JP2005203781A - メッキされた導電リード上の成長形成を減少させるための方法および装置 - Google Patents

メッキされた導電リード上の成長形成を減少させるための方法および装置 Download PDF

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Publication number
JP2005203781A
JP2005203781A JP2005004605A JP2005004605A JP2005203781A JP 2005203781 A JP2005203781 A JP 2005203781A JP 2005004605 A JP2005004605 A JP 2005004605A JP 2005004605 A JP2005004605 A JP 2005004605A JP 2005203781 A JP2005203781 A JP 2005203781A
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JP
Japan
Prior art keywords
conductive leads
tin
plated
annealing
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005004605A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005203781A5 (https=
Inventor
John W Osenbach
ウィリアム オーゼンバッハ ジョン
Brian D Potteiger
デール ポッテイガー ブリアン
Richard L Shook
ローレンス ショック リチャード
Brian T Vaccaro
トーマス ヴァッカロ ブリアン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agere Systems LLC
Original Assignee
Agere Systems LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agere Systems LLC filed Critical Agere Systems LLC
Publication of JP2005203781A publication Critical patent/JP2005203781A/ja
Publication of JP2005203781A5 publication Critical patent/JP2005203781A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04G—SCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
    • E04G17/00—Connecting or other auxiliary members for forms, falsework structures, or shutterings
    • E04G17/06—Tying means; Spacers ; Devices for extracting or inserting wall ties
    • E04G17/075—Tying means, the tensional elements of which are fastened or tensioned by other means
    • E04G17/0751—One-piece elements
    • E04G17/0752—One-piece elements fully recoverable
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04G—SCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
    • E04G17/00—Connecting or other auxiliary members for forms, falsework structures, or shutterings
    • E04G17/06—Tying means; Spacers ; Devices for extracting or inserting wall ties
    • E04G17/07—Tying means, the tensional elements of which are fastened or tensioned by means of wedge-shaped members
    • E04G17/0707—One-piece elements
    • E04G17/0714—One-piece elements fully recoverable
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/456—Materials
    • H10W70/457—Materials of metallic layers on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Mechanical Engineering (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2005004605A 2004-01-12 2005-01-12 メッキされた導電リード上の成長形成を減少させるための方法および装置 Pending JP2005203781A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US53583904P 2004-01-12 2004-01-12
US10/855,148 US7368326B2 (en) 2004-01-12 2004-05-27 Methods and apparatus to reduce growth formations on plated conductive leads

Publications (2)

Publication Number Publication Date
JP2005203781A true JP2005203781A (ja) 2005-07-28
JP2005203781A5 JP2005203781A5 (https=) 2007-03-01

Family

ID=34743099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005004605A Pending JP2005203781A (ja) 2004-01-12 2005-01-12 メッキされた導電リード上の成長形成を減少させるための方法および装置

Country Status (3)

Country Link
US (1) US7368326B2 (https=)
JP (1) JP2005203781A (https=)
KR (1) KR101120288B1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008147589A (ja) * 2006-12-13 2008-06-26 Toyota Motor Corp 電子部品
JP2009038075A (ja) * 2007-07-31 2009-02-19 Toyota Motor Corp 電子部品

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060068218A1 (en) 2004-09-28 2006-03-30 Hooghan Kultaransingh N Whisker-free lead frames
US20060091121A1 (en) * 2004-10-06 2006-05-04 James Zanolli Method for reflowing a metal plating layer of a contact and contact formed thereby
US20060266446A1 (en) * 2005-05-25 2006-11-30 Osenbach John W Whisker-free electronic structures
JP2007123395A (ja) * 2005-10-26 2007-05-17 Renesas Technology Corp 半導体装置および半導体装置の製造方法
KR100725026B1 (ko) * 2005-11-14 2007-06-07 주식회사 아큐텍반도체기술 반도체장치용 리드프레임
US8367244B2 (en) * 2008-04-17 2013-02-05 Enovix Corporation Anode material having a uniform metal-semiconductor alloy layer
JP2011527100A (ja) * 2008-06-30 2011-10-20 アギア システムズ インコーポレーテッド 金属フィルム上の成長形成物の防止または軽減
JP5679216B2 (ja) * 2009-06-29 2015-03-04 オーエム産業株式会社 電気部品の製造方法
TW201114952A (en) * 2009-10-28 2011-05-01 Univ Nat Taiwan Science Tech Method for inhibiting growth of tin whiskers
US8551263B1 (en) * 2009-12-15 2013-10-08 Emc Corporation Method for reducing whisker growth
CN102744488A (zh) * 2011-04-22 2012-10-24 鸿富锦精密工业（深圳）有限公司 焊接辅助装置
CN110265376A (zh) 2018-03-12 2019-09-20 意法半导体股份有限公司 引线框架表面精整
US11735512B2 (en) 2018-12-31 2023-08-22 Stmicroelectronics International N.V. Leadframe with a metal oxide coating and method of forming the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000138334A (ja) * 1999-12-06 2000-05-16 Furukawa Electric Co Ltd:The リ―ドフレ―ム材のアウタ―リ―ド部、それを用いた半導体装置
JP2002368175A (ja) * 2002-05-15 2002-12-20 Matsushita Electric Ind Co Ltd 電子部品の製造方法
JP2003193289A (ja) * 2001-12-27 2003-07-09 Fujikura Ltd 電解メッキ皮膜の熱処理方法
JP2003342782A (ja) * 2002-05-23 2003-12-03 Fuji Denshi Kogyo Kk ストライプめっき条及びストライプめっき方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5994767A (en) * 1997-04-09 1999-11-30 Sitron Precision Co., Ltd. Leadframe for integrated circuit package and method of manufacturing the same
US6194777B1 (en) * 1998-06-27 2001-02-27 Texas Instruments Incorporated Leadframes with selective palladium plating
JP3417395B2 (ja) * 2000-09-21 2003-06-16 松下電器産業株式会社 半導体装置用リードフレーム及びその製造方法及びそれを用いた半導体装置
JP3395772B2 (ja) * 2000-11-20 2003-04-14 松下電器産業株式会社 錫−銀合金めっき皮膜の製造方法及び錫−銀合金めっき皮膜及びそれを備えた電子部品用リードフレーム
US6713852B2 (en) * 2002-02-01 2004-03-30 Texas Instruments Incorporated Semiconductor leadframes plated with thick nickel, minimum palladium, and pure tin
US20040183166A1 (en) * 2003-03-17 2004-09-23 Abbott Donald C. Preplated leadframe without precious metal

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000138334A (ja) * 1999-12-06 2000-05-16 Furukawa Electric Co Ltd:The リ―ドフレ―ム材のアウタ―リ―ド部、それを用いた半導体装置
JP2003193289A (ja) * 2001-12-27 2003-07-09 Fujikura Ltd 電解メッキ皮膜の熱処理方法
JP2002368175A (ja) * 2002-05-15 2002-12-20 Matsushita Electric Ind Co Ltd 電子部品の製造方法
JP2003342782A (ja) * 2002-05-23 2003-12-03 Fuji Denshi Kogyo Kk ストライプめっき条及びストライプめっき方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008147589A (ja) * 2006-12-13 2008-06-26 Toyota Motor Corp 電子部品
JP2009038075A (ja) * 2007-07-31 2009-02-19 Toyota Motor Corp 電子部品

Also Published As

Publication number Publication date
KR101120288B1 (ko) 2012-03-06
US7368326B2 (en) 2008-05-06
US20050153532A1 (en) 2005-07-14
KR20050074311A (ko) 2005-07-18

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