KR101304798B1 - 접착제 조성물 및 상기 접착제로 이루어지는 접착층을구비한 시트 - Google Patents

접착제 조성물 및 상기 접착제로 이루어지는 접착층을구비한 시트 Download PDF

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Publication number
KR101304798B1
KR101304798B1 KR1020060101694A KR20060101694A KR101304798B1 KR 101304798 B1 KR101304798 B1 KR 101304798B1 KR 1020060101694 A KR1020060101694 A KR 1020060101694A KR 20060101694 A KR20060101694 A KR 20060101694A KR 101304798 B1 KR101304798 B1 KR 101304798B1
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KR
South Korea
Prior art keywords
adhesive
resin
adhesive layer
weight
silicone
Prior art date
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KR1020060101694A
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English (en)
Korean (ko)
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KR20070043629A (ko
Inventor
쇼우헤이 고자까이
노부히로 이찌로꾸
Original Assignee
신에쓰 가가꾸 고교 가부시끼가이샤
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Publication of KR20070043629A publication Critical patent/KR20070043629A/ko
Application granted granted Critical
Publication of KR101304798B1 publication Critical patent/KR101304798B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Adhesive Tapes (AREA)
KR1020060101694A 2005-10-20 2006-10-19 접착제 조성물 및 상기 접착제로 이루어지는 접착층을구비한 시트 KR101304798B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2005-00306238 2005-10-20
JP2005306238 2005-10-20

Publications (2)

Publication Number Publication Date
KR20070043629A KR20070043629A (ko) 2007-04-25
KR101304798B1 true KR101304798B1 (ko) 2013-09-05

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020060101694A KR101304798B1 (ko) 2005-10-20 2006-10-19 접착제 조성물 및 상기 접착제로 이루어지는 접착층을구비한 시트

Country Status (2)

Country Link
KR (1) KR101304798B1 (zh)
TW (1) TWI384046B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100962936B1 (ko) * 2007-12-20 2010-06-09 제일모직주식회사 반도체 조립용 접착 필름 조성물 및 접착 필름
KR101047923B1 (ko) 2007-12-27 2011-07-08 주식회사 엘지화학 버 특성 및 신뢰성이 우수한 다이싱 다이 본딩 필름 및반도체 장치
JP4771100B2 (ja) * 2008-08-27 2011-09-14 信越化学工業株式会社 無溶剤型ポリイミドシリコーン系樹脂組成物及びその硬化物
CN102209754B (zh) * 2008-11-10 2013-07-17 味之素株式会社 印刷线路板用树脂组合物
JP5681374B2 (ja) * 2010-04-19 2015-03-04 日東電工株式会社 ダイシングテープ一体型半導体裏面用フィルム
JP5975528B2 (ja) * 2012-10-11 2016-08-23 信越化学工業株式会社 ウエハ加工体、ウエハ加工用部材、ウエハ加工用仮接着材、及び薄型ウエハの製造方法
WO2015080098A1 (ja) * 2013-11-27 2015-06-04 東レ株式会社 半導体用樹脂組成物および半導体用樹脂フィルムならびにこれらを用いた半導体装置
JP6395597B2 (ja) * 2014-12-25 2018-09-26 マクセルホールディングス株式会社 ダイシング用粘着テープおよび半導体チップの製造方法
JP6612683B2 (ja) * 2016-06-13 2019-11-27 東京応化工業株式会社 積層体の製造方法、及びその利用
CN108966511A (zh) * 2018-07-30 2018-12-07 生益电子股份有限公司 一种降低高速pcb信号插入损耗的内层表面处理方法
KR102378701B1 (ko) * 2019-04-22 2022-03-24 삼성에스디아이 주식회사 실리콘계 점착성 보호 필름 및 이를 포함하는 광학 부재

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001329233A (ja) * 2000-03-15 2001-11-27 Shin Etsu Chem Co Ltd フィルム状電子部品用接着剤及び電子部品
JP2003313427A (ja) * 2002-04-24 2003-11-06 Shin Etsu Chem Co Ltd 導電性樹脂組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7449519B2 (en) * 2003-02-18 2008-11-11 Konishi Co., Ltd. Curing resin, method for producing same and curing resin composition
JP4171898B2 (ja) * 2003-04-25 2008-10-29 信越化学工業株式会社 ダイシング・ダイボンド用接着テープ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001329233A (ja) * 2000-03-15 2001-11-27 Shin Etsu Chem Co Ltd フィルム状電子部品用接着剤及び電子部品
JP2003313427A (ja) * 2002-04-24 2003-11-06 Shin Etsu Chem Co Ltd 導電性樹脂組成物

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Publication number Publication date
KR20070043629A (ko) 2007-04-25
TWI384046B (zh) 2013-02-01
TW200728427A (en) 2007-08-01

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