KR101215105B1 - 스텔스 다이싱용 점착 시트 및 반도체 장치의 제조 방법 - Google Patents

스텔스 다이싱용 점착 시트 및 반도체 장치의 제조 방법 Download PDF

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KR101215105B1
KR101215105B1 KR1020100122174A KR20100122174A KR101215105B1 KR 101215105 B1 KR101215105 B1 KR 101215105B1 KR 1020100122174 A KR1020100122174 A KR 1020100122174A KR 20100122174 A KR20100122174 A KR 20100122174A KR 101215105 B1 KR101215105 B1 KR 101215105B1
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South Korea
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adhesive sheet
stealth dicing
adhesive layer
adhesive
wafer
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Korean (ko)
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KR20110063359A (ko
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요스케 사토
마사토모 나카무라
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린텍 코포레이션
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/245—Vinyl resins, e.g. polyvinyl chloride [PVC]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2427/00—Presence of halogenated polymer
    • C09J2427/006—Presence of halogenated polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
KR1020100122174A 2009-12-04 2010-12-02 스텔스 다이싱용 점착 시트 및 반도체 장치의 제조 방법 Active KR101215105B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009276906A JP5128575B2 (ja) 2009-12-04 2009-12-04 ステルスダイシング用粘着シート及び半導体装置の製造方法
JPJP-P-2009-276906 2009-12-04

Publications (2)

Publication Number Publication Date
KR20110063359A KR20110063359A (ko) 2011-06-10
KR101215105B1 true KR101215105B1 (ko) 2012-12-24

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KR1020100122174A Active KR101215105B1 (ko) 2009-12-04 2010-12-02 스텔스 다이싱용 점착 시트 및 반도체 장치의 제조 방법

Country Status (3)

Country Link
US (1) US8106522B2 (https=)
JP (1) JP5128575B2 (https=)
KR (1) KR101215105B1 (https=)

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KR101375397B1 (ko) * 2008-03-03 2014-03-17 린텍 코포레이션 점착 시트
JP5993845B2 (ja) 2010-06-08 2016-09-14 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング 先ダイシング法を行う微細加工されたウェーハへの接着剤の被覆
EP2671248A4 (en) * 2011-02-01 2015-10-07 Henkel Corp ON A PRECUTED WAFER APPLIED FILM ON A DICING TAPE
JP2014511559A (ja) 2011-02-01 2014-05-15 ヘンケル コーポレイション プレカットされウェハに塗布されるアンダーフィル膜
JP2012229372A (ja) * 2011-04-27 2012-11-22 Nitto Denko Corp 粘着剤組成物及び粘着シート
JP5904720B2 (ja) * 2011-05-12 2016-04-20 株式会社ディスコ ウエーハの分割方法
JP5786505B2 (ja) * 2011-07-08 2015-09-30 日立化成株式会社 ダイシング・ダイボンディング一体型テープ
JP5975621B2 (ja) 2011-11-02 2016-08-23 リンテック株式会社 ダイシングシートおよび半導体チップの製造方法
JP5684948B2 (ja) * 2012-05-14 2015-03-18 リンテック株式会社 接着性樹脂層付シートおよび半導体装置の製造方法
US9364863B2 (en) 2013-01-23 2016-06-14 Siemens Medical Solutions Usa, Inc. Method for forming an ultrasound transducer array
JP6334223B2 (ja) 2014-03-26 2018-05-30 リンテック株式会社 粘着シート
US9601437B2 (en) * 2014-09-09 2017-03-21 Nxp B.V. Plasma etching and stealth dicing laser process
KR102430472B1 (ko) * 2014-12-25 2022-08-05 덴카 주식회사 레이저 다이싱용 점착 시트 및 반도체 장치의 제조 방법
JP6530242B2 (ja) * 2015-06-01 2019-06-12 日東電工株式会社 半導体裏面用フィルム及びその用途
JP6573072B2 (ja) 2015-08-27 2019-09-11 株式会社村田製作所 フィルム拡張装置およびそれを用いた電子部品の製造方法
MY191606A (en) * 2015-10-05 2022-07-01 Lintec Corp Sheet for semiconductor processing
WO2018083987A1 (ja) * 2016-11-02 2018-05-11 リンテック株式会社 ステルスダイシング用粘着シート
JP6800062B2 (ja) * 2017-03-28 2020-12-16 古河電気工業株式会社 粘着テープ
KR102453451B1 (ko) * 2017-03-31 2022-10-12 린텍 가부시키가이샤 반도체 장치의 제조 방법 및 점착 시트
JP6832784B2 (ja) * 2017-04-24 2021-02-24 デンカ株式会社 ステルスダイシング用粘着テープ及びそれを用いた半導体チップの製造方法
KR102492038B1 (ko) 2017-04-24 2023-01-27 도레이 카부시키가이샤 필름 및 필름의 제조 방법
JP7402601B2 (ja) * 2018-05-09 2023-12-21 リンテック株式会社 個片体形成装置および個片体形成方法
US12288768B2 (en) * 2019-08-26 2025-04-29 Lintec Corporation Method of manufacturing laminate
US12552975B2 (en) 2020-03-06 2026-02-17 Tredegar Surface Protection, Llc Carrier film for semi-conductor wafer processing
KR102846622B1 (ko) 2020-12-21 2025-08-18 코닝 인코포레이티드 기판 절단 및 분리 시스템 및 방법
JPWO2024150789A1 (https=) 2023-01-12 2024-07-18
KR20250170581A (ko) 2023-03-31 2025-12-05 후루카와 덴키 고교 가부시키가이샤 전자 부품용 점착 테이프

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JP2006152072A (ja) * 2004-11-26 2006-06-15 Teijin Chem Ltd 半導体製造用帯電防止性フィルムおよびその製造方法
JP2009177025A (ja) * 2008-01-25 2009-08-06 Lintec Corp レーザーダイシングシートおよびチップ体の製造方法
JP2009277778A (ja) * 2008-05-13 2009-11-26 Disco Abrasive Syst Ltd ウエーハの分割方法

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US7108911B2 (en) * 2000-11-02 2006-09-19 3M Innovative Properties Company Adhesive composition and adhesive sheet
KR101215728B1 (ko) * 2003-06-06 2012-12-26 히다치 가세고교 가부시끼가이샤 반도체 장치의 제조방법
JP2005068420A (ja) * 2003-08-07 2005-03-17 Mitsui Chemicals Inc 粘着シート
JP2006203133A (ja) * 2005-01-24 2006-08-03 Lintec Corp チップ体の製造方法、デバイスの製造方法およびチップ体固着用粘接着シート
KR101375397B1 (ko) * 2008-03-03 2014-03-17 린텍 코포레이션 점착 시트
JP5613982B2 (ja) * 2008-04-11 2014-10-29 日立化成株式会社 半導体チップの製造方法及びダイシングテープ
US20100112315A1 (en) * 2008-10-31 2010-05-06 Xerox Corporation Laminating film and methods of use thereof

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2006152072A (ja) * 2004-11-26 2006-06-15 Teijin Chem Ltd 半導体製造用帯電防止性フィルムおよびその製造方法
JP2009177025A (ja) * 2008-01-25 2009-08-06 Lintec Corp レーザーダイシングシートおよびチップ体の製造方法
JP2009277778A (ja) * 2008-05-13 2009-11-26 Disco Abrasive Syst Ltd ウエーハの分割方法

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Publication number Publication date
JP2011119548A (ja) 2011-06-16
US20110136322A1 (en) 2011-06-09
JP5128575B2 (ja) 2013-01-23
KR20110063359A (ko) 2011-06-10
US8106522B2 (en) 2012-01-31

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