KR101112979B1 - 표면 처리 동박과 그 표면 처리 방법, 및 적층 회로 기판 - Google Patents

표면 처리 동박과 그 표면 처리 방법, 및 적층 회로 기판 Download PDF

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Publication number
KR101112979B1
KR101112979B1 KR1020080095888A KR20080095888A KR101112979B1 KR 101112979 B1 KR101112979 B1 KR 101112979B1 KR 1020080095888 A KR1020080095888 A KR 1020080095888A KR 20080095888 A KR20080095888 A KR 20080095888A KR 101112979 B1 KR101112979 B1 KR 101112979B1
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KR
South Korea
Prior art keywords
copper foil
surface treatment
circuit board
treated
peel strength
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KR1020080095888A
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English (en)
Korean (ko)
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KR20090054368A (ko
Inventor
후지사와 사토시
스즈키 유우지
Original Assignee
후루카와 덴키 고교 가부시키가이샤
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Publication of KR20090054368A publication Critical patent/KR20090054368A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/20—Zinc
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/22—Nickel or cobalt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
KR1020080095888A 2007-11-26 2008-09-30 표면 처리 동박과 그 표면 처리 방법, 및 적층 회로 기판 Active KR101112979B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00304396 2007-11-26
JP2007304396 2007-11-26

Publications (2)

Publication Number Publication Date
KR20090054368A KR20090054368A (ko) 2009-05-29
KR101112979B1 true KR101112979B1 (ko) 2012-04-18

Family

ID=40741818

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080095888A Active KR101112979B1 (ko) 2007-11-26 2008-09-30 표면 처리 동박과 그 표면 처리 방법, 및 적층 회로 기판

Country Status (4)

Country Link
JP (1) JP5075099B2 (https=)
KR (1) KR101112979B1 (https=)
CN (1) CN101445947B (https=)
TW (1) TW200934330A (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5650023B2 (ja) * 2011-03-03 2015-01-07 Jx日鉱日石金属株式会社 プリント配線板用銅箔及びそれを用いた積層板
KR101315364B1 (ko) * 2011-03-11 2013-10-07 엘에스엠트론 주식회사 내열성이 개선된 표면 처리 동박 및 그 제조방법
JP6487704B2 (ja) * 2015-02-12 2019-03-20 福田金属箔粉工業株式会社 処理銅箔及び該処理銅箔を用いた銅張積層板並びにプリント配線板
JP6023367B1 (ja) * 2015-06-17 2016-11-09 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP7085394B2 (ja) * 2018-04-13 2022-06-16 東洋鋼鈑株式会社 積層電解箔
JP7014884B1 (ja) * 2020-12-23 2022-02-01 Ｊｘ金属株式会社 表面処理銅箔、銅張積層板及びプリント配線板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758479A (en) * 1987-03-30 1988-07-19 General Motors Corporation Corrosion resistant nickel-zinc-phosphorus coating and method of electroplating said coating
JP2000178787A (ja) 1998-12-14 2000-06-27 Nikko Materials Co Ltd 光沢面の耐酸化性に優れた銅箔及びその製造方法
JP2000269637A (ja) * 1999-03-18 2000-09-29 Furukawa Circuit Foil Kk 高密度超微細配線板用銅箔
KR20070003880A (ko) * 2004-02-17 2007-01-05 닛코킨조쿠 가부시키가이샤 흑화 처리 면 또는 층을 가지는 동박

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4202840B2 (ja) * 2003-06-26 2008-12-24 日鉱金属株式会社 銅箔及びその製造方法
JP2005064110A (ja) * 2003-08-08 2005-03-10 Tdk Corp 電子部品用部材並びにこれを用いた電子部品
JP2005344174A (ja) * 2004-06-03 2005-12-15 Mitsui Mining & Smelting Co Ltd 表面処理銅箔及びその表面処理銅箔を用いて製造したフレキシブル銅張積層板並びにフィルムキャリアテープ
JP4652020B2 (ja) * 2004-11-16 2011-03-16 新日鐵化学株式会社 銅張り積層板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4758479A (en) * 1987-03-30 1988-07-19 General Motors Corporation Corrosion resistant nickel-zinc-phosphorus coating and method of electroplating said coating
JP2000178787A (ja) 1998-12-14 2000-06-27 Nikko Materials Co Ltd 光沢面の耐酸化性に優れた銅箔及びその製造方法
JP2000269637A (ja) * 1999-03-18 2000-09-29 Furukawa Circuit Foil Kk 高密度超微細配線板用銅箔
KR20070003880A (ko) * 2004-02-17 2007-01-05 닛코킨조쿠 가부시키가이샤 흑화 처리 면 또는 층을 가지는 동박

Also Published As

Publication number Publication date
CN101445947B (zh) 2011-04-27
TWI376174B (https=) 2012-11-01
CN101445947A (zh) 2009-06-03
KR20090054368A (ko) 2009-05-29
JP2009149977A (ja) 2009-07-09
TW200934330A (en) 2009-08-01
JP5075099B2 (ja) 2012-11-14

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