KR101136879B1 - 열 물리적 증착 소스 및 면적이 큰 기판을 피복하는 방법 - Google Patents

열 물리적 증착 소스 및 면적이 큰 기판을 피복하는 방법 Download PDF

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Publication number
KR101136879B1
KR101136879B1 KR1020067017022A KR20067017022A KR101136879B1 KR 101136879 B1 KR101136879 B1 KR 101136879B1 KR 1020067017022 A KR1020067017022 A KR 1020067017022A KR 20067017022 A KR20067017022 A KR 20067017022A KR 101136879 B1 KR101136879 B1 KR 101136879B1
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South Korea
Prior art keywords
deposition source
vessel
physical deposition
thermal physical
container
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Korean (ko)
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KR20060123578A (ko
Inventor
제레미 매튜 그레이스
데니스 레이 프리맨
저스틴 헤이거 클럭
네일 패트릭 레던
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글로벌 오엘이디 테크놀러지 엘엘씨
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020067017022A 2004-02-25 2005-02-11 열 물리적 증착 소스 및 면적이 큰 기판을 피복하는 방법 Expired - Lifetime KR101136879B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/786,859 2004-02-25
US10/786,859 US6893939B1 (en) 2004-02-25 2004-02-25 Thermal physical vapor deposition source with minimized internal condensation effects
PCT/US2005/004394 WO2005083145A2 (en) 2004-02-25 2005-02-11 Vapor deposition source with minimized condensation effects

Publications (2)

Publication Number Publication Date
KR20060123578A KR20060123578A (ko) 2006-12-01
KR101136879B1 true KR101136879B1 (ko) 2012-04-20

Family

ID=34574859

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067017022A Expired - Lifetime KR101136879B1 (ko) 2004-02-25 2005-02-11 열 물리적 증착 소스 및 면적이 큰 기판을 피복하는 방법

Country Status (6)

Country Link
US (1) US6893939B1 (enExample)
JP (1) JP4718538B2 (enExample)
KR (1) KR101136879B1 (enExample)
CN (1) CN1922339B (enExample)
TW (1) TWI394854B (enExample)
WO (1) WO2005083145A2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7364772B2 (en) * 2004-03-22 2008-04-29 Eastman Kodak Company Method for coating an organic layer onto a substrate in a vacuum chamber
KR101106289B1 (ko) * 2006-08-04 2012-01-18 순천향대학교 산학협력단 증착 공정을 위한 선형 증착 소스
US20080173241A1 (en) * 2006-12-19 2008-07-24 Scott Wayne Priddy Vapor deposition sources and methods
KR20110110187A (ko) * 2008-12-18 2011-10-06 비코 인스트루먼트 아이엔씨. 열확산 오리피스를 갖는 진공 증착원
KR20110138259A (ko) * 2009-03-25 2011-12-26 비코 인스트루먼츠 인코포레이티드 고증기압재료의 증착
US20110195187A1 (en) * 2010-02-10 2011-08-11 Apple Inc. Direct liquid vaporization for oleophobic coatings
US8715779B2 (en) 2011-06-24 2014-05-06 Apple Inc. Enhanced glass impact durability through application of thin films
JP2014189807A (ja) * 2013-03-26 2014-10-06 Canon Tokki Corp 蒸発源装置
CN104099570B (zh) * 2013-04-01 2016-10-05 上海和辉光电有限公司 单点线性蒸发源系统
KR102096049B1 (ko) * 2013-05-03 2020-04-02 삼성디스플레이 주식회사 증착장치, 이를 이용한 유기발광 디스플레이 장치 제조 방법 및 유기발광 디스플레이 장치
CN104213077A (zh) * 2013-05-30 2014-12-17 海洋王照明科技股份有限公司 一种用于有机电致发光器件的蒸发设备
EP3559306B1 (en) * 2016-12-22 2022-10-05 Flisom AG Linear source for vapor deposition with at least three electrical heating elements
JP7011521B2 (ja) * 2018-04-17 2022-01-26 株式会社アルバック 真空蒸着装置用の蒸着源

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0134280A1 (de) * 1983-08-29 1985-03-20 idn inventions and development of novelties ag Magazin für Tonaufzeichnungsträger
KR20030074317A (ko) * 2002-03-08 2003-09-19 이스트맨 코닥 캄파니 구조체 코팅 방법 및 기다란 열 물리적 증기 증착 소스
KR20040069281A (ko) * 2003-01-28 2004-08-05 이스트맨 코닥 캄파니 가열식 물리적 증착 시스템의 디자인 방법

Family Cites Families (16)

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US4356429A (en) 1980-07-17 1982-10-26 Eastman Kodak Company Organic electroluminescent cell
US4539507A (en) 1983-03-25 1985-09-03 Eastman Kodak Company Organic electroluminescent devices having improved power conversion efficiencies
US4720432A (en) 1987-02-11 1988-01-19 Eastman Kodak Company Electroluminescent device with organic luminescent medium
US4769292A (en) 1987-03-02 1988-09-06 Eastman Kodak Company Electroluminescent device with modified thin film luminescent zone
JPH07118839A (ja) * 1993-10-22 1995-05-09 Mitsubishi Heavy Ind Ltd 金属蒸気発生装置
US5550066A (en) 1994-12-14 1996-08-27 Eastman Kodak Company Method of fabricating a TFT-EL pixel
US5532102A (en) * 1995-03-30 1996-07-02 Xerox Corporation Apparatus and process for preparation of migration imaging members
US6337102B1 (en) 1997-11-17 2002-01-08 The Trustees Of Princeton University Low pressure vapor phase deposition of organic thin films
US6037241A (en) * 1998-02-19 2000-03-14 First Solar, Llc Apparatus and method for depositing a semiconductor material
JPH11246963A (ja) * 1998-03-05 1999-09-14 Nikon Corp 蒸着用ボートとそれを用いて成膜した光学薄膜
US6237529B1 (en) * 2000-03-03 2001-05-29 Eastman Kodak Company Source for thermal physical vapor deposition of organic electroluminescent layers
JP2001279428A (ja) * 2000-03-31 2001-10-10 Matsushita Electric Ind Co Ltd 蒸着ボート
US20030101937A1 (en) * 2001-11-28 2003-06-05 Eastman Kodak Company Thermal physical vapor deposition source for making an organic light-emitting device
CN1444423A (zh) * 2002-03-08 2003-09-24 伊斯曼柯达公司 用于制造有机发光器件的长条形热物理蒸汽淀积源
US6749906B2 (en) * 2002-04-25 2004-06-15 Eastman Kodak Company Thermal physical vapor deposition apparatus with detachable vapor source(s) and method
CN1226448C (zh) * 2002-07-19 2005-11-09 Lg电子株式会社 有机场致发光膜蒸镀用蒸镀源

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0134280A1 (de) * 1983-08-29 1985-03-20 idn inventions and development of novelties ag Magazin für Tonaufzeichnungsträger
KR20030074317A (ko) * 2002-03-08 2003-09-19 이스트맨 코닥 캄파니 구조체 코팅 방법 및 기다란 열 물리적 증기 증착 소스
KR20040069281A (ko) * 2003-01-28 2004-08-05 이스트맨 코닥 캄파니 가열식 물리적 증착 시스템의 디자인 방법

Also Published As

Publication number Publication date
US6893939B1 (en) 2005-05-17
JP2007524763A (ja) 2007-08-30
JP4718538B2 (ja) 2011-07-06
CN1922339A (zh) 2007-02-28
TW200532037A (en) 2005-10-01
KR20060123578A (ko) 2006-12-01
WO2005083145A2 (en) 2005-09-09
CN1922339B (zh) 2010-08-25
TWI394854B (zh) 2013-05-01
WO2005083145A3 (en) 2006-02-02

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