KR101183730B1 - 반도체 장치용 필름 및 반도체 장치 - Google Patents

반도체 장치용 필름 및 반도체 장치 Download PDF

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Publication number
KR101183730B1
KR101183730B1 KR1020117027459A KR20117027459A KR101183730B1 KR 101183730 B1 KR101183730 B1 KR 101183730B1 KR 1020117027459 A KR1020117027459 A KR 1020117027459A KR 20117027459 A KR20117027459 A KR 20117027459A KR 101183730 B1 KR101183730 B1 KR 101183730B1
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KR
South Korea
Prior art keywords
film
adhesive
dicing
adhesive film
degreec
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Application number
KR1020117027459A
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English (en)
Korean (ko)
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KR20120034620A (ko
Inventor
야스히로 아마노
유따 기무라
Original Assignee
닛토덴코 가부시키가이샤
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Publication of KR20120034620A publication Critical patent/KR20120034620A/ko
Application granted granted Critical
Publication of KR101183730B1 publication Critical patent/KR101183730B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
  • Laminated Bodies (AREA)
KR1020117027459A 2010-09-06 2011-08-29 반도체 장치용 필름 및 반도체 장치 KR101183730B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2010-199027 2010-09-06
JP2010199027A JP4976532B2 (ja) 2010-09-06 2010-09-06 半導体装置用フィルム
PCT/JP2011/069468 WO2012032958A1 (ja) 2010-09-06 2011-08-29 半導体装置用フィルム、及び、半導体装置

Publications (2)

Publication Number Publication Date
KR20120034620A KR20120034620A (ko) 2012-04-12
KR101183730B1 true KR101183730B1 (ko) 2012-09-17

Family

ID=45810560

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117027459A KR101183730B1 (ko) 2010-09-06 2011-08-29 반도체 장치용 필름 및 반도체 장치

Country Status (5)

Country Link
JP (1) JP4976532B2 (zh)
KR (1) KR101183730B1 (zh)
CN (1) CN103081069B (zh)
TW (1) TWI456645B (zh)
WO (1) WO2012032958A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5997506B2 (ja) * 2012-05-31 2016-09-28 リンテック株式会社 ダイシング・ダイボンディングシート
JP6101492B2 (ja) * 2013-01-10 2017-03-22 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
JP2015129226A (ja) * 2014-01-08 2015-07-16 日東電工株式会社 フィルム状接着剤、フィルム状接着剤付きダイシングテープ、半導体装置の製造方法、及び半導体装置
JP2015199814A (ja) * 2014-04-08 2015-11-12 住友ベークライト株式会社 樹脂組成物、接着フィルム、接着シート、ダイシングテープ一体型接着シート、バックグラインドテープ一体型接着シート、ダイシングテープ兼バックグラインドテープ一体型接着シート、および、電子装置
JP2016111158A (ja) * 2014-12-04 2016-06-20 古河電気工業株式会社 ウェハ加工用テープ
JP2016111156A (ja) * 2014-12-04 2016-06-20 古河電気工業株式会社 ウェハ加工用テープ
JP6406999B2 (ja) * 2014-12-04 2018-10-17 古河電気工業株式会社 ウェハ加工用テープ
JP6382088B2 (ja) * 2014-12-04 2018-08-29 古河電気工業株式会社 ウェハ加工用テープ
JP6445315B2 (ja) * 2014-12-12 2018-12-26 日東電工株式会社 ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP6721398B2 (ja) * 2016-04-22 2020-07-15 日東電工株式会社 ダイシングダイボンディングフィルム、ダイシングダイボンディングテープおよび半導体装置の製造方法
JP6295304B1 (ja) * 2016-10-03 2018-03-14 日東電工株式会社 ダイシングテープ一体型接着シート
JP6961387B2 (ja) * 2017-05-19 2021-11-05 日東電工株式会社 ダイシングダイボンドフィルム
JP7046585B2 (ja) * 2017-12-14 2022-04-04 日東電工株式会社 接着フィルムおよびダイシングテープ付き接着フィルム
JP2018148218A (ja) * 2018-04-18 2018-09-20 日東電工株式会社 半導体装置用フィルム、及び、半導体装置の製造方法
US20220293555A1 (en) * 2019-08-26 2022-09-15 Lintec Corporation Method of manufacturing laminate
KR20220159341A (ko) 2020-03-27 2022-12-02 린텍 가부시키가이샤 반도체 장치 제조용 시트, 반도체 장치 제조용 시트의 제조 방법, 및 필름형 접착제가 형성된 반도체 칩의 제조 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010067771A (ja) 2008-09-10 2010-03-25 Sekisui Chem Co Ltd ダイシング−ダイボンディングテープ及び半導体チップの製造方法
JP2010135400A (ja) * 2008-12-02 2010-06-17 Nitto Denko Corp 半導体装置製造用フィルム及びその製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6235387B1 (en) * 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
JP4393934B2 (ja) * 2004-06-23 2010-01-06 リンテック株式会社 半導体加工用粘着シート
CN101772831B (zh) * 2007-07-19 2011-12-21 积水化学工业株式会社 切割和芯片接合用带以及半导体芯片的制造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010067771A (ja) 2008-09-10 2010-03-25 Sekisui Chem Co Ltd ダイシング−ダイボンディングテープ及び半導体チップの製造方法
JP2010135400A (ja) * 2008-12-02 2010-06-17 Nitto Denko Corp 半導体装置製造用フィルム及びその製造方法

Also Published As

Publication number Publication date
WO2012032958A1 (ja) 2012-03-15
TWI456645B (zh) 2014-10-11
JP4976532B2 (ja) 2012-07-18
CN103081069B (zh) 2015-11-25
CN103081069A (zh) 2013-05-01
TW201216343A (en) 2012-04-16
KR20120034620A (ko) 2012-04-12
JP2012059768A (ja) 2012-03-22

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