KR101196660B1 - 전자 부품의 제조 방법 - Google Patents

전자 부품의 제조 방법 Download PDF

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Publication number
KR101196660B1
KR101196660B1 KR1020110041802A KR20110041802A KR101196660B1 KR 101196660 B1 KR101196660 B1 KR 101196660B1 KR 1020110041802 A KR1020110041802 A KR 1020110041802A KR 20110041802 A KR20110041802 A KR 20110041802A KR 101196660 B1 KR101196660 B1 KR 101196660B1
Authority
KR
South Korea
Prior art keywords
electronic component
solder
molten solder
manufacturing
layer
Prior art date
Application number
KR1020110041802A
Other languages
English (en)
Korean (ko)
Other versions
KR20110123672A (ko
Inventor
고 오노데라
아키히로 호리타
다카시 사쿠라이
요시카즈 이토
게니치 와타나베
요시키 기쿠치
Original Assignee
티디케이가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 티디케이가부시기가이샤 filed Critical 티디케이가부시기가이샤
Publication of KR20110123672A publication Critical patent/KR20110123672A/ko
Application granted granted Critical
Publication of KR101196660B1 publication Critical patent/KR101196660B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H01G4/22—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 impregnated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating With Molten Metal (AREA)
  • Ceramic Capacitors (AREA)
KR1020110041802A 2010-05-07 2011-05-03 전자 부품의 제조 방법 KR101196660B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010107397A JP5573341B2 (ja) 2010-05-07 2010-05-07 電子部品の製造方法
JPJP-P-2010-107397 2010-05-07

Publications (2)

Publication Number Publication Date
KR20110123672A KR20110123672A (ko) 2011-11-15
KR101196660B1 true KR101196660B1 (ko) 2012-11-02

Family

ID=45324756

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110041802A KR101196660B1 (ko) 2010-05-07 2011-05-03 전자 부품의 제조 방법

Country Status (3)

Country Link
JP (1) JP5573341B2 (ja)
KR (1) KR101196660B1 (ja)
CN (1) CN102290240B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2840596B1 (en) * 2012-04-17 2017-11-22 Tanigurogumi Corporation Forming method of solder bumps and manufacturing method for substrate having solder bumps
JP6076698B2 (ja) * 2012-11-02 2017-02-08 株式会社谷黒組 電極溶食防止層を有する部品
JP6150881B2 (ja) * 2013-03-21 2017-06-21 株式会社谷黒組 はんだ付け装置及びはんだ付け方法
JP7494826B2 (ja) * 2021-10-11 2024-06-04 株式会社村田製作所 積層セラミックコンデンサ

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004076030A (ja) * 2002-08-09 2004-03-11 Nippon Joint Kk 表面処理方法、洗浄保護用溶液および装置ユニット

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0460106A (ja) * 1990-06-29 1992-02-26 Mazda Motor Corp エンジンの制御装置
JPH04163990A (ja) * 1990-10-29 1992-06-09 Metsuku Kk 改良された半田付け方法
JPH06252542A (ja) * 1993-02-25 1994-09-09 Sharp Corp 半田層の形成方法
JPH0878278A (ja) * 1994-09-08 1996-03-22 Matsushita Electric Ind Co Ltd 電子部品の製造方法
JPH09260106A (ja) * 1996-03-22 1997-10-03 Murata Mfg Co Ltd 電子部品の製造方法
JP4665071B1 (ja) * 2010-04-22 2011-04-06 ホライゾン技術研究所株式会社 錫またははんだプリコート皮膜の形成方法及びその装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004076030A (ja) * 2002-08-09 2004-03-11 Nippon Joint Kk 表面処理方法、洗浄保護用溶液および装置ユニット

Also Published As

Publication number Publication date
CN102290240B (zh) 2015-03-25
JP2011236457A (ja) 2011-11-24
KR20110123672A (ko) 2011-11-15
CN102290240A (zh) 2011-12-21
JP5573341B2 (ja) 2014-08-20

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