KR101274927B1 - 후막도체형성용 조성물, 이 조성물을 이용하여 형성된 후막도체 및 이 후막도체를 이용한 칩 저항기 - Google Patents

후막도체형성용 조성물, 이 조성물을 이용하여 형성된 후막도체 및 이 후막도체를 이용한 칩 저항기 Download PDF

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KR101274927B1
KR101274927B1 KR1020110075793A KR20110075793A KR101274927B1 KR 101274927 B1 KR101274927 B1 KR 101274927B1 KR 1020110075793 A KR1020110075793 A KR 1020110075793A KR 20110075793 A KR20110075793 A KR 20110075793A KR 101274927 B1 KR101274927 B1 KR 101274927B1
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South Korea
Prior art keywords
powder
thick film
film conductor
composition
weight
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KR1020110075793A
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English (en)
Korean (ko)
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KR20120017396A (ko
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나오키 이시야마
신고 아와가쿠보
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스미토모 긴조쿠 고잔 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/08—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Conductive Materials (AREA)
  • Non-Adjustable Resistors (AREA)
  • Non-Insulated Conductors (AREA)
  • Glass Compositions (AREA)
KR1020110075793A 2010-08-18 2011-07-29 후막도체형성용 조성물, 이 조성물을 이용하여 형성된 후막도체 및 이 후막도체를 이용한 칩 저항기 KR101274927B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-183323 2010-08-18
JP2010183323A JP5454414B2 (ja) 2010-08-18 2010-08-18 厚膜導体形成用組成物、この組成物を用いて形成された厚膜導体、およびこの厚膜導体を用いたチップ抵抗器

Publications (2)

Publication Number Publication Date
KR20120017396A KR20120017396A (ko) 2012-02-28
KR101274927B1 true KR101274927B1 (ko) 2013-06-17

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KR1020110075793A KR101274927B1 (ko) 2010-08-18 2011-07-29 후막도체형성용 조성물, 이 조성물을 이용하여 형성된 후막도체 및 이 후막도체를 이용한 칩 저항기

Country Status (4)

Country Link
JP (1) JP5454414B2 (ja)
KR (1) KR101274927B1 (ja)
CN (1) CN102426871B (ja)
TW (1) TWI429609B (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6011006B2 (ja) * 2012-04-27 2016-10-19 ブラザー工業株式会社 液滴噴射装置
JP6114001B2 (ja) * 2012-10-26 2017-04-12 京セラ株式会社 導電性ペーストおよび回路基板ならびに電子装置
JP6201190B2 (ja) * 2014-04-25 2017-09-27 住友金属鉱山株式会社 厚膜導体形成用組成物及びそれを用いて得られる厚膜導体
MY183351A (en) 2014-09-12 2021-02-18 Shoei Chemical Ind Co Resistive composition
CN109065837B (zh) 2014-11-10 2021-08-24 株式会社村田制作所 锂离子导体、电池及电子装置
JP2016219256A (ja) * 2015-05-20 2016-12-22 住友金属鉱山株式会社 Ｃｕペースト組成物および厚膜導体
JP6952949B2 (ja) * 2016-10-04 2021-10-27 日本電気硝子株式会社 ホウケイ酸系ガラス、複合粉末材料及び複合粉末材料ペースト
US10763018B2 (en) * 2017-04-14 2020-09-01 Panasonic Intellectual Property Management Co., Ltd. Chip resistor
KR102639865B1 (ko) 2017-12-15 2024-02-22 스미토모 긴조쿠 고잔 가부시키가이샤 후막 도체 형성용 분말 조성물 및 후막 도체 형성용 페이스트
CN111453987B (zh) * 2019-01-21 2022-04-22 中国科学院过程工程研究所 一种与氧化铝完全化学相容的玻璃组合物、其制备方法和应用
CN110660544B (zh) * 2019-10-14 2021-09-28 安徽翔胜科技有限公司 一种抗环境气体腐蚀的电阻
CN112071465B (zh) * 2020-09-18 2022-04-08 西安宏星电子浆料科技股份有限公司 一种包含含镍的合金粉的抗银迁移片式电阻正面电极浆料
CN113782251A (zh) * 2021-09-09 2021-12-10 南京汇聚新材料科技有限公司 一种电极膏体和电极厚膜及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06223616A (ja) * 1993-01-27 1994-08-12 Sumitomo Metal Mining Co Ltd 導電ペースト用組成物
JPH0797269A (ja) * 1993-09-27 1995-04-11 Mitsubishi Materials Corp 低温焼結性セラミックスの製造方法
JP2001114556A (ja) 1999-10-20 2001-04-24 Sumitomo Metal Electronics Devices Inc ガラスセラミック基板の製造方法
JP2006228572A (ja) 2005-02-17 2006-08-31 Sumitomo Metal Mining Co Ltd 厚膜導体形成用組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060102228A1 (en) * 2004-11-12 2006-05-18 Ferro Corporation Method of making solar cell contacts
JP2006294589A (ja) * 2005-03-17 2006-10-26 Sumitomo Metal Mining Co Ltd 抵抗ペースト及び抵抗体
EP2137739B1 (en) * 2007-04-25 2017-11-01 Heraeus Precious Metals North America Conshohocken LLC Thick film conductor formulations comprising silver and nickel or silver and nickel alloys and solar cells made therefrom

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06223616A (ja) * 1993-01-27 1994-08-12 Sumitomo Metal Mining Co Ltd 導電ペースト用組成物
JPH0797269A (ja) * 1993-09-27 1995-04-11 Mitsubishi Materials Corp 低温焼結性セラミックスの製造方法
JP2001114556A (ja) 1999-10-20 2001-04-24 Sumitomo Metal Electronics Devices Inc ガラスセラミック基板の製造方法
JP2006228572A (ja) 2005-02-17 2006-08-31 Sumitomo Metal Mining Co Ltd 厚膜導体形成用組成物

Also Published As

Publication number Publication date
JP2012043622A (ja) 2012-03-01
JP5454414B2 (ja) 2014-03-26
CN102426871B (zh) 2015-07-01
KR20120017396A (ko) 2012-02-28
CN102426871A (zh) 2012-04-25
TWI429609B (zh) 2014-03-11
TW201213269A (en) 2012-04-01

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