KR101185881B1 - 카메라 시스템 및 관련 방법들 - Google Patents
카메라 시스템 및 관련 방법들 Download PDFInfo
- Publication number
- KR101185881B1 KR101185881B1 KR1020097003164A KR20097003164A KR101185881B1 KR 101185881 B1 KR101185881 B1 KR 101185881B1 KR 1020097003164 A KR1020097003164 A KR 1020097003164A KR 20097003164 A KR20097003164 A KR 20097003164A KR 101185881 B1 KR101185881 B1 KR 101185881B1
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- South Korea
- Prior art keywords
- substrate
- optical stack
- detector
- optical
- detector substrate
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Images
Classifications
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
- G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
- G02B13/003—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having two lenses
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
- G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
- G02B13/0035—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having three lenses
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- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0055—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element
- G02B13/006—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element at least one element being a compound optical element, e.g. cemented elements
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- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
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- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L27/144—Devices controlled by radiation
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- H—ELECTRICITY
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
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- H—ELECTRICITY
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
- Lens Barrels (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Cameras In General (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/487,580 | 2006-07-17 | ||
US11/487,580 US8049806B2 (en) | 2004-09-27 | 2006-07-17 | Thin camera and associated methods |
US85536506P | 2006-10-31 | 2006-10-31 | |
US60/855,365 | 2006-10-31 | ||
PCT/US2007/016156 WO2008011003A2 (en) | 2006-07-17 | 2007-07-17 | Camera system and associated methods |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090034981A KR20090034981A (ko) | 2009-04-08 |
KR101185881B1 true KR101185881B1 (ko) | 2012-09-25 |
Family
ID=38957311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020097003164A KR101185881B1 (ko) | 2006-07-17 | 2007-07-17 | 카메라 시스템 및 관련 방법들 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2044629A4 (de) |
JP (2) | JP5292291B2 (de) |
KR (1) | KR101185881B1 (de) |
CN (1) | CN101512768B (de) |
WO (1) | WO2008011003A2 (de) |
Families Citing this family (46)
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US20080118241A1 (en) * | 2006-11-16 | 2008-05-22 | Tekolste Robert | Control of stray light in camera systems employing an optics stack and associated methods |
WO2008102776A1 (ja) | 2007-02-19 | 2008-08-28 | Konica Minolta Opto, Inc. | 撮像レンズ、撮像装置、携帯端末、および撮像レンズの製造方法 |
EP2527898A3 (de) * | 2007-02-19 | 2014-06-25 | Konica Minolta Opto, Inc. | Abbildungsobjektiv, Abbildungsvorrichtung und mobiles Endgerät |
JPWO2008102773A1 (ja) * | 2007-02-19 | 2010-05-27 | コニカミノルタオプト株式会社 | 撮像レンズ、撮像装置、携帯端末、および撮像レンズの製造方法 |
WO2009004965A1 (ja) * | 2007-07-04 | 2009-01-08 | Konica Minolta Opto, Inc. | 撮像レンズ及び撮像装置並びに携帯端末 |
US20110031510A1 (en) * | 2007-11-27 | 2011-02-10 | Heptagon Oy | Encapsulated lens stack |
TW200937642A (en) | 2007-12-19 | 2009-09-01 | Heptagon Oy | Wafer stack, integrated optical device and method for fabricating the same |
US8270098B2 (en) | 2008-02-20 | 2012-09-18 | Konica Minolto Opto, Inc. | Image pickup lens, image pickup apparatus, mobile terminal, and method for manufacturing image pickup lens |
US9118825B2 (en) | 2008-02-22 | 2015-08-25 | Nan Chang O-Film Optoelectronics Technology Ltd. | Attachment of wafer level optics |
JP4420141B2 (ja) * | 2008-04-28 | 2010-02-24 | コニカミノルタオプト株式会社 | ウエハレンズの製造方法及びウエハレンズ |
WO2009137022A1 (en) * | 2008-05-06 | 2009-11-12 | Tessera North America, Inc. | Camera system including radiation shield and method of shielding radiation |
FR2931587B1 (fr) * | 2008-05-21 | 2011-05-13 | Commissariat Energie Atomique | Procede de realisation d'un dispositif optique a composants optoelectroniques integres |
US20090321861A1 (en) * | 2008-06-26 | 2009-12-31 | Micron Technology, Inc. | Microelectronic imagers with stacked lens assemblies and processes for wafer-level packaging of microelectronic imagers |
JP5094802B2 (ja) * | 2008-09-26 | 2012-12-12 | シャープ株式会社 | 光学素子ウエハの製造方法 |
KR101634353B1 (ko) | 2008-12-04 | 2016-06-28 | 삼성전자주식회사 | 마이크로 렌즈, 상기 마이크로 렌즈 제조방법, 상기 마이크로 렌즈 제조 장치, 및 상기 마이크로 렌즈를 구비한카메라 모듈 |
NL1036360C2 (nl) * | 2008-12-23 | 2010-06-24 | Anteryon B V | Optische eenheid. |
TWM364865U (en) | 2009-05-07 | 2009-09-11 | E Pin Optical Industry Co Ltd | Miniature stacked glass lens module |
KR20100130423A (ko) * | 2009-06-03 | 2010-12-13 | 삼성전자주식회사 | 웨이퍼-레벨 렌즈 모듈 및 이를 구비하는 촬상 모듈 |
KR101648540B1 (ko) | 2009-08-13 | 2016-08-16 | 삼성전자주식회사 | 웨이퍼-레벨 렌즈 모듈 및 이를 구비하는 촬상 장치 |
US9419032B2 (en) | 2009-08-14 | 2016-08-16 | Nanchang O-Film Optoelectronics Technology Ltd | Wafer level camera module with molded housing and method of manufacturing |
TW201109165A (en) | 2009-09-11 | 2011-03-16 | E Pin Optical Industry Co Ltd | Stacked disk-shaped optical lens array, stacked disk-shaped lens module array and the method of manufacturing thereof |
US8305699B2 (en) | 2009-09-23 | 2012-11-06 | Samsung Electronics Co., Ltd. | Wafer-level lens module with extended depth of field and imaging device including the wafer-level lens module |
JP2011085625A (ja) * | 2009-10-13 | 2011-04-28 | Toppan Printing Co Ltd | カメラモジュール及びその製造方法 |
JP5556140B2 (ja) * | 2009-11-20 | 2014-07-23 | 凸版印刷株式会社 | カメラモジュール及びその製造方法 |
KR20130093072A (ko) * | 2010-06-14 | 2013-08-21 | 헵타곤 마이크로 옵틱스 피티이. 리미티드 | 복수의 광학 장치를 제조하는 방법 |
NL2005164C2 (nl) | 2010-07-28 | 2012-01-31 | Anteryon Internat B V | Optische eenheid. |
FR2966936B1 (fr) | 2010-11-02 | 2012-12-07 | Commissariat Energie Atomique | Systeme optique de formation d'image sur une surface spherique concave |
CN102478695B (zh) * | 2010-11-25 | 2016-05-11 | 鸿富锦精密工业(深圳)有限公司 | 镜头模组阵列、制造方法及镜头 |
US9910239B2 (en) * | 2010-11-30 | 2018-03-06 | Flir Systems Trading Belgium Bvba | Wafer level optical elements and applications thereof |
KR101262470B1 (ko) * | 2011-01-31 | 2013-05-08 | 엘지이노텍 주식회사 | 렌즈 어셈블리 및 카메라 모듈 |
NL2006373C2 (nl) | 2011-03-11 | 2012-09-17 | Anteryon Internat B V | Optische eenheid. |
US8345360B2 (en) * | 2011-06-03 | 2013-01-01 | Visera Technologies Company Limited | Camera unit and macro lens thereof |
JPWO2012173252A1 (ja) * | 2011-06-17 | 2015-02-23 | コニカミノルタ株式会社 | ウェハーレンズの製造方法及びウェハーレンズ、並びにレンズユニットの製造方法及びレンズユニット |
JP2013007969A (ja) * | 2011-06-27 | 2013-01-10 | Sharp Corp | 撮像レンズ、レンズアレイ、撮像レンズの製造方法、および撮像モジュール |
US20130122247A1 (en) * | 2011-11-10 | 2013-05-16 | Omnivision Technologies, Inc. | Spacer Wafer For Wafer-Level Camera And Method For Manufacturing Same |
JP5469235B2 (ja) * | 2012-12-20 | 2014-04-16 | オリンパス株式会社 | レンズモジュールの製造方法 |
CN106104804B (zh) * | 2014-02-18 | 2019-07-12 | 赫普塔冈微光有限公司 | 包括用于焦距调整和/或倾斜减少的可定制间隔物的光学模块 |
WO2015151697A1 (ja) * | 2014-04-04 | 2015-10-08 | シャープ株式会社 | レンズ素子、撮像装置、および撮像レンズ |
US20160307881A1 (en) * | 2015-04-20 | 2016-10-20 | Advanced Semiconductor Engineering, Inc. | Optical sensor module and method for manufacturing the same |
US9829698B2 (en) | 2015-08-31 | 2017-11-28 | Panasonic Corporation | Endoscope |
JP6744119B2 (ja) * | 2016-04-05 | 2020-08-19 | パナソニックi−PROセンシングソリューションズ株式会社 | 内視鏡 |
US9778443B2 (en) | 2015-10-05 | 2017-10-03 | Omnivision Technologies, Inc. | Three-surface wide field-of-view lens system |
KR101701060B1 (ko) * | 2015-11-03 | 2017-01-31 | 삼성전기주식회사 | 카메라 모듈 |
US10677964B2 (en) | 2017-10-23 | 2020-06-09 | Omnivision Technologies, Inc. | Lens wafer assembly and associated method for manufacturing a stepped spacer wafer |
WO2019193529A1 (en) * | 2018-04-06 | 2019-10-10 | Amo Wavefront Sciences, Llc | Methods and systems for corneal topography with in-focus scleral imaging |
KR102555577B1 (ko) * | 2019-01-28 | 2023-07-18 | 삼성전자주식회사 | 카메라 모듈을 포함하는 전자 장치 |
Citations (4)
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EP1067779A2 (de) | 1999-06-30 | 2001-01-10 | Canon Kabushiki Kaisha | Bildaufnahmevorrichtung |
US20020122124A1 (en) | 2000-10-25 | 2002-09-05 | Yasuo Suda | Image sensing apparatus and its control method, control program, and storage medium |
EP1244151A2 (de) | 2001-03-21 | 2002-09-25 | Canon Kabushiki Kaisha | Halbleiterbauelement und Herstellungsverfahren |
US20020176148A1 (en) | 2000-03-03 | 2002-11-28 | Ichiro Onuki | Optical apparatus |
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AU2001253547A1 (en) * | 2000-05-23 | 2001-12-03 | Atmel Corporation | Integrated ic chip package for electronic image sensor die |
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- 2007-07-17 WO PCT/US2007/016156 patent/WO2008011003A2/en active Application Filing
- 2007-07-17 EP EP07796897A patent/EP2044629A4/de not_active Withdrawn
- 2007-07-17 CN CN2007800336275A patent/CN101512768B/zh not_active Expired - Fee Related
- 2007-07-17 JP JP2009520799A patent/JP5292291B2/ja not_active Expired - Fee Related
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2013
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Also Published As
Publication number | Publication date |
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JP5372280B2 (ja) | 2013-12-18 |
CN101512768A (zh) | 2009-08-19 |
WO2008011003A3 (en) | 2008-06-26 |
EP2044629A2 (de) | 2009-04-08 |
KR20090034981A (ko) | 2009-04-08 |
JP2009544226A (ja) | 2009-12-10 |
EP2044629A4 (de) | 2012-08-01 |
JP2013153537A (ja) | 2013-08-08 |
WO2008011003A2 (en) | 2008-01-24 |
CN101512768B (zh) | 2012-11-21 |
JP5292291B2 (ja) | 2013-09-18 |
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