JP5015552B2 - Pattern correction device - Google Patents

Description

  The present invention relates to a pattern correction apparatus, and more particularly to a pattern correction apparatus that corrects a defective portion of a fine pattern formed on a substrate.

In the manufacturing process of a liquid crystal display (LCD), various defects occur in the color filter, which is a fine pattern formed on the substrate. If all the substrates on which defects are generated are discarded, the yield decreases, and therefore a pattern correction device that corrects the defects is used. In this pattern correction device, when a white defect (color missing portion) occurs in the color filter, the coating needle is moved above the white defect by the positioning device, the correction ink is attached to the tip of the application needle, and the application needle Is moved up and down to apply the correction ink to the white defect (see, for example, Patent Document 1).
JP 9-236933 A

  However, in the conventional pattern correction apparatus, when the application needle is replaced, there is a case where application to the target position cannot be performed due to an influence of an attachment error or a dimensional error. For this reason, when the application needle is replaced, the coordinates of the target position are given to the positioning device, the application needle is moved, the correction ink is applied to the surface of the dummy substrate, and the target position and the correction ink are actually applied. The position deviation from the position is observed with the observation optical system, and the coordinates of the target position are corrected so that the position deviation is eliminated. Therefore, there is a problem that this correction work takes time and labor.

  Further, even if the correction work is performed at the time of replacing the application needle, the metal parts constituting the apparatus expand and contract in accordance with the change in the temperature or the change in the temperature of the apparatus itself, resulting in a displacement between the target position and the application position.

  Therefore, a main object of the present invention is to provide a pattern correction apparatus capable of easily correcting a positional deviation between a target position and an application position.

The pattern correction apparatus according to the present invention is a pattern correction apparatus that corrects a defect portion of a fine pattern formed on a substrate. The correction liquid is attached to the tip portion of the application needle, and the application needle is moved up and down to detect the defect portion. Correction liquid application means for applying correction liquid to the substrate, positioning means for moving the correction liquid application means relative to the substrate in accordance with the position command signal, coordinates of the target position where the correction liquid should be applied, and misalignment of the application needle The position command signal is generated on the basis of the correction value for correcting the correction value, the control means for applying the correction liquid to the target position, and the coordinates of the target position are given to the control means in the correction mode for updating the correction value. Correction means for applying correction liquid to the surface of the dummy substrate, detecting a positional deviation amount between the target position and the application position where the correction liquid is actually applied, and a correction means for updating the correction value based on the detection result. Also Der Ru. This correction means captures images of the dummy substrate surface before and after the correction liquid is applied by the application needle, compares the images before and after application, extracts the inconsistent portions where the brightness does not match, and extracts the extracted inconsistent portions Is determined as the application position.
In another pattern correction apparatus according to the present invention, the correction means captures images of the dummy substrate surface before and after the correction liquid is applied by the application needle, and compares the images before and after the application to match the brightness. An unmatched portion that is not extracted is extracted, and the center of the circumscribed rectangle of the extracted mismatched portion is determined as the application position.

Preferably, the correction unit executes the correction mode at a predetermined cycle.
Preferably, the information processing apparatus further includes notification means for notifying an operator that the correction mode should be executed at a predetermined cycle, and the correction means executes the correction mode in response to an instruction to execute the correction mode by the operator. .

  Preferably, the dummy substrate is a mirror, and the correction unit performs epi-illumination to capture an image of the mirror.

Also preferably, the surface of the dummy substrate is divided into a plurality of regions. The correction means selects any one of the plurality of areas in the correction mode, and gives the coordinates in the selected area to the control means as the coordinates of the target position. Further, when selecting the area in the correction mode, the correction means selects an area different from the area selected in the previous correction mode.

In the pattern correction apparatus according to the present invention, the correction liquid is applied to the tip of the application needle, the correction needle is moved up and down to apply the correction liquid to the defective portion, and the correction is performed according to the position command signal. A position command signal is generated based on a positioning means for moving the liquid application means relative to the substrate, a coordinate of a target position where the correction liquid is to be applied, and a correction value for correcting a positional deviation of the application needle. In the correction mode in which the correction liquid is applied to the position and in the correction mode in which the correction value is updated, the coordinates of the target position are given to the control means to apply the correction liquid to the surface of the dummy substrate, and the target position and the correction liquid are actually Correction means is provided for detecting an amount of positional deviation from the applied application position and updating the correction value based on the detection result. This correction means captures images of the dummy substrate surface before and after the correction liquid is applied by the application needle, compares the images before and after application, extracts the inconsistent portions where the brightness does not match, and extracts the extracted inconsistent portions Is determined as the application position. Therefore, since the correction means executes the correction mode, it is not necessary for the worker to perform correction work.
In another pattern correction apparatus according to the present invention, the correction means captures images of the dummy substrate surface before and after the correction liquid is applied by the application needle, and compares the images before and after the application to match the brightness. An unmatched portion that is not extracted is extracted, and the center of the circumscribed rectangle of the extracted mismatched portion is determined as the application position. Therefore, since the correction means executes the correction mode, it is not necessary for the worker to perform correction work.

  FIG. 1 is a diagram showing the overall configuration of a pattern correction apparatus according to an embodiment of the present invention. In FIG. 1, a pattern correction apparatus 1 includes an observation optical system 2 for observing the surface of a substrate, a monitor 3 for displaying an observed image, and irradiating the substrate with laser light through the observation optical system 2 to cut unnecessary portions. A cutting laser unit 4 to be applied, an ink application mechanism 5 for applying correction ink to the tip of the application needle to apply to the defective part of the substrate, an ink curing light source 6 for curing the correction ink applied to the defective part, and a defect Image processing unit 7 for recognizing the image forming unit and the ink application position, a host computer 8 for controlling the entire apparatus, and a control computer 9 for controlling the operation of the apparatus mechanism unit. In addition, an XY stage 10 that moves a substrate having a defective portion in the XY direction (horizontal direction), a chuck base 11 that holds the substrate on the XY stage 10, and the observation optical system 2 and the ink application mechanism 5 are moved in the Z direction. A Z stage 12 that is moved in the (vertical direction) is provided.

  The XY stage 10 is used to relatively move the substrate to an appropriate position when the correction ink is applied to the defective portion by the ink application mechanism 5 or when the surface of the substrate is observed by the observation optical system 2. The XY stage 10 shown in FIG. 1 has a configuration in which two uniaxial stages are stacked in a perpendicular direction. However, the XY stage 10 only needs to be able to move the substrate relative to the observation optical system 2 and the ink application mechanism 5, and is limited to the configuration of the XY stage 10 shown in FIG. is not. In recent years, gantry-type XY stages that can move independently in the X-axis direction and the Y-axis direction have been widely adopted as the substrate size increases.

  FIG. 2 is a diagram showing the color filter 15 of the LCD to be corrected. In FIG. 2, the color filter 15 includes a lattice pattern called a black matrix 16 formed on the surface of a glass substrate (not shown), a plurality of sets of R (red) pixels 17, G (green) pixels 18, And B (blue) pixel 19. In the manufacturing process of the color filter 15, the white defect 20 in which the color of the pixel and the black matrix 16 is lost, the black defect 21 in which the adjacent pixel and the color are mixed, or the black matrix 16 protrudes from the pixel, As a result, a foreign matter defect 22 or the like in which foreign matter has adhered to the pixel occurs.

  FIG. 3 is a diagram illustrating the configuration of the observation optical system 2 and the cutting laser unit 4. In FIG. 3, a variable slit 23 immediately below the laser unit 4 is for forming a laser processing shape, and is provided at the focal position of the imaging lens 24. Half mirrors 25 and 26 are provided below the imaging lens 24, and an objective lens 27 is further provided therebelow. A plurality of objective lenses 27 having different magnifications and a revolver for selecting an objective lens 27 having a desired magnification among them may be provided. The shape of the opening of the variable slit 23 is reduced at the magnification ratio of the objective lens 27 to obtain a processed shape. The light emitted from the epi-illumination light source 28 is irradiated to the white defect 20 or the like of the color filter 15 formed on the surface of the glass substrate 14 via the half mirror 26, and the image of the white defect 20 or the like is converted to the CCD via the half mirror 25. The image is picked up by the camera 29 and displayed on the monitor 3 of FIG.

  FIG. 4 is a partially omitted perspective view showing the configuration of the ink application mechanism 5. In FIG. 4, the ink application mechanism 5 includes an application needle 31 for applying ink and an application needle drive cylinder 32 for vertically driving the application needle 31. The application needle 31 is provided at the tip of the drive shaft 33 of the application needle drive cylinder 32 via the application needle holder 34 and the fixed base 35.

  The ink application mechanism 5 includes a rotary table 36 provided horizontally, and a plurality of ink tanks 37 to 40 are sequentially arranged on the rotary table 36 in the circumferential direction. A cleaning device 41 and an air purge device 42 are provided. A rotating shaft 43 is erected at the center of the rotary table 36. Further, the rotary table 36 is formed with a notch 44 for allowing the application needle 31 to pass when ink is applied. Ink tanks 37 to 40 are appropriately filled with R (red), G (green), B (blue), and black correction inks, respectively. The cleaning device 41 is for removing the correction ink attached to the application needle 31, and the air purge device 42 is for blowing off the cleaning liquid attached to the application needle 31.

  Further, the ink application mechanism 5 includes an index motor 45 for rotating the rotary shaft 43 of the rotary table 36, an index plate 46 that rotates together with the rotary shaft 43, and the rotary table 36 via the index plate 46. An index sensor 47 for detecting the rotational position and an origin return sensor 48 for detecting that the rotational position of the rotary table 36 has returned to the origin via the index plate 46 are provided. The motor 45 is controlled based on the outputs of the sensors 47 and 48, and rotates the rotary table 36 so that any one of the notch 44, the ink tanks 37 to 40, the cleaning device 41, and the air purge device 42 is placed below the application needle 31. Position.

  The application needle drive cylinder 32 and the motor 45 are fixed to the Z stage 12, and the Z stage 12 and the color filter 15 to be defect corrected are relatively positioned by the XY stage 10.

  Next, the operation of the ink application mechanism 5 will be described. First, the XY stage 10 and the Z stage 12 are driven, and the tip of the application needle 31 is positioned at a predetermined position above the white defect 20 of the R pixel 17, for example. Next, the rotary table 36 is rotated by the motor 45, and a desired ink tank (in this case 37) is moved below the application needle 31. Next, the application needle 31 is driven up and down by the application needle drive cylinder 32, and the correction ink 49 is attached to the tip of the application needle 31 as shown in FIG.

  Next, the rotary table 36 is rotated by the motor 45, and the notch 44 is moved below the application needle 31. Next, the application needle 31 is driven up and down by the application needle drive cylinder 32, and the correction ink 49 attached to the flat surface 31 a at the tip of the application needle 31 is applied to the R pixel 17 as shown in FIGS. It is applied to the white defect 20.

  When cleaning the application needle 31, the rotary table 36 is rotated by the motor 45, and the cleaning device 41 is moved below the application needle 31. Next, the application needle 31 is driven up and down by the application needle drive cylinder 32, and the correction ink 49 attached to the application needle 31 is washed. Next, the rotary table 36 is rotated by the motor 45, and the air purge device 42 is moved below the application needle 31. Next, the application needle 31 is driven up and down by the application needle drive cylinder 32, and the cleaning liquid adhering to the application needle 31 is blown away.

  FIGS. 6A to 6F are diagrams illustrating a method for correcting the foreign object defect 22 generated in the B pixel 19. 6A, 6C, and 6E are plan views of the B pixel 19, FIG. 6B is a cross-sectional view taken along the line VIA-VIA in FIG. 6A, and FIG. FIG. 6C is a cross-sectional view taken along the line VID-VID in FIG. 6C, and FIG. 6F is a cross-sectional view taken along the line VIF-VIF in FIG.

  As shown in FIGS. 6A and 6B, the foreign substance defect 22 is a pixel formed with the foreign substance 50 attached to the surface of the glass substrate 14. While observing the foreign object defect 22 on the monitor 3, the stages 10 and 12 are moved, the foreign object defect 22 is focused on the cutting laser unit 4, and the laser beam α is irradiated. The laser light α is shaped into a rectangle by the variable slit 23 in FIG. Thereby, as shown in FIGS. 6C and 6D, the foreign substance defect 22 is removed, and a rectangular hole 19 a is formed in the B pixel 19. Next, as shown in FIGS. 6E and 6F, the correction ink 49 is applied to the hole 19a by the method shown in FIGS. 5A to 5C.

  The correction ink 49 applied to the hole 19a is cured, and the correction of the foreign matter defect 22 is completed. When the correction ink 49 is an ultraviolet curable type, ultraviolet light is used as the light source 6 and the correction ink 49 is irradiated with ultraviolet rays. When the correction ink 49 is a thermosetting type or a dry curing type, halogen lamp illumination is adopted as the light source 6 and the correction ink 49 is irradiated with halogen lamp light.

  The black defect 21 is corrected by the same method as the foreign object defect 22. The white defect 20 may be corrected by the same method as the foreign object defect 22, or may be corrected by directly applying the correction ink 49 to the white defect 22 as shown in FIGS. .

  In such a pattern correction apparatus, the metal portion of the XY stage 10 or the ink application mechanism 5 may expand and contract with outside air or a temperature change in the apparatus, and the correction ink 49 may not be applied to the target position. In this embodiment, this problem is solved.

  As shown in FIG. 7, the host computer 8 monitors the elapsed time T immediately after the start of the apparatus, and after a certain time T1 has elapsed, displays a message or sounds a buzzer to notify the worker and Position correction is prompted (steps S1 and S2). When the operator confirms the message and presses the correction start button (step S3), the pattern correction apparatus 1 is set to the correction mode and the process returns to step S1 (step S4).

  As shown in FIG. 8, a mirror 51 which is a dummy substrate is installed at the end of the chuck base 11. As shown in FIG. 9, the surface of the mirror 51 is divided into a plurality of rows and columns of test areas 51a. In each correction mode, a test area 51a different from the test area 51a selected in the previous correction mode is selected. For example, as shown in FIG. 9, the plurality of test areas 51a in the first column are sequentially selected one by one downward in the figure, and then the plurality of test areas 51a in the second column are in the upper part in the figure. Are selected sequentially, and so on.

  As shown in FIG. 10, the pattern correction apparatus 1 set in the correction mode captures an image of the selected test area 51 a of the mirror 51 by the CCD camera 29 in step S <b> 11, and the captured image is input to the image processing unit 7. take in. Next, in step S12, the pattern correction device applies correction ink 49 to the target position P1 that is the center of the selected test area 51a.

  Specifically, the computer 8 or 9 gives a position command signal generated from the coordinates of the target position P1 and the correction value to the XY stage 10, and the XY stage 10 sets the position corresponding to the position command signal below the ink application mechanism 5. Move to. If the position command signal is correct, the correction ink 49 is applied to the target position P1, but if the position command signal is not correct, the application position where the target position P1 and the correction ink 49 are actually applied is shown in FIG. A positional deviation occurs with respect to P2. When a positional deviation occurs between the target position P1 and the application position P2, it is necessary to update the correction value.

  Next, in step S <b> 13, an image of the test area 51 a to which the correction ink 49 is applied is captured by the CCD camera 29, and the captured image is taken into the image processing unit 7. At this time, by using the incident light source 28 and the mirror 51 of FIG. 3 together, the contrast between the coating portion and the background can be sufficiently ensured.

  Next, in step S14, the actual application position P2 is detected by the image processing unit 7. That is, the image processing unit 7 compares the image before ink application shown in FIG. 12 (a) with the image after ink application shown in FIG. 12 (b). As shown in FIG. Unmatched portions 52 that do not match are extracted. Specifically, the brightness of the pixel at the position (x, y) of the image before ink application is a (x, y), and the brightness of the position (x, y) after ink application is b (x, y). ), A pixel in which the absolute value c of the difference between a (x, y) and b (x, y) is larger than a predetermined threshold value TH is extracted. In FIG. 12 (c), the portion 52 where the absolute value c is larger than the threshold value TH is represented in white, and the other portions are shaded. The image processing unit 7 obtains the center of gravity of the white portion 52 and sets the obtained center of gravity as the application position P2. In addition, when the white part 52 is circular, it is good also considering not the gravity center but the center position of a circumscribed rectangle as the application position P2.

  Assuming that the coordinates of the obtained application position P2 on the image are (gx, gy) and the coordinates of the target position P2 on the image are (tx, ty), the positional deviation amount (dx, dy) on the image is (dx, dy). dy) = (gx−tx, gy−ty). When the vertical and horizontal actual dimensions of one pixel on the image are (mx, my), the actual size value of the positional deviation amount is (dx × mx, dy × my). By adding this to the current correction value, the correction value is updated. In order to secure the reliability of the correction value, the amount of positional deviation may be obtained a plurality of times and the average value thereof may be used.

  The automatic correction may be executed immediately after the application needle 31 is replaced. Further, the correction operation may be automatically performed at an arbitrary timing, such as after loading or unloading the substrate, even if a message is displayed and no work instruction is given by the operator.

In this embodiment, since the correction work is automated, work efficiency is improved.
The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

1 is a perspective view showing an overall configuration of a pattern correction apparatus according to an embodiment of the present invention. It is a figure which shows the color filter which is a correction object of the pattern correction apparatus shown in FIG. It is a figure which shows the structure of the observation optical system shown in FIG. 1, and a laser part. It is a perspective view which shows the structure of the ink application | coating mechanism shown in FIG. It is a figure which shows operation | movement of the ink application | coating mechanism shown in FIG. It is a figure which shows the correction method of the foreign material defect shown in FIG. It is a flowchart which shows the starting method of the correction mode of the pattern correction apparatus shown in FIG. FIG. 1 is a view showing a mirror mounted on a chuck base. It is a figure which shows the usage method of the mirror shown in FIG. It is a flowchart which shows the correction mode of the pattern correction apparatus shown in FIG. It is a figure which shows the image after the ink application of the test area | region shown in FIG. It is a figure which shows the method of calculating | requiring an ink application position.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Pattern correction apparatus, 2 Observation optical system, 3 Monitor, 4 Cut laser part, 5 Ink application mechanism, 6 Ink curing light source, 7 Image processing part, 8 Host computer, 9 Control computer, 10 XY stage, 11 Chuck Stand, 12 Z stage, 15 color filter, 16 black matrix, 17 R pixel, 18 G pixel, 19 B pixel, 19 a hole, 20 white defect, 21 black defect, 22 foreign object defect, 23 variable slit, 24 imaging lens, 25, 26 Half mirror, 27 Objective lens, 28 Incident light source, 29 CCD camera, 31 Application needle, 31a Flat surface, 32 Application needle drive cylinder, 33 Drive shaft, 34 Application needle holder, 35 Fixed base, 36 Rotary table, 27 -40 ink tank, 41 cleaning device, 42 air purge device, 3 Rotating shaft, 44 Notch, 45 Index motor, 46 Index plate, 47 Index sensor, 48 Origin return sensor, 49 Correction ink, 50 Foreign matter, 51 Mirror, 51a Test area, P1 target position, P2 application position, 52 Unmatched part.

Claims (6)

In a pattern correction apparatus for correcting a defective portion of a fine pattern formed on a substrate,
A correction liquid application means for applying a correction liquid to the tip of the application needle and applying the correction liquid to the defective part by moving the application needle up and down;
Positioning means for moving the correction liquid applying means relative to the substrate in accordance with a position command signal;
Control means for generating the position command signal based on the coordinates of the target position where the correction liquid is to be applied and a correction value for correcting the positional deviation of the application needle, and for applying the correction liquid to the target position; ,
In the correction mode for updating the correction value, the coordinates of the target position are given to the control means to apply the correction liquid to the surface of the dummy substrate, and the target position and the application position where the correction liquid is actually applied And a correction means for updating the correction value based on the detection result ,
The correction means captures images of the surface of the dummy substrate before and after the correction liquid is applied by the application needle, compares the images before and after the application, extracts a mismatched portion where the brightness does not match, and extracts A pattern correcting apparatus, wherein the center of gravity position of the mismatched portion is determined as the application position . In a pattern correction apparatus for correcting a defective portion of a fine pattern formed on a substrate,
A correction liquid application means for applying a correction liquid to the tip of the application needle and applying the correction liquid to the defective part by moving the application needle up and down;
Positioning means for moving the correction liquid applying means relative to the substrate in accordance with a position command signal;
Control means for generating the position command signal based on the coordinates of the target position where the correction liquid is to be applied and a correction value for correcting the positional deviation of the application needle, and for applying the correction liquid to the target position; ,
In the correction mode for updating the correction value, the coordinates of the target position are given to the control means to apply the correction liquid to the surface of the dummy substrate, and the target position and the application position where the correction liquid is actually applied And a correction means for updating the correction value based on the detection result,
The correction means captures images of the surface of the dummy substrate before and after the correction liquid is applied by the application needle, compares the images before and after the application, extracts a mismatched portion where the brightness does not match, and extracts A pattern correction apparatus, wherein the center of a circumscribed rectangle of the mismatched portion is determined as the application position. The pattern correction apparatus according to claim 1, wherein the correction unit executes the correction mode at a predetermined cycle. Informing means for notifying an operator that the correction mode should be executed at a predetermined cycle,
The pattern correction apparatus according to claim 1 , wherein the correction unit executes the correction mode in response to an instruction to execute the correction mode by the operator. The dummy substrate is a mirror;
The correction means is characterized by capturing an image of the mirror by performing epi-illumination, the pattern adjustment device according to any one of claims 1 to 4. Surface prior Symbol dummy substrate is divided into a plurality of regions,
It said correcting means, the correction mode, select one of the regions of the plurality of areas, applied to said control means coordinates of the selected area as the coordinates of the previous SL-th target position,
Wherein the correction means, when selecting the region in the correction mode, characterized by you to select a region different from the selected area in the correction mode of the previous, to any of claims 1 to 5 The pattern correction apparatus as described.

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