JP4976532B2 - 半導体装置用フィルム - Google Patents

半導体装置用フィルム Download PDF

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Publication number
JP4976532B2
JP4976532B2 JP2010199027A JP2010199027A JP4976532B2 JP 4976532 B2 JP4976532 B2 JP 4976532B2 JP 2010199027 A JP2010199027 A JP 2010199027A JP 2010199027 A JP2010199027 A JP 2010199027A JP 4976532 B2 JP4976532 B2 JP 4976532B2
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JP
Japan
Prior art keywords
film
adhesive
dicing
adhesive film
pressure
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Active
Application number
JP2010199027A
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English (en)
Japanese (ja)
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JP2012059768A (ja
Inventor
康弘 天野
雄大 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2010199027A priority Critical patent/JP4976532B2/ja
Priority to PCT/JP2011/069468 priority patent/WO2012032958A1/ja
Priority to KR1020117027459A priority patent/KR101183730B1/ko
Priority to CN201180042800.4A priority patent/CN103081069B/zh
Priority to TW100131942A priority patent/TWI456645B/zh
Publication of JP2012059768A publication Critical patent/JP2012059768A/ja
Application granted granted Critical
Publication of JP4976532B2 publication Critical patent/JP4976532B2/ja
Active legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
  • Laminated Bodies (AREA)
JP2010199027A 2010-09-06 2010-09-06 半導体装置用フィルム Active JP4976532B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2010199027A JP4976532B2 (ja) 2010-09-06 2010-09-06 半導体装置用フィルム
PCT/JP2011/069468 WO2012032958A1 (ja) 2010-09-06 2011-08-29 半導体装置用フィルム、及び、半導体装置
KR1020117027459A KR101183730B1 (ko) 2010-09-06 2011-08-29 반도체 장치용 필름 및 반도체 장치
CN201180042800.4A CN103081069B (zh) 2010-09-06 2011-08-29 半导体装置用薄膜以及半导体装置
TW100131942A TWI456645B (zh) 2010-09-06 2011-09-05 半導體裝置用膜以及半導體裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010199027A JP4976532B2 (ja) 2010-09-06 2010-09-06 半導体装置用フィルム

Publications (2)

Publication Number Publication Date
JP2012059768A JP2012059768A (ja) 2012-03-22
JP4976532B2 true JP4976532B2 (ja) 2012-07-18

Family

ID=45810560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010199027A Active JP4976532B2 (ja) 2010-09-06 2010-09-06 半導体装置用フィルム

Country Status (5)

Country Link
JP (1) JP4976532B2 (zh)
KR (1) KR101183730B1 (zh)
CN (1) CN103081069B (zh)
TW (1) TWI456645B (zh)
WO (1) WO2012032958A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5997506B2 (ja) * 2012-05-31 2016-09-28 リンテック株式会社 ダイシング・ダイボンディングシート
JP6101492B2 (ja) * 2013-01-10 2017-03-22 日東電工株式会社 接着フィルム、ダイシング・ダイボンドフィルム、半導体装置の製造方法及び半導体装置
JP2015129226A (ja) * 2014-01-08 2015-07-16 日東電工株式会社 フィルム状接着剤、フィルム状接着剤付きダイシングテープ、半導体装置の製造方法、及び半導体装置
JP2015199814A (ja) * 2014-04-08 2015-11-12 住友ベークライト株式会社 樹脂組成物、接着フィルム、接着シート、ダイシングテープ一体型接着シート、バックグラインドテープ一体型接着シート、ダイシングテープ兼バックグラインドテープ一体型接着シート、および、電子装置
JP2016111158A (ja) * 2014-12-04 2016-06-20 古河電気工業株式会社 ウェハ加工用テープ
JP2016111156A (ja) * 2014-12-04 2016-06-20 古河電気工業株式会社 ウェハ加工用テープ
JP6406999B2 (ja) * 2014-12-04 2018-10-17 古河電気工業株式会社 ウェハ加工用テープ
JP6382088B2 (ja) * 2014-12-04 2018-08-29 古河電気工業株式会社 ウェハ加工用テープ
JP6445315B2 (ja) * 2014-12-12 2018-12-26 日東電工株式会社 ダイシングシート、ダイシング・ダイボンドフィルム及び半導体装置の製造方法
JP6721398B2 (ja) * 2016-04-22 2020-07-15 日東電工株式会社 ダイシングダイボンディングフィルム、ダイシングダイボンディングテープおよび半導体装置の製造方法
JP6295304B1 (ja) * 2016-10-03 2018-03-14 日東電工株式会社 ダイシングテープ一体型接着シート
JP6961387B2 (ja) * 2017-05-19 2021-11-05 日東電工株式会社 ダイシングダイボンドフィルム
JP7046585B2 (ja) * 2017-12-14 2022-04-04 日東電工株式会社 接着フィルムおよびダイシングテープ付き接着フィルム
JP2018148218A (ja) * 2018-04-18 2018-09-20 日東電工株式会社 半導体装置用フィルム、及び、半導体装置の製造方法
US20220293555A1 (en) * 2019-08-26 2022-09-15 Lintec Corporation Method of manufacturing laminate
KR20220159341A (ko) 2020-03-27 2022-12-02 린텍 가부시키가이샤 반도체 장치 제조용 시트, 반도체 장치 제조용 시트의 제조 방법, 및 필름형 접착제가 형성된 반도체 칩의 제조 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6235387B1 (en) * 1998-03-30 2001-05-22 3M Innovative Properties Company Semiconductor wafer processing tapes
JP4393934B2 (ja) * 2004-06-23 2010-01-06 リンテック株式会社 半導体加工用粘着シート
CN101772831B (zh) * 2007-07-19 2011-12-21 积水化学工业株式会社 切割和芯片接合用带以及半导体芯片的制造方法
JP5319993B2 (ja) 2008-09-10 2013-10-16 積水化学工業株式会社 ダイシング−ダイボンディングテープ及び半導体チップの製造方法
JP4602450B2 (ja) * 2008-12-02 2010-12-22 日東電工株式会社 半導体装置製造用フィルム及びその製造方法

Also Published As

Publication number Publication date
WO2012032958A1 (ja) 2012-03-15
TWI456645B (zh) 2014-10-11
CN103081069B (zh) 2015-11-25
CN103081069A (zh) 2013-05-01
KR101183730B1 (ko) 2012-09-17
TW201216343A (en) 2012-04-16
KR20120034620A (ko) 2012-04-12
JP2012059768A (ja) 2012-03-22

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