KR101168881B1 - 기능성 영역의 이설방법, ｌｅｄ 어레이, ｌｅｄ 프린터 헤드, 및 ｌｅｄ 프린터 - Google Patents

기능성 영역의 이설방법, ｌｅｄ 어레이, ｌｅｄ 프린터 헤드, 및 ｌｅｄ 프린터 Download PDF

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KR101168881B1
KR101168881B1 KR1020090104803A KR20090104803A KR101168881B1 KR 101168881 B1 KR101168881 B1 KR 101168881B1 KR 1020090104803 A KR1020090104803 A KR 1020090104803A KR 20090104803 A KR20090104803 A KR 20090104803A KR 101168881 B1 KR101168881 B1 KR 101168881B1
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substrate
layer
functional region
region
functional
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KR20100050410A (ko
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타카오 요네하라
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캐논 가부시끼가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
KR1020090104803A 2008-11-04 2009-11-02 기능성 영역의 이설방법, ｌｅｄ 어레이, ｌｅｄ 프린터 헤드, 및 ｌｅｄ 프린터 Expired - Fee Related KR101168881B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-282681 2008-11-04
JP2008282681A JP2010114106A (ja) 2008-11-04 2008-11-04 機能性領域の移設方法、ｌｅｄアレイ、ｌｅｄプリンタヘッド、及びｌｅｄプリンタ

Publications (2)

Publication Number Publication Date
KR20100050410A KR20100050410A (ko) 2010-05-13
KR101168881B1 true KR101168881B1 (ko) 2012-07-30

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KR1020090104803A Expired - Fee Related KR101168881B1 (ko) 2008-11-04 2009-11-02 기능성 영역의 이설방법, ｌｅｄ 어레이, ｌｅｄ 프린터 헤드, 및 ｌｅｄ 프린터

Country Status (5)

Country Link
US (1) US7943488B2 (https=)
EP (1) EP2182554A2 (https=)
JP (1) JP2010114106A (https=)
KR (1) KR101168881B1 (https=)
CN (1) CN101740494B (https=)

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JP5590837B2 (ja) * 2009-09-15 2014-09-17 キヤノン株式会社 機能性領域の移設方法
JP2012043946A (ja) * 2010-08-18 2012-03-01 Toyohashi Univ Of Technology 光電子半導体装置及びその製造方法
CN102956757A (zh) * 2011-08-19 2013-03-06 展晶科技(深圳)有限公司 发光二极管封装结构的制造方法
US20130056749A1 (en) * 2011-09-07 2013-03-07 Michael Tischler Broad-area lighting systems
CN102496667B (zh) * 2011-12-20 2014-05-07 中国科学院半导体研究所 GaN基薄膜芯片的制造方法
US8907362B2 (en) 2012-01-24 2014-12-09 Cooledge Lighting Inc. Light-emitting dies incorporating wavelength-conversion materials and related methods
US20130187540A1 (en) 2012-01-24 2013-07-25 Michael A. Tischler Discrete phosphor chips for light-emitting devices and related methods
US8896010B2 (en) 2012-01-24 2014-11-25 Cooledge Lighting Inc. Wafer-level flip chip device packages and related methods
CN108447855B (zh) * 2012-11-12 2020-11-24 晶元光电股份有限公司 半导体光电元件的制作方法
KR101763675B1 (ko) 2013-07-05 2017-08-14 에피스타 코포레이션 발광소자 및 그 제조방법
WO2015119858A1 (en) 2014-02-05 2015-08-13 Cooledge Lighting Inc. Light-emitting dies incorporating wavelength-conversion materials and related methods
CN113380928B (zh) * 2014-10-22 2024-07-12 波主有限公司 半导体装置的制造方法
JP2019071323A (ja) * 2017-10-06 2019-05-09 鼎元光電科技股▲ふん▼有限公司 基板がない発光ダイオード及びその製造方法
CN108962789A (zh) * 2018-06-25 2018-12-07 开发晶照明（厦门）有限公司 微器件转移方法和微器件转移设备
US11217471B2 (en) * 2019-03-06 2022-01-04 Rohinni, LLC Multi-axis movement for transfer of semiconductor devices
CN110337237A (zh) * 2019-04-23 2019-10-15 深圳市丰泰工业科技有限公司 用紫外激光器让uv胶失去粘性的方法
JP7457255B2 (ja) * 2019-05-08 2024-03-28 日亜化学工業株式会社 画像表示装置の製造方法および画像表示装置
JP2024081307A (ja) * 2022-12-06 2024-06-18 キヤノン株式会社 積層基板、液体吐出ヘッドおよび積層基板の製造方法
CN116387226A (zh) * 2023-03-29 2023-07-04 香港科技大学(广州) 转移基板及其制备方法、显示装置及发光元件的转移方法

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JP2005012034A (ja) 2003-06-20 2005-01-13 Oki Data Corp 半導体薄膜の製造方法及び半導体装置の製造方法

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EP1758169A3 (en) * 1996-08-27 2007-05-23 Seiko Epson Corporation Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same
JP3116085B2 (ja) * 1997-09-16 2000-12-11 東京農工大学長 半導体素子形成法
JP2003174041A (ja) 2001-12-06 2003-06-20 Seiko Epson Corp 素子の実装方法、電子機器、フラットパネルディスプレイ、システムインパッケージ型ｉｃおよびオプティカルエレクトリカルｉｃ
US8049947B2 (en) * 2002-06-10 2011-11-01 E Ink Corporation Components and methods for use in electro-optic displays
TWI328837B (en) * 2003-02-28 2010-08-11 Semiconductor Energy Lab Semiconductor device and method of manufacturing the same
JP4370796B2 (ja) 2003-04-08 2009-11-25 セイコーエプソン株式会社 半導体装置、半導体装置の製造方法及び電子機器
US6913985B2 (en) 2003-06-20 2005-07-05 Oki Data Corporation Method of manufacturing a semiconductor device
JP4554180B2 (ja) * 2003-09-17 2010-09-29 ソニー株式会社 薄膜半導体デバイスの製造方法
JP2005108943A (ja) * 2003-09-29 2005-04-21 Oki Data Corp 半導体ウェハ及びこれを用いた半導体装置の製造方法
JP4672329B2 (ja) * 2003-10-22 2011-04-20 株式会社沖データ 半導体装置、及び、それを用いたｌｅｄプリントヘッド、画像形成装置、半導体装置の製造方法
US7282380B2 (en) * 2004-03-25 2007-10-16 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP4468107B2 (ja) 2004-08-09 2010-05-26 シャープ株式会社 半導体装置の製造方法、半導体装置及び半導体回路基板
US7523701B2 (en) * 2005-03-07 2009-04-28 Asml Netherlands B.V. Imprint lithography method and apparatus
JP5171016B2 (ja) * 2006-10-27 2013-03-27 キヤノン株式会社 半導体部材、半導体物品の製造方法、その製造方法を用いたｌｅｄアレイ

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Publication number Publication date
KR20100050410A (ko) 2010-05-13
CN101740494A (zh) 2010-06-16
EP2182554A2 (en) 2010-05-05
JP2010114106A (ja) 2010-05-20
CN101740494B (zh) 2012-08-01
US7943488B2 (en) 2011-05-17
US20100109023A1 (en) 2010-05-06

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