KR101120288B1 - 성장 형성물 감소 방법 및 장치와 집적 회로 - Google Patents

성장 형성물 감소 방법 및 장치와 집적 회로 Download PDF

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Publication number
KR101120288B1
KR101120288B1 KR1020050002443A KR20050002443A KR101120288B1 KR 101120288 B1 KR101120288 B1 KR 101120288B1 KR 1020050002443 A KR1020050002443 A KR 1020050002443A KR 20050002443 A KR20050002443 A KR 20050002443A KR 101120288 B1 KR101120288 B1 KR 101120288B1
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South Korea
Prior art keywords
conductive leads
plated
annealing
melting point
finish
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020050002443A
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English (en)
Korean (ko)
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KR20050074311A (ko
Inventor
오센바크존윌리엄
포테이거브라이언데일
숙리차드로렌스
바카로브라이언토마스
Original Assignee
에이저 시스템즈 인크
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Application filed by 에이저 시스템즈 인크 filed Critical 에이저 시스템즈 인크
Publication of KR20050074311A publication Critical patent/KR20050074311A/ko
Application granted granted Critical
Publication of KR101120288B1 publication Critical patent/KR101120288B1/ko
Assigned to 아바고 테크놀로지스 제너럴 아이피 (싱가포르) 피티이 리미티드 reassignment 아바고 테크놀로지스 제너럴 아이피 (싱가포르) 피티이 리미티드 권리의 전부이전등록 Assignors: 에이저 시스템즈 엘엘시
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04G—SCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
    • E04G17/00—Connecting or other auxiliary members for forms, falsework structures, or shutterings
    • E04G17/06—Tying means; Spacers ; Devices for extracting or inserting wall ties
    • E04G17/075—Tying means, the tensional elements of which are fastened or tensioned by other means
    • E04G17/0751—One-piece elements
    • E04G17/0752—One-piece elements fully recoverable
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04G—SCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
    • E04G17/00—Connecting or other auxiliary members for forms, falsework structures, or shutterings
    • E04G17/06—Tying means; Spacers ; Devices for extracting or inserting wall ties
    • E04G17/07—Tying means, the tensional elements of which are fastened or tensioned by means of wedge-shaped members
    • E04G17/0707—One-piece elements
    • E04G17/0714—One-piece elements fully recoverable
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Mechanical Engineering (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1020050002443A 2004-01-12 2005-01-11 성장 형성물 감소 방법 및 장치와 집적 회로 Expired - Fee Related KR101120288B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US53583904P 2004-01-12 2004-01-12
US60/535,839 2004-01-12
US10/855,148 2004-05-27
US10/855,148 US7368326B2 (en) 2004-01-12 2004-05-27 Methods and apparatus to reduce growth formations on plated conductive leads

Publications (2)

Publication Number Publication Date
KR20050074311A KR20050074311A (ko) 2005-07-18
KR101120288B1 true KR101120288B1 (ko) 2012-03-06

Family

ID=34743099

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050002443A Expired - Fee Related KR101120288B1 (ko) 2004-01-12 2005-01-11 성장 형성물 감소 방법 및 장치와 집적 회로

Country Status (3)

Country Link
US (1) US7368326B2 (https=)
JP (1) JP2005203781A (https=)
KR (1) KR101120288B1 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060068218A1 (en) 2004-09-28 2006-03-30 Hooghan Kultaransingh N Whisker-free lead frames
US20060091121A1 (en) * 2004-10-06 2006-05-04 James Zanolli Method for reflowing a metal plating layer of a contact and contact formed thereby
US20060266446A1 (en) * 2005-05-25 2006-11-30 Osenbach John W Whisker-free electronic structures
JP2007123395A (ja) * 2005-10-26 2007-05-17 Renesas Technology Corp 半導体装置および半導体装置の製造方法
KR100725026B1 (ko) * 2005-11-14 2007-06-07 주식회사 아큐텍반도체기술 반도체장치용 리드프레임
JP2008147589A (ja) * 2006-12-13 2008-06-26 Toyota Motor Corp 電子部品
JP2009038075A (ja) * 2007-07-31 2009-02-19 Toyota Motor Corp 電子部品
US8367244B2 (en) * 2008-04-17 2013-02-05 Enovix Corporation Anode material having a uniform metal-semiconductor alloy layer
JP2011527100A (ja) * 2008-06-30 2011-10-20 アギア システムズ インコーポレーテッド 金属フィルム上の成長形成物の防止または軽減
JP5679216B2 (ja) * 2009-06-29 2015-03-04 オーエム産業株式会社 電気部品の製造方法
TW201114952A (en) * 2009-10-28 2011-05-01 Univ Nat Taiwan Science Tech Method for inhibiting growth of tin whiskers
US8551263B1 (en) * 2009-12-15 2013-10-08 Emc Corporation Method for reducing whisker growth
CN102744488A (zh) * 2011-04-22 2012-10-24 鸿富锦精密工业（深圳）有限公司 焊接辅助装置
CN110265376A (zh) 2018-03-12 2019-09-20 意法半导体股份有限公司 引线框架表面精整
US11735512B2 (en) 2018-12-31 2023-08-22 Stmicroelectronics International N.V. Leadframe with a metal oxide coating and method of forming the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000138334A (ja) * 1999-12-06 2000-05-16 Furukawa Electric Co Ltd:The リ―ドフレ―ム材のアウタ―リ―ド部、それを用いた半導体装置
JP2003342782A (ja) 2002-05-23 2003-12-03 Fuji Denshi Kogyo Kk ストライプめっき条及びストライプめっき方法
US20040183166A1 (en) 2003-03-17 2004-09-23 Abbott Donald C. Preplated leadframe without precious metal

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5994767A (en) * 1997-04-09 1999-11-30 Sitron Precision Co., Ltd. Leadframe for integrated circuit package and method of manufacturing the same
US6194777B1 (en) * 1998-06-27 2001-02-27 Texas Instruments Incorporated Leadframes with selective palladium plating
JP3417395B2 (ja) * 2000-09-21 2003-06-16 松下電器産業株式会社 半導体装置用リードフレーム及びその製造方法及びそれを用いた半導体装置
JP3395772B2 (ja) * 2000-11-20 2003-04-14 松下電器産業株式会社 錫−銀合金めっき皮膜の製造方法及び錫−銀合金めっき皮膜及びそれを備えた電子部品用リードフレーム
JP2003193289A (ja) * 2001-12-27 2003-07-09 Fujikura Ltd 電解メッキ皮膜の熱処理方法
US6713852B2 (en) * 2002-02-01 2004-03-30 Texas Instruments Incorporated Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin
JP2002368175A (ja) * 2002-05-15 2002-12-20 Matsushita Electric Ind Co Ltd 電子部品の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000138334A (ja) * 1999-12-06 2000-05-16 Furukawa Electric Co Ltd:The リ―ドフレ―ム材のアウタ―リ―ド部、それを用いた半導体装置
JP2003342782A (ja) 2002-05-23 2003-12-03 Fuji Denshi Kogyo Kk ストライプめっき条及びストライプめっき方法
US20040183166A1 (en) 2003-03-17 2004-09-23 Abbott Donald C. Preplated leadframe without precious metal

Also Published As

Publication number Publication date
US7368326B2 (en) 2008-05-06
JP2005203781A (ja) 2005-07-28
US20050153532A1 (en) 2005-07-14
KR20050074311A (ko) 2005-07-18

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