KR101112979B1 - 표면 처리 동박과 그 표면 처리 방법, 및 적층 회로 기판 - Google Patents
표면 처리 동박과 그 표면 처리 방법, 및 적층 회로 기판 Download PDFInfo
- Publication number
- KR101112979B1 KR101112979B1 KR1020080095888A KR20080095888A KR101112979B1 KR 101112979 B1 KR101112979 B1 KR 101112979B1 KR 1020080095888 A KR1020080095888 A KR 1020080095888A KR 20080095888 A KR20080095888 A KR 20080095888A KR 101112979 B1 KR101112979 B1 KR 101112979B1
- Authority
- KR
- South Korea
- Prior art keywords
- copper foil
- surface treatment
- circuit board
- treated
- peel strength
- Prior art date
Links
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/12—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/20—Zinc
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/22—Nickel or cobalt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007304396 | 2007-11-26 | ||
JPJP-P-2007-00304396 | 2007-11-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090054368A KR20090054368A (ko) | 2009-05-29 |
KR101112979B1 true KR101112979B1 (ko) | 2012-04-18 |
Family
ID=40741818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080095888A KR101112979B1 (ko) | 2007-11-26 | 2008-09-30 | 표면 처리 동박과 그 표면 처리 방법, 및 적층 회로 기판 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5075099B2 (ja) |
KR (1) | KR101112979B1 (ja) |
CN (1) | CN101445947B (ja) |
TW (1) | TW200934330A (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5650023B2 (ja) * | 2011-03-03 | 2015-01-07 | Jx日鉱日石金属株式会社 | プリント配線板用銅箔及びそれを用いた積層板 |
KR101315364B1 (ko) * | 2011-03-11 | 2013-10-07 | 엘에스엠트론 주식회사 | 내열성이 개선된 표면 처리 동박 및 그 제조방법 |
JP6487704B2 (ja) * | 2015-02-12 | 2019-03-20 | 福田金属箔粉工業株式会社 | 処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板 |
JP6023367B1 (ja) * | 2015-06-17 | 2016-11-09 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP7085394B2 (ja) * | 2018-04-13 | 2022-06-16 | 東洋鋼鈑株式会社 | 積層電解箔 |
JP7014884B1 (ja) * | 2020-12-23 | 2022-02-01 | Jx金属株式会社 | 表面処理銅箔、銅張積層板及びプリント配線板 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4758479A (en) * | 1987-03-30 | 1988-07-19 | General Motors Corporation | Corrosion resistant nickel-zinc-phosphorus coating and method of electroplating said coating |
JP2000178787A (ja) | 1998-12-14 | 2000-06-27 | Nikko Materials Co Ltd | 光沢面の耐酸化性に優れた銅箔及びその製造方法 |
JP2000269637A (ja) * | 1999-03-18 | 2000-09-29 | Furukawa Circuit Foil Kk | 高密度超微細配線板用銅箔 |
KR20070003880A (ko) * | 2004-02-17 | 2007-01-05 | 닛코킨조쿠 가부시키가이샤 | 흑화 처리 면 또는 층을 가지는 동박 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4202840B2 (ja) * | 2003-06-26 | 2008-12-24 | 日鉱金属株式会社 | 銅箔及びその製造方法 |
JP2005064110A (ja) * | 2003-08-08 | 2005-03-10 | Tdk Corp | 電子部品用部材並びにこれを用いた電子部品 |
JP2005344174A (ja) * | 2004-06-03 | 2005-12-15 | Mitsui Mining & Smelting Co Ltd | 表面処理銅箔及びその表面処理銅箔を用いて製造したフレキシブル銅張積層板並びにフィルムキャリアテープ |
JP4652020B2 (ja) * | 2004-11-16 | 2011-03-16 | 新日鐵化学株式会社 | 銅張り積層板 |
-
2008
- 2008-09-08 TW TW097134379A patent/TW200934330A/zh unknown
- 2008-09-27 CN CN200810168887XA patent/CN101445947B/zh active Active
- 2008-09-30 KR KR1020080095888A patent/KR101112979B1/ko active IP Right Grant
- 2008-11-25 JP JP2008299671A patent/JP5075099B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4758479A (en) * | 1987-03-30 | 1988-07-19 | General Motors Corporation | Corrosion resistant nickel-zinc-phosphorus coating and method of electroplating said coating |
JP2000178787A (ja) | 1998-12-14 | 2000-06-27 | Nikko Materials Co Ltd | 光沢面の耐酸化性に優れた銅箔及びその製造方法 |
JP2000269637A (ja) * | 1999-03-18 | 2000-09-29 | Furukawa Circuit Foil Kk | 高密度超微細配線板用銅箔 |
KR20070003880A (ko) * | 2004-02-17 | 2007-01-05 | 닛코킨조쿠 가부시키가이샤 | 흑화 처리 면 또는 층을 가지는 동박 |
Also Published As
Publication number | Publication date |
---|---|
CN101445947A (zh) | 2009-06-03 |
CN101445947B (zh) | 2011-04-27 |
KR20090054368A (ko) | 2009-05-29 |
JP5075099B2 (ja) | 2012-11-14 |
JP2009149977A (ja) | 2009-07-09 |
TWI376174B (ja) | 2012-11-01 |
TW200934330A (en) | 2009-08-01 |
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