KR101118848B1 - Defect correcting method for fine pattern - Google Patents

Abstract

assignment

The present invention provides a fine pattern correction apparatus capable of correcting defects in fine patterns in a short time, having low device cost, small device installation area, and high quality of correction.

Solution

The fine pattern correction apparatus includes a laser apparatus 1 for irradiating a laser beam to remove black defects, an observation optical system 2 for observing defects, an ink application unit 3 for applying ink to correct color missing defects, and The correction head portion 6 including the tape polishing unit 5 for polishing and correcting the projection defect, the XYZ tables 7 to 9 in which the correction head portion 6 is positioned, and the to-be-modified glass substrate 10 A glass base plate 11 to be mounted is provided. Thus, one device can correct color missing defects, black defects and protrusion defects.

Fine Patterns, Defects, Fixes

Description

{DEFECT CORRECTING METHOD FOR FINE PATTERN}

BRIEF DESCRIPTION OF THE DRAWINGS The perspective view which shows the whole structure of the micropattern correction apparatus by one Embodiment of this invention.

FIG. 2 is a diagram showing the configuration of the quartz head 6 shown in FIG.

FIG. 3 is a perspective view showing the configuration of the ink application unit shown in FIG. 1. FIG.

4 shows a color filter with color missing defects.

FIG. 5 is a view for explaining a method of correcting color missing defects of the color filter shown in FIG. 4; FIG.

6 shows a modified color filter.

7 is a view for explaining a method of correcting black defects in a color filter;

8 is a view for explaining a method of correcting protrusion defects of a color filter;

9 is a view for explaining another method of correcting black defects in a color filter.

10 is another diagram for explaining a method of correcting color missing defects of a color filter;

(Explanation of symbols for the main parts of the drawing)

1 laser device 2 observation optical system

3: ink coating unit 4: light source for curing liquid correction

5: tape polishing unit 6: crystal head portion

7: Z axis table 8: X axis table

9: Y-axis Table 10: Crystal Glass Substrate

11: glass plate 11a: lifter pin hole

11b: groove for vacuum absorption 12: laser optical system

13: objective lens 14: CCD camera

15: sub-Z axis table 21: the needle

22: positioning actuator 23: drive shaft

24: support member 25: rotary table

26 to 29: ink tank 30: cleaning device

31: air purge device 32: notch

33: rotating shaft 34: indexing motor

35 index plate 36 index sensor

37: Return to origin sensor 41: Color part

42: black matrix 43, 44: color missing defect

45, 46: Ink 47: foreign matter

48: black defect 49: laser beam

50 abrasive tape 51 transfer side reel

52: polishing head 53: drive mechanism

54: winding side reel 55: height measuring sensor

56: pressure member

Technical field

The present invention relates to a fine pattern correction apparatus and a method for correcting defects of a fine pattern, and more particularly, to a fine pattern correction apparatus for correcting a defect of a fine pattern formed on a substrate and a method for correcting defects of a fine pattern.

Background technology

The defect which may arise in the color filter used for a liquid crystal display device (LCD) can be roughly classified into three types, a color missing defect, a black defect, and a protrusion defect. The color missing defect is a defect in which a predetermined color is not expressed in a certain pixel. A black defect is a defect which produces the black part which light does not transmit to a pixel. The causes of black defects include protruding from the black matrix material to the pixel portion, color of a certain pixel protruding into the adjacent pixel, mixed color of which colors are mixed with each other, adhesion of foreign matter to the pixel, and the like. A projection defect is a defect which a protrusion generate | occur | produced by adhesion of a foreign material, the bubble of ink, etc.

As a device for correcting color missing defects, a correction liquid may be applied by a needle. As an apparatus for correcting black defects, there is a method of changing a black defect into a color missing defect by cutting the black defect with a laser, and applying a correction liquid to the dichroic missing defect with a needle (see Patent Documents 1 and 2, for example). As an apparatus for correcting protrusion defects, there is a method of pressing and polishing a polishing tape against protrusion defects and removing them (see Patent Document 3, for example).

[Patent Document 1]

Japanese Patent Application Laid-Open No. 2001-174625

[Patent Document 2]

Japanese Patent Application Laid-Open No. 9-236933

[Patent Document 3]

Japanese Patent Application Laid-Open No. 8-229797

However, conventionally, different apparatuses are required according to the type of defects. For example, when color missing defects and protrusion defects occur on the same substrate, the time between the apparatuses and the positional separation of the substrates in the apparatus, etc. may be reduced. need. For this reason, shortening of correction time is difficult.

Moreover, in recent years, since a board | substrate became large, the defect correction apparatus also becomes large and an apparatus becomes expensive. In addition, the floor area required for installation of the apparatus increases, and the cost of construction and maintenance of a clean room becomes high.

Moreover, in the black defect by adhesion of a foreign material, when a foreign material is large, it is necessary to raise the irradiation energy of the laser beam to remove a black defect and turn into a color missing defect. For this reason, the influence of heat etc. appears in the top part around black defect.

Therefore, the main object of the present invention is to provide a fine pattern correction apparatus which can correct a defect of a fine pattern in a short time, has a low device cost, a small device installation area, and high quality of correction.

Another object of the present invention is to provide a method for correcting defects of fine patterns having high quality of correction.

The fine pattern correction apparatus according to the present invention is a fine pattern correction apparatus for correcting a defect of a fine pattern formed on a substrate, an application unit for applying a correction liquid to a defect, a laser device for irradiating a laser beam to remove the defect, and a defect Positioning apparatus for performing positioning in a three-dimensional space by relatively moving the observation optical system for observing the optical head and the correction head portion including the tape polishing unit for polishing the defect, the work table on which the substrate is mounted, and the correction head portion and the work table. It is equipped with.

In addition, the defect correction method of the micropattern according to the present invention is a defect correction method for correcting the defect of the micropattern formed on the substrate, and the rise of the defect portion is polished with an abrasive tape to make it almost the same height as the peripheral top portion. It includes a polishing step, a laser cut step of irradiating a laser beam to a defective part after polishing to remove the defective part, and a coating step of applying a correction liquid to a position where the defective part is removed by a laser beam.

In addition, another fine pattern defect correction method of the present invention is a defect correction method for correcting a defect of a fine pattern formed on a substrate, which is a coating step of applying a correction liquid to a defective defect portion in which a pattern is separated from a normal pattern surface. It includes a polishing process in which the rising correction liquid is removed with an abrasive tape so as to be almost the same height as the top portion.

Best Mode for Carrying Out the Invention

1 is a perspective view showing the overall configuration of a fine pattern correction device according to an embodiment of the present invention. In FIG. 1, in this fine pattern correction apparatus, the correction head part containing the laser apparatus 1, the observation optical system 2, the ink application unit 3, the light source 4 for correction liquid hardening, and the tape polishing unit 5 (6) is fixed to the Z-axis table 7, and the Z-axis table 7 is provided so that a movement to a Z-axis direction (up-down direction) is possible. The Z axis table 7 is provided to be movable on the X axis table 8 in the X axis direction (lateral direction). The X-axis table 8 is provided so that the movement on the Y-axis table 9 in the Y-axis direction (lateral direction) is possible.

Below the X-axis table 8, the glass surface plate 11 which is a work table which mounts the to-be-modified glass substrate 10 is provided. The glass surface plate 11 includes a lifter pin hole 11a for passing a lifter pin of a lift-up mechanism for lifting up when carrying in and out of the modified glass substrate 10, and a glass surface plate 10. The vacuum suction groove 11b for fixing to the upper surface of 11 is formed. In several places of the vacuum suction groove 11b, vacuum suction holes for pulling with vacuum are formed.

The laser device 1 irradiates a laser beam to black defects or projection defects of the color filter on the to-be-modified glass substrate 10, and sublimes or scatters ink or foreign material with the thermal energy to remove them. The observation optical system 2 enlarges and captures a defect part, and displays the picked-up image on a television monitor (not shown). The ink application unit 3 applies ink to color missing defects of the color filter on the modified glass substrate 10. The light source for curing liquid curing 4 is irradiated with light onto the applied ink and cured. The tape polishing unit 5 polishes and removes black defects or protrusion defects of the color filter on the modified glass substrate 10 with a tape.

The crystal head portion 6 including the laser device 1, the observation optical system 2, the ink coating unit 3, the light source for curing liquid correction 4, and the tape polishing unit 5 is attached to the Z-axis table 7. Since it is attached, it can be located in arbitrary height on the to-be-modified glass substrate 10, and since the Z-axis table 7 is mounted on the X-axis table 8 and the Y-axis table 9, It can move to arbitrary positions in the X-axis direction and the Y-axis direction with respect to the to-be-fixed glass substrate 10. FIG. In addition, a control computer (not shown) for controlling each mechanism and a host computer (not shown) for controlling the entire apparatus are provided.

Next, the operation of this fine pattern correction apparatus will be described. The positional information (X, Y coordinate) of the defect is sent from the other inspection apparatus to the controller of the correction apparatus, and the controller gives a command signal to the positioning mechanism including the tables 8 and 9 based on the information. The positioning mechanism moves the observation optical system 2 to a position where the defect can be observed based on the command signal. An image of the defective portion picked up by the observation optical system 2 is displayed on the display screen provided on the operation portion. The operator determines the type of defect based on the displayed image and selects and executes an appropriate correction method.

In the case of a color missing defect, ink is apply | coated to a defect part by the ink application unit 3, the light of the light source 4 for correction liquid hardening is irradiated, and an ink is hardened. In the case of a black defect, a laser beam is irradiated to the defect part from the laser device 1, the defect part is sublimed or scattered by the thermal energy of the laser beam, the black defect is converted into a color missing defect, and then corrected by ink coating. In the case of a projection defect, the projection is polished with the tape of the tape polishing unit 5.

In addition, although the positioning apparatus has shown the XYZ table 7-9 in FIG. 1, if the defect part on the correction head part 6 and the to-be-modified glass substrate 10 can be relatively located in a three-dimensional space, It does not limit, for example, other forms, such as a parallel link mechanism, may be sufficient. The glass substrate 10 may be provided to be movable in the X-axis and Y-axis directions, and the crystal head portion 6 may be provided to be movable in the Z-axis direction. The glass substrate 10 may be provided to be movable in the Y-axis direction, and the crystal head portion 6 may be provided to be movable in the X-axis and Z-axis directions.

The controller further includes an image processing apparatus and a memory for recording a program for executing various types of correction procedures and data, and a correction program recorded in the memory by determining the position and type of the defect from the image of the defective portion by the image processing apparatus. By selecting an appropriate correction method and executing the correction, the various defects can be corrected automatically without the operator.

2 is a diagram showing the configuration of the quartz head 6 in more detail. In FIG. 2, a laser optical system 12 for guiding a laser beam emitted from the laser device 1 to a defect portion is fixed to a central portion of the Z-axis table 7. The observation optical system 2 and the laser optical system 12 are provided coaxially, and share the objective lens 13 etc. in common. The observation optical system 2 includes a microscope and a CCD camera 14 for enlarging and capturing a fine pattern on the water-modified glass substrate 10. The laser device 1 is fixed to the upper portion of the laser optical system 12. Although various lasers can be used as the laser apparatus 1, the short wavelength laser below the 2nd harmonic of a YAG laser is preferable,

The ink application unit 3 is fixed to one end of the Z axis table 7, and the sub Z axis table 15 is provided at the other end of the Z axis table 7 so as to be movable in the Z axis direction. The tape polishing unit 5 is fixed to the sub-Z axis table 15. The correction liquid curing light source 4 is provided between the observation optical system 2 and the ink application unit 3.

The ink coating unit 3 and the tape polishing unit 5 are preferably arranged on both sides with the observation optical system 2 interposed therebetween. A correction unit (ink coating unit 3 or tape polishing unit 5) which displays the image photographed by the observation optical system 2 on the screen of the image display device of the operation unit, instructs the correction position on the screen, and designates the position as the position. ), And the correction work is carried out. If the movement amount at this time is large, the positioning error of the correction unit 3 or 5 with respect to the designated position increases. By arranging the two correction units 3 and 5 on both sides of the observation optical system 2, the amount of movement when moving from observation to crystal can be made small, so that highly accurate correction is possible.

Although the crystal head part 6 is integrally positioned by the Z-axis table 7 in the Z-axis direction, the correction head part 6 further includes a sub-Z-axis table 15 for moving the tape polishing unit 5 independently in the Z-direction. By providing, the tape polishing unit 5 can be positioned at high speed and with high accuracy.

The range in which the correction liquid curing light source 4 acts is generally larger than the pattern dimension, and the demand for positioning accuracy is not severe compared to the ink application unit 3 or the tape polishing unit 5. Therefore, the correction liquid curing light source 4 may be provided at any position of the Z-axis table 7, and the ink coating unit 3 and the tape polishing unit 5 arranged on both sides with the observation optical system 2 as the center. You may arrange | position further outside). By curing the ink in the fine pattern correction apparatus by the light source for curing liquid curing 4, the water-modified glass substrate 10 can be quickly sent to the next step. As the light source 4, a halogen lamp, a laser device, an infrared light such as ultraviolet light, or the like is used. In place of the light source 4, a heat source such as a hot air generator for drying or curing the applied correction liquid may be provided.

3 is a perspective view showing the configuration of the ink application unit 3. In FIG. 3, the ink application unit 3 includes a needle 21 for ink application and a positioning actuator 22 for driving the needle 21 in the vertical direction. The needle 21 is provided at the tip of the drive shaft 23 of the actuator 22 via the support member 24. The support member 24 has a spring for relieving the impact when the needle 21 comes into contact with the surface of the to-be-modified glass substrate 10. In addition, in order to alleviate the impact between the needle 24 and the water-modified glass substrate 10, the support member 24 is attached to the drive shaft 23 through a guide element such as a linear guide, and the tip of the needle 21 is attached. After contacting the surface of the modified glass substrate 10, the needle 21 and the support member 24 may be moved upward relative to the drive shaft 23. The positioning actuator 22 is fixed to the Z-axis table 7.

In addition, the ink application unit 3 includes a rotating table 25 provided horizontally, a plurality of ink tanks 26 to 29, a cleaning device 30, and air arranged sequentially in the circumferential direction on the rotating table 25. A purge device 31 is provided. The notch part 32 for passing the needle 21 at the time of ink application | coating is formed in the rotary table 25, and the rotating shaft 33 is provided in the center of the rotary table 25. RGB and black ink are injected into the ink tanks 26 to 29, respectively. The cleaning device 30 stores a cleaning liquid for cleaning the needle 21. The air purge device 31 blows air to the needle 21 inserted into the small hole and blows off the cleaning liquid attached to the needle 21 or the like.

In addition, the ink application unit 3 includes an index motor 34 for rotating the rotary shaft 33 of the rotary table 25, an index plate 35 that rotates together with the rotary shaft 33, and an index plate 35. Index sensor 36 for detecting the rotational position of the rotary table 25 through the reference), and origin return sensor for detecting that the rotational position of the rotary table 25 has returned to the original position through the index plate 35. (37) is provided. The motor 34 is controlled based on the outputs of the sensors 36 and 37, and rotates the rotary table 25 to form the notches 32, ink tanks 26 to 29, the cleaning device 30, and the air purge device. Any one of (31) is positioned below the needle 21.

Next, the operation of the ink application unit 3 will be described. First, the Z-axis table 7, the X-axis table 8, and the Y-axis table 9 are driven to place the needle 21 above the color missing defect of the color filter formed on the surface of the modified glass substrate 10. It is located in a predetermined position. Subsequently, the rotary table 25 is rotated, and the ink tank in which the ink to be applied to the color missing defect is stored is placed under the needle 21, and the needle 21 is turned up and down by the actuator 22, Ink is attached to the tip of the needle 21.

Next, the rotary table 25 is rotated so that the notch 32 is positioned below the needle 21, the actuator 21 is lowered by the actuator 22, and the tip of the needle 21 is moved to the color filter. Contact is made with the color missing part and ink is applied to the color missing part.

After the ink application is completed, the cleaning device 30 is positioned below the needle 21, the needle 21 is inverted, and the needle 21 is washed. Then, the air purging device 31 is disposed below the needle 21. ), The needle 21 is turned upside down and the cleaning liquid attached to the needle 21 is blown off.

4 is a diagram illustrating a color filter 40 in which color missing defects occur. In FIG. 4, the color filter 40 includes a color adding portion 41 of RGB formed on the surface of the glass substrate 10 at regular intervals, and a black matrix 42 formed in a gap between the color adding portion 41. . When a foreign material adheres to the surface of the glass substrate 10 at the time of formation of the color addition part 41 or the black matrix 42, the part which the foreign material adhered becomes the color missing defect parts 43 and 44. As shown in FIG.

5A to 5C are diagrams showing a step of correcting the color missing defect 43 by the ink coating unit 3. First, as shown in FIG. 5A, the correction ink 45 is attached to the tip of the needle 21. As shown in FIG. Subsequently, as shown in Fig. 5B, the tip of the needle 21 is brought into contact with the color missing defect 43 so that the ink 45 is attached to the color missing defect 43. Subsequently, as shown in Fig. 5C, the needle 21 is separated from the color missing defect 43, the ink 45 is cured by the correction liquid curing light source 4, and the color missing defect 43 Terminate the modification. Similarly, the color missing defect 44 of the black matrix is also corrected.

6 shows the color filter 40 after the correction. The color missing defects 43 and 44 are covered with inks 45 and 46 of the same color as the surroundings thereof. The modified color filter 40 is treated as good quality.

7A and 7B are diagrams showing a method of correcting black defects 48 generated in the color adding portion 41 of the color filter formed on the surface of the glass substrate 10. The black defect 48 is a defect in which the foreign material 47 attached to the glass substrate 10 is covered with ink and remains. While observing the black defect 48 by the observation optical system 2, the focus of the laser device 1 and the laser optical system 12 is positioned at the center of the black defect 48, and as shown in FIG. 7A. The black defect 48 is removed by irradiating the black defect 48 with the laser beam 49. As a result, as shown in FIG. 7B, the black defect 48 is converted into the color missing defect 43. The color missing defect 43 is corrected by the method shown in Figs. 5A to 5C.

Next, a method of correcting protrusion defects will be described. The projection defect is corrected by the tape polishing unit 5 shown in FIG. Referring to FIG. 2, the tape polishing unit 5 includes a polishing tape 50 for polishing the projection defect, a transfer side reel 51 for sending the polishing tape 50, and a projection defect for the polishing tape 50. Measuring the height of the polishing defect 52, the drive mechanism 53 for driving the polishing tape 50, the winding side reel 54 for winding the polishing tape 50, and the protrusion defect. Height measuring sensor 55 for the purpose of. The tape polishing unit 5 is positioned in the Z-axis direction with high accuracy by the Z-axis table 7 and the sub-Z-axis table 5. In addition, a positioning mechanism for moving only the polishing head 52 independently in the Z-axis direction may be provided.

8A to 8C show a method of correcting the projection defect 60 generated in the black matrix 42 or the color adding portion 41 of the color filter formed on the surface of the glass substrate 10. Drawing. First, as shown to Fig.8 (a), the height h1 of the protrusion defect 60 and the height h2 of the periphery of it are measured by the height measuring sensor 55. As shown in FIG. Subsequently, as shown in FIG. 8B, the distal end portion of the pressing member 56 included in the polishing head 55 is positioned at the center of the protrusion defect 60, and the distal end portion of the pressing member 56 is positioned. The polishing tape 50 is driven while pressing the polishing tape 50 to the protrusion defect 60, and the protrusion defect 60 is scraped off. The depth which press-fits the press member 56 is determined based on the measurement result h2 of the height of the top part of the periphery of a defect. As a result, as shown in FIG. 8C, the projection defect 60 is corrected.

Moreover, in this fine pattern correction apparatus, it evaluated by the difference h1-h2 of the height h1 of the defect measured by the height measuring sensor 55, and the height h2 of the top part, and the observation optical system 2 Based on the area of the defect, the size of the defective portion to be removed can be grasped, and it is possible to determine whether the defective portion is removed only by irradiation of the laser beam 49 or whether polishing by the polishing tape 50 is used in combination.

That is, in the case where the black defect 48 due to the foreign matter or the like is present, when the size of the black defect 48 is large, the power of the laser beam 49 may be considerably increased if it is to be removed only by irradiation of the laser beam 49. There is a need for this, and there is a fear that adverse effects may occur at the top of the defect periphery. In this case, first, as shown in Figs. 9A and 9B, most of the protrusions are removed by the polishing tape 50, and the defects are made almost the same level as the tops. ) And (c) irradiate the laser beam 49 to convert the black defects 48 into color missing defects 43, and the color by the method shown in Figs. 5A to 5C. Ink is applied to the missing defect 43 and corrected. Thereby, it becomes possible to remove a defect part with weak laser power, and to reduce the bad influence to the surrounding top part, and the correction of high quality can be performed. If the size of the black defect 48 is small and the power of the laser beam 49 does not need to be increased, and there is no influence on the top of the periphery of the defect, as shown in Figs. 7A and 7B, the laser is Only the irradiation of the beam 49 converts the black defect 48 into the color missing defect 43.

In addition, in the case where correction by ink application is performed, when the ink 45 protrudes from the color missing defect 43 and greatly rises, as shown in 0 (a) and (b) of FIG. 1, The flatness of the crystal part can be improved by grinding and removing the ink 45 protruding and swelling with the polishing tape 50.

As described above, in this embodiment, color missing defects 43, black defects 48, and projection defects 60 of the LCD color filter can be corrected by one device. Therefore, even when three types of defects are mixed, the substrate transfer between devices and the substrate position dividing operation after fixing the substrate to the crystal device are unnecessary, and the correction time can be shortened. In addition, the installation area of the device is reduced compared to the case of using a plurality of devices to modify, the construction of a clean room. Can reduce the maintenance cost. In addition, the cost of the correction facility can be reduced.

In the case of correcting the black defect 48 due to a large foreign matter, by using a combination of the polishing by the polishing tape 50 and the irradiation of the laser beam 49 together, the thermal effect on the peripheral top portion is reduced or the ink is applied. The quality of the correction can be improved by the combination of functions, such as removing the rise of one part by tape polishing.

Moreover, the movement amount of the correction head part 6 at the time of moving from the observation (correction position designation) to correction by disposing the ink application unit 3 and the tape polishing unit 5 on both sides of the observation optical system 2 is small. Thus, it is possible to correct the position specified more accurately.

In addition, the application needle 21 of the ink application unit 3 is mounted independently of the XYZ positioning apparatus (tables 7 to 9) for relative positioning of the crystal head portion 6 and the substrate 10 in the XYZ direction. By providing an actuator 22 for moving in the Z-axis direction and a sub-Z-axis table 15 for moving the tape polishing unit 5 in the Z-axis direction, the mass to be moved in the Z-axis direction in the correction process becomes smaller. , High-speed or high-precision positioning in the Z-axis direction becomes possible. Therefore, it becomes possible to shorten the time of ink coating correction and to improve the precision of the height control of tape polishing.

In addition, although this embodiment demonstrated the correction of the defect of the color filter for LCDs as an example, in addition to the correction of the defect of the board | substrate for flat panel display devices which provided the fine pattern in a flat board | substrate, such as a plasma display device and an organic electroluminescent display device. Also in this regard, the present invention can be effectively applied.

In addition, the ink coating unit 3 may use a dispenser in addition to the method using the coating needle 21 (for example, see FIG. 13 of Japanese Patent Application Laid-Open No. 2001-174625), or an inkjet method (for example, Japanese Patent Application Laid-Open No. 7-13). See 318724).

It should be considered that the embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is shown by above-described not description but Claim, and it is intended that the meaning of a claim and equality and all the changes within a range are included.

In the fine pattern correction apparatus according to the present invention, a coating unit for applying a correction liquid to a defect, a laser apparatus for irradiating a laser beam to remove the defect, an observation optical system for observing the defect, and a tape polishing unit for polishing the defect There is provided a work table for mounting the quartz head portion, a substrate, and a positioning device that performs positioning in a three-dimensional space by relatively moving the quartz head portion and the work table. Therefore, color missing defects, black defects, and projection defects can be corrected with one device, so that it is possible to shorten the correction time, reduce the device price, reduce the device installation area, and improve the correction quality.

In addition, in the method for correcting a defect of a fine pattern according to the present invention, the rise of the defect part is polished with an abrasive tape to be almost the same height as the surrounding top part, and the defect part after polishing is irradiated with a laser beam to remove the defect part, The correction liquid is applied to the position where the defect is removed by the laser beam. Therefore, even when correcting black defects caused by the attachment of large foreign matters, the irradiation energy of the laser beam can be suppressed low, so that the influence of heat or the like can be prevented from appearing on the tops of the periphery of the defects, thereby improving the quality of the correction. Can be planned.

In another fine pattern defect correction method of the present invention, the correction liquid is applied to the defective defect portion in which the pattern is separated, and the correction liquid rising above the normal pattern surface is removed with an abrasive tape to be almost the same height as the top portion. Therefore, the quality of correction can be improved.

Claims (9)

As a method of correcting a defect of a fine pattern for correcting a defect of a fine pattern formed on a substrate, A coating unit for applying a correction liquid to a defect, a laser device for irradiating a laser beam to remove the defect, an observation optical system for observing the defect, a tape polishing unit for polishing the defect with an abrasive tape, a defect portion of the fine pattern, Correction head portion including a height measuring sensor for measuring the height of the top, A work table on which the substrate is mounted; A positioning device which performs positioning in a three-dimensional space by relatively moving the correction head portion and the work table, and A site value determination device mounted on the correction head portion and moving the polishing head portion included in the tape polishing unit or the tape polishing unit and the height measuring sensor in a direction perpendicular to the substrate; A first polishing step of polishing the rise of the defect with the polishing tape based on the measurement result of the height measuring sensor to make the same height as the peripheral top; A laser cut process of irradiating the laser beam to a defect or a defect after polishing to remove the defect; An application step of applying the correction liquid at a position where the defect is removed with the laser beam, First, the height of the defect is measured using the height measuring sensor, and it is determined based on the measurement result to determine whether the defect is removed only by the laser cut process or whether the first polishing process and the laser cut process are used together. A method for correcting a defect of a fine pattern, characterized by carrying out a process. The method of claim 1, Further, based on the measurement result of the height measuring sensor, a second polishing step of removing the correction liquid that has risen from the top of the fine pattern with the polishing tape to have the same height as the top is performed. How to fix the defect. As a method of correcting a defect of a fine pattern for correcting a defect of a fine pattern formed on a substrate, A coating unit for applying a correction liquid to a defect, a laser device for irradiating a laser beam to remove the defect, an observation optical system for observing the defect, a tape polishing unit for polishing the defect with an abrasive tape, a defect portion of the fine pattern, Correction head portion including a height measuring sensor for measuring the height of the top, A work table on which the substrate is mounted; A positioning device which performs positioning in a three-dimensional space by relatively moving the correction head portion and the work table, and A site value determination device mounted on the correction head portion and moving the polishing head portion included in the tape polishing unit or the tape polishing unit and the height measuring sensor in a direction perpendicular to the substrate; An application step of applying the correction liquid to a defective defect portion in which a part of the fine pattern is separated; And a polishing step of removing the correction liquid rising above the top of the fine pattern with the polishing tape on the basis of the measurement result of the height measuring sensor to have the same height as the top. 4. The method according to any one of claims 1 to 3, The correction head portion further includes a light source or a heat source for curing the correction liquid applied to the defect by the coating unit. 4. The method according to any one of claims 1 to 3, The optical system for the laser device and the observation optical system are arranged coaxially, The observation optical system is disposed between the tape polishing unit and the coating unit, characterized in that the fine pattern defect correction method. 4. The method according to any one of claims 1 to 3, The coating unit, An applicator for transferring the correction liquid attached to the tip to a defect, And an actuator for moving the coating needle in a direction perpendicular to the substrate. delete A defect correction method for correcting a defect of a fine pattern formed on a substrate, A polishing step in which the rise of the defective portion is polished with an abrasive tape to be at the same height as the surrounding top portion, A laser cut process of irradiating a laser beam to a defective portion after polishing to remove the defective portion, An application step of applying a correction liquid at a position where the defect portion is removed by a laser beam, And a determination step of first measuring the height of the defect portion and determining whether the defect portion is removed only by the laser cut process or in combination with the polishing process and the laser cut process based on the measurement result. How to fix defects in fine patterns. A defect correction method for correcting a defect of a fine pattern formed on a substrate, An application step of applying a correction liquid to a defect defect in which the pattern is separated; And a polishing step of removing the correction liquid rising above the normal pattern surface with the polishing tape to have the same height as the top portion.

Images