Dow Corning Corporation | Silicone resin compositions having good solution solubility and stability |
| KR100355604B1 (ko) | 1999-12-23 | 2002-10-12 | 주식회사 하이닉스반도체 | 난반사 방지막용 중합체와 그 제조방법 |
| JP3795333B2 (ja) | 2000-03-30 | 2006-07-12 | 東京応化工業株式会社 | 反射防止膜形成用組成物 |
| US6420088B1 (en) | 2000-06-23 | 2002-07-16 | International Business Machines Corporation | Antireflective silicon-containing compositions as hardmask layer |
| US20030176614A1 (en) | 2000-06-30 | 2003-09-18 | Nigel Hacker | Organohydridosiloxane resins with high organic content |
| US6368400B1 (en) | 2000-07-17 | 2002-04-09 | Honeywell International | Absorbing compounds for spin-on-glass anti-reflective coatings for photolithography |
| JP4141625B2 (ja) | 2000-08-09 | 2008-08-27 | 東京応化工業株式会社 | ポジ型レジスト組成物およびそのレジスト層を設けた基材 |
| EP1197511A1 (en) | 2000-10-10 | 2002-04-17 | Shipley Company LLC | Antireflective composition |
| US6589711B1 (en) | 2001-04-04 | 2003-07-08 | Advanced Micro Devices, Inc. | Dual inlaid process using a bilayer resist |
| US6746530B2 (en) | 2001-08-02 | 2004-06-08 | Chunghwa Pictures Tubes, Ltd. | High contrast, moisture resistant antistatic/antireflective coating for CRT display screen |
| US20030096090A1 (en) | 2001-10-22 | 2003-05-22 | Boisvert Ronald Paul | Etch-stop resins |
| EP1478682A4 (en) | 2001-11-15 | 2005-06-15 | Honeywell Int Inc | ANTIREFLECTIVE LAYERS FOR PHOTOLITHOGRAPHY AND METHODS OF PREPARATION THEREOF |
| WO2003044600A1 (en) | 2001-11-15 | 2003-05-30 | Honeywell International Inc. | Spin-on anti-reflective coatings for photolithography |
| JP2005509710A (ja) | 2001-11-16 | 2005-04-14 | ハネウェル・インターナショナル・インコーポレーテッド | フォトリソグラフィ用のスピンオングラス反射防止性コーティング |
| US6730454B2 (en) | 2002-04-16 | 2004-05-04 | International Business Machines Corporation | Antireflective SiO-containing compositions for hardmask layer |
| WO2004044025A2 (en) * | 2002-11-12 | 2004-05-27 | Honeywell International Inc | Anti-reflective coatings for photolithography and methods of preparation thereof |
| JP4244315B2 (ja) * | 2002-12-02 | 2009-03-25 | 東京応化工業株式会社 | レジストパターン形成用材料 |
| KR20050084283A (ko) | 2002-12-02 | 2005-08-26 | 토쿄오오카코교 가부시기가이샤 | 래더형 실리콘 공중합체 |
| TW200505966A (en) | 2003-04-02 | 2005-02-16 | Dow Global Technologies Inc | Organosilicate resin formulation for use in microelectronic devices |
| ATE377036T1 (de) | 2003-05-23 | 2007-11-15 | Dow Corning | Siloxan-harz basierte anti- reflektionsbeschichtung mit hoher nassätzgeschwindigkeit |
| CN101073039B (zh) | 2004-12-17 | 2011-12-14 | 陶氏康宁公司 | 形成抗反射涂层的方法 |
| DE602005008100D1 (de) | 2004-12-17 | 2008-08-21 | Dow Corning | Verfahren zur ausbildung einer antireflexionsbeschichtung |
| ATE486098T1 (de) | 2004-12-17 | 2010-11-15 | Dow Corning | Siloxanharzbeschichtung |
| WO2006065316A1 (en) | 2004-12-17 | 2006-06-22 | Dow Corning Corporation | Method for forming anti-reflective coating |
-
2006
- 2006-12-07 CN CN2006800527193A patent/CN101371196B/zh not_active Expired - Fee Related
- 2006-12-07 WO PCT/US2006/046810 patent/WO2007094848A2/en not_active Ceased
- 2006-12-07 KR KR1020087019774A patent/KR101324052B1/ko not_active Expired - Fee Related
- 2006-12-07 JP JP2008555229A patent/JP4881396B2/ja not_active Expired - Fee Related
- 2006-12-07 US US12/160,325 patent/US8263312B2/en not_active Expired - Fee Related
- 2006-12-07 EP EP20060847526 patent/EP1989593A2/en not_active Withdrawn
-
2007
- 2007-01-08 TW TW96100714A patent/TWI406099B/zh not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000510520A (ja) * | 1997-04-21 | 2000-08-15 | アライドシグナル・インコーポレーテッド | 高有機含量のオルガノヒドリドシロキサン樹脂 |
| US6448331B1 (en) * | 1997-07-15 | 2002-09-10 | Asahi Kasei Kabushiki Kaisha | Alkoxysilane/organic polymer composition for thin insulating film production and use thereof |
| US6177143B1 (en) * | 1999-01-06 | 2001-01-23 | Allied Signal Inc | Electron beam treatment of siloxane resins |
| JP2002284997A (ja) * | 2000-10-10 | 2002-10-03 | Shipley Co Llc | 多孔性有機ポリシリカ誘電体形成用の組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20080318436A1 (en) | 2008-12-25 |
| TWI406099B (zh) | 2013-08-21 |
| KR20080094686A (ko) | 2008-10-23 |
| JP4881396B2 (ja) | 2012-02-22 |
| WO2007094848A3 (en) | 2007-12-06 |
| US8263312B2 (en) | 2012-09-11 |
| WO2007094848A2 (en) | 2007-08-23 |
| JP2009527021A (ja) | 2009-07-23 |
| TW200739270A (en) | 2007-10-16 |
| CN101371196A (zh) | 2009-02-18 |
| CN101371196B (zh) | 2012-07-04 |
| EP1989593A2 (en) | 2008-11-12 |
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