EP2044629A4 - Kamerasystem und zugehörige verfahren - Google Patents
Kamerasystem und zugehörige verfahrenInfo
- Publication number
- EP2044629A4 EP2044629A4 EP07796897A EP07796897A EP2044629A4 EP 2044629 A4 EP2044629 A4 EP 2044629A4 EP 07796897 A EP07796897 A EP 07796897A EP 07796897 A EP07796897 A EP 07796897A EP 2044629 A4 EP2044629 A4 EP 2044629A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- camera system
- associated methods
- methods
- camera
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
- G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
- G02B13/003—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having two lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
- G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
- G02B13/0035—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having three lenses
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0055—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element
- G02B13/006—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element at least one element being a compound optical element, e.g. cemented elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B13/00—Optical objectives specially designed for the purposes specified below
- G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
- G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
- Lens Barrels (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Cameras In General (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/487,580 US8049806B2 (en) | 2004-09-27 | 2006-07-17 | Thin camera and associated methods |
US85536506P | 2006-10-31 | 2006-10-31 | |
PCT/US2007/016156 WO2008011003A2 (en) | 2006-07-17 | 2007-07-17 | Camera system and associated methods |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2044629A2 EP2044629A2 (de) | 2009-04-08 |
EP2044629A4 true EP2044629A4 (de) | 2012-08-01 |
Family
ID=38957311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP07796897A Withdrawn EP2044629A4 (de) | 2006-07-17 | 2007-07-17 | Kamerasystem und zugehörige verfahren |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2044629A4 (de) |
JP (2) | JP5292291B2 (de) |
KR (1) | KR101185881B1 (de) |
CN (1) | CN101512768B (de) |
WO (1) | WO2008011003A2 (de) |
Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080118241A1 (en) * | 2006-11-16 | 2008-05-22 | Tekolste Robert | Control of stray light in camera systems employing an optics stack and associated methods |
WO2008102773A1 (ja) | 2007-02-19 | 2008-08-28 | Konica Minolta Opto, Inc. | 撮像レンズ、撮像装置、携帯端末、および撮像レンズの製造方法 |
JP5212354B2 (ja) * | 2007-02-19 | 2013-06-19 | コニカミノルタアドバンストレイヤー株式会社 | 撮像レンズ、撮像装置、携帯端末、および撮像レンズの製造方法 |
KR20090115711A (ko) * | 2007-02-19 | 2009-11-05 | 코니카 미놀타 옵토 인코포레이티드 | 촬상 렌즈, 촬상 장치 및 휴대 단말기 |
KR20100025551A (ko) | 2007-07-04 | 2010-03-09 | 코니카 미놀타 옵토 인코포레이티드 | 촬상 렌즈, 촬상 장치 및 휴대 단말기 |
US20110031510A1 (en) * | 2007-11-27 | 2011-02-10 | Heptagon Oy | Encapsulated lens stack |
TW200937642A (en) | 2007-12-19 | 2009-09-01 | Heptagon Oy | Wafer stack, integrated optical device and method for fabricating the same |
CN101952761B (zh) | 2008-02-20 | 2012-12-19 | 柯尼卡美能达精密光学株式会社 | 摄像透镜、摄像装置、便携终端及摄像透镜的制造方法 |
US9118825B2 (en) | 2008-02-22 | 2015-08-25 | Nan Chang O-Film Optoelectronics Technology Ltd. | Attachment of wafer level optics |
US8194323B2 (en) * | 2008-04-28 | 2012-06-05 | Konica Minolta Opto, Inc. | Method for producing wafer lens assembly and method for producing wafer lens |
WO2009137022A1 (en) * | 2008-05-06 | 2009-11-12 | Tessera North America, Inc. | Camera system including radiation shield and method of shielding radiation |
FR2931587B1 (fr) * | 2008-05-21 | 2011-05-13 | Commissariat Energie Atomique | Procede de realisation d'un dispositif optique a composants optoelectroniques integres |
US20090321861A1 (en) * | 2008-06-26 | 2009-12-31 | Micron Technology, Inc. | Microelectronic imagers with stacked lens assemblies and processes for wafer-level packaging of microelectronic imagers |
JP5094802B2 (ja) * | 2008-09-26 | 2012-12-12 | シャープ株式会社 | 光学素子ウエハの製造方法 |
KR101634353B1 (ko) | 2008-12-04 | 2016-06-28 | 삼성전자주식회사 | 마이크로 렌즈, 상기 마이크로 렌즈 제조방법, 상기 마이크로 렌즈 제조 장치, 및 상기 마이크로 렌즈를 구비한카메라 모듈 |
NL1036360C2 (nl) * | 2008-12-23 | 2010-06-24 | Anteryon B V | Optische eenheid. |
TWM364865U (en) | 2009-05-07 | 2009-09-11 | E Pin Optical Industry Co Ltd | Miniature stacked glass lens module |
KR20100130423A (ko) * | 2009-06-03 | 2010-12-13 | 삼성전자주식회사 | 웨이퍼-레벨 렌즈 모듈 및 이를 구비하는 촬상 모듈 |
KR101648540B1 (ko) | 2009-08-13 | 2016-08-16 | 삼성전자주식회사 | 웨이퍼-레벨 렌즈 모듈 및 이를 구비하는 촬상 장치 |
US9419032B2 (en) | 2009-08-14 | 2016-08-16 | Nanchang O-Film Optoelectronics Technology Ltd | Wafer level camera module with molded housing and method of manufacturing |
TW201109165A (en) | 2009-09-11 | 2011-03-16 | E Pin Optical Industry Co Ltd | Stacked disk-shaped optical lens array, stacked disk-shaped lens module array and the method of manufacturing thereof |
US8305699B2 (en) | 2009-09-23 | 2012-11-06 | Samsung Electronics Co., Ltd. | Wafer-level lens module with extended depth of field and imaging device including the wafer-level lens module |
JP2011085625A (ja) * | 2009-10-13 | 2011-04-28 | Toppan Printing Co Ltd | カメラモジュール及びその製造方法 |
JP5556140B2 (ja) * | 2009-11-20 | 2014-07-23 | 凸版印刷株式会社 | カメラモジュール及びその製造方法 |
US20130162882A1 (en) * | 2010-06-14 | 2013-06-27 | Heptagon Oy | Method of Manufacturing Plurality of Optical Devices |
NL2005164C2 (nl) | 2010-07-28 | 2012-01-31 | Anteryon Internat B V | Optische eenheid. |
FR2966936B1 (fr) | 2010-11-02 | 2012-12-07 | Commissariat Energie Atomique | Systeme optique de formation d'image sur une surface spherique concave |
CN102478695B (zh) * | 2010-11-25 | 2016-05-11 | 鸿富锦精密工业(深圳)有限公司 | 镜头模组阵列、制造方法及镜头 |
US9910239B2 (en) | 2010-11-30 | 2018-03-06 | Flir Systems Trading Belgium Bvba | Wafer level optical elements and applications thereof |
KR101262470B1 (ko) * | 2011-01-31 | 2013-05-08 | 엘지이노텍 주식회사 | 렌즈 어셈블리 및 카메라 모듈 |
NL2006373C2 (nl) | 2011-03-11 | 2012-09-17 | Anteryon Internat B V | Optische eenheid. |
US8345360B2 (en) * | 2011-06-03 | 2013-01-01 | Visera Technologies Company Limited | Camera unit and macro lens thereof |
JPWO2012173252A1 (ja) * | 2011-06-17 | 2015-02-23 | コニカミノルタ株式会社 | ウェハーレンズの製造方法及びウェハーレンズ、並びにレンズユニットの製造方法及びレンズユニット |
JP2013007969A (ja) * | 2011-06-27 | 2013-01-10 | Sharp Corp | 撮像レンズ、レンズアレイ、撮像レンズの製造方法、および撮像モジュール |
US20130122247A1 (en) | 2011-11-10 | 2013-05-16 | Omnivision Technologies, Inc. | Spacer Wafer For Wafer-Level Camera And Method For Manufacturing Same |
JP5469235B2 (ja) * | 2012-12-20 | 2014-04-16 | オリンパス株式会社 | レンズモジュールの製造方法 |
SG11201606706WA (en) * | 2014-02-18 | 2016-09-29 | Heptagon Micro Optics Pte Ltd | Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules |
CN106164731B (zh) * | 2014-04-04 | 2019-08-20 | 夏普株式会社 | 透镜元件和摄像装置 |
US20160307881A1 (en) * | 2015-04-20 | 2016-10-20 | Advanced Semiconductor Engineering, Inc. | Optical sensor module and method for manufacturing the same |
US9829698B2 (en) | 2015-08-31 | 2017-11-28 | Panasonic Corporation | Endoscope |
JP6744119B2 (ja) * | 2016-04-05 | 2020-08-19 | パナソニックi−PROセンシングソリューションズ株式会社 | 内視鏡 |
US9778443B2 (en) | 2015-10-05 | 2017-10-03 | Omnivision Technologies, Inc. | Three-surface wide field-of-view lens system |
KR101701060B1 (ko) * | 2015-11-03 | 2017-01-31 | 삼성전기주식회사 | 카메라 모듈 |
US10677964B2 (en) | 2017-10-23 | 2020-06-09 | Omnivision Technologies, Inc. | Lens wafer assembly and associated method for manufacturing a stepped spacer wafer |
US11311187B2 (en) | 2018-04-06 | 2022-04-26 | Amo Development, Llc | Methods and systems for corneal topography with in-focus scleral imaging |
KR102555577B1 (ko) * | 2019-01-28 | 2023-07-18 | 삼성전자주식회사 | 카메라 모듈을 포함하는 전자 장치 |
Citations (6)
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WO2001091193A2 (en) * | 2000-05-23 | 2001-11-29 | Atmel Corporation | Integrated ic chip package for electronic image sensor die |
EP1239519A2 (de) * | 2001-03-05 | 2002-09-11 | Canon Kabushiki Kaisha | Bildaufnahmemodul und Bildaufnahmevorrichtung |
US20040047274A1 (en) * | 2002-06-27 | 2004-03-11 | Olumpus Optical Co., Ltd. | Image pickup lens unit and image pickup device |
WO2004027880A2 (en) * | 2002-09-17 | 2004-04-01 | Koninklijke Philips Electronics N.V. | Camera device, method of manufacturing a camera device, wafer scale package |
US20050285016A1 (en) * | 2004-06-29 | 2005-12-29 | Yung-Cheol Kong | Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure |
US20060043262A1 (en) * | 2004-08-30 | 2006-03-02 | Micron Technology, Inc. | Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers |
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US6859229B1 (en) | 1999-06-30 | 2005-02-22 | Canon Kabushiki Kaisha | Image pickup apparatus |
US6806988B2 (en) | 2000-03-03 | 2004-10-19 | Canon Kabushiki Kaisha | Optical apparatus |
US7262799B2 (en) | 2000-10-25 | 2007-08-28 | Canon Kabushiki Kaisha | Image sensing apparatus and its control method, control program, and storage medium |
US6635941B2 (en) | 2001-03-21 | 2003-10-21 | Canon Kabushiki Kaisha | Structure of semiconductor device with improved reliability |
JP4506083B2 (ja) * | 2002-03-25 | 2010-07-21 | コニカミノルタホールディングス株式会社 | 撮像レンズ,これを備える撮像装置、撮像ユニット及び撮像ユニットを備える携帯端末 |
JP4030048B2 (ja) * | 2002-03-28 | 2008-01-09 | シチズン電子株式会社 | 小型撮像モジュール |
JP2005198103A (ja) * | 2004-01-08 | 2005-07-21 | Inter Action Corp | カメラモジュールの組立装置および組立方法 |
JP2007528506A (ja) * | 2004-02-06 | 2007-10-11 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | カメラ装置、カメラ装置を有する携帯電話、カメラ装置の製造方法 |
JP2006080597A (ja) * | 2004-09-07 | 2006-03-23 | Canon Inc | 撮像モジュール及び撮像モジュールの製造方法 |
JP2006081043A (ja) * | 2004-09-13 | 2006-03-23 | Seiko Precision Inc | 固体撮像装置およびこれを備えた電子機器 |
JP2008035047A (ja) * | 2006-07-27 | 2008-02-14 | Matsushita Electric Ind Co Ltd | カメラ部品およびカメラと、カメラ部品の製造方法 |
-
2007
- 2007-07-17 JP JP2009520799A patent/JP5292291B2/ja not_active Expired - Fee Related
- 2007-07-17 WO PCT/US2007/016156 patent/WO2008011003A2/en active Application Filing
- 2007-07-17 EP EP07796897A patent/EP2044629A4/de not_active Withdrawn
- 2007-07-17 KR KR1020097003164A patent/KR101185881B1/ko not_active IP Right Cessation
- 2007-07-17 CN CN2007800336275A patent/CN101512768B/zh not_active Expired - Fee Related
-
2013
- 2013-04-18 JP JP2013087770A patent/JP5372280B2/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001091193A2 (en) * | 2000-05-23 | 2001-11-29 | Atmel Corporation | Integrated ic chip package for electronic image sensor die |
EP1239519A2 (de) * | 2001-03-05 | 2002-09-11 | Canon Kabushiki Kaisha | Bildaufnahmemodul und Bildaufnahmevorrichtung |
US20040047274A1 (en) * | 2002-06-27 | 2004-03-11 | Olumpus Optical Co., Ltd. | Image pickup lens unit and image pickup device |
WO2004027880A2 (en) * | 2002-09-17 | 2004-04-01 | Koninklijke Philips Electronics N.V. | Camera device, method of manufacturing a camera device, wafer scale package |
US20050285016A1 (en) * | 2004-06-29 | 2005-12-29 | Yung-Cheol Kong | Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure |
US20060043262A1 (en) * | 2004-08-30 | 2006-03-02 | Micron Technology, Inc. | Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers |
Non-Patent Citations (1)
Title |
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See also references of WO2008011003A2 * |
Also Published As
Publication number | Publication date |
---|---|
EP2044629A2 (de) | 2009-04-08 |
WO2008011003A2 (en) | 2008-01-24 |
CN101512768B (zh) | 2012-11-21 |
KR20090034981A (ko) | 2009-04-08 |
JP5372280B2 (ja) | 2013-12-18 |
WO2008011003A3 (en) | 2008-06-26 |
JP2013153537A (ja) | 2013-08-08 |
JP5292291B2 (ja) | 2013-09-18 |
KR101185881B1 (ko) | 2012-09-25 |
JP2009544226A (ja) | 2009-12-10 |
CN101512768A (zh) | 2009-08-19 |
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