KR101117655B1 - 프로브 및 선별장치 - Google Patents

프로브 및 선별장치 Download PDF

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Publication number
KR101117655B1
KR101117655B1 KR1020090069433A KR20090069433A KR101117655B1 KR 101117655 B1 KR101117655 B1 KR 101117655B1 KR 1020090069433 A KR1020090069433 A KR 1020090069433A KR 20090069433 A KR20090069433 A KR 20090069433A KR 101117655 B1 KR101117655 B1 KR 101117655B1
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KR
South Korea
Prior art keywords
sorting
wafer ring
unit
probe
loading
Prior art date
Application number
KR1020090069433A
Other languages
English (en)
Korean (ko)
Other versions
KR20100021359A (ko
Inventor
웨이-주 판
시아오-흥 린
융-친 리우
Original Assignee
엠피아이 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엠피아이 코포레이션 filed Critical 엠피아이 코포레이션
Publication of KR20100021359A publication Critical patent/KR20100021359A/ko
Application granted granted Critical
Publication of KR101117655B1 publication Critical patent/KR101117655B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020090069433A 2008-08-15 2009-07-29 프로브 및 선별장치 KR101117655B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW097131281 2008-08-15
TW097131281A TW201007868A (en) 2008-08-15 2008-08-15 Probing and sorting device

Publications (2)

Publication Number Publication Date
KR20100021359A KR20100021359A (ko) 2010-02-24
KR101117655B1 true KR101117655B1 (ko) 2012-03-20

Family

ID=42016448

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090069433A KR101117655B1 (ko) 2008-08-15 2009-07-29 프로브 및 선별장치

Country Status (3)

Country Link
JP (1) JP5008700B2 (ja)
KR (1) KR101117655B1 (ja)
TW (1) TW201007868A (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101707805B1 (ko) * 2015-09-15 2017-02-17 (주) 윈팩 웨이퍼 재구성 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990030793A (ko) * 1997-10-06 1999-05-06 윤종용 반도체 프로브 스테이션, 이의 냉각장치, 이의 냉각방법 그리고 이를 이용한 이디에스 방법
US6781363B2 (en) * 2001-06-21 2004-08-24 Han-Ping Chen Memory sorting method and apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01202832A (ja) * 1988-02-08 1989-08-15 Nec Kyushu Ltd 半導体製造装置のプローバー
JP2000162275A (ja) * 1998-12-01 2000-06-16 Fujitsu Ltd 半導体試験方法及び半導体試験装置
JP2001021617A (ja) * 1999-07-07 2001-01-26 Tesetsuku:Kk 電子部品の搬送方法及び搬送装置
JP2008172203A (ja) * 2007-11-19 2008-07-24 Hitachi High-Technologies Corp 半導体チップの選別装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990030793A (ko) * 1997-10-06 1999-05-06 윤종용 반도체 프로브 스테이션, 이의 냉각장치, 이의 냉각방법 그리고 이를 이용한 이디에스 방법
US6781363B2 (en) * 2001-06-21 2004-08-24 Han-Ping Chen Memory sorting method and apparatus

Also Published As

Publication number Publication date
TWI368966B (ja) 2012-07-21
JP2010045349A (ja) 2010-02-25
KR20100021359A (ko) 2010-02-24
TW201007868A (en) 2010-02-16
JP5008700B2 (ja) 2012-08-22

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