KR101111932B1 - 다층 프린트 배선판, 및 다층 프린트 배선판의 제조 방법 - Google Patents
다층 프린트 배선판, 및 다층 프린트 배선판의 제조 방법 Download PDFInfo
- Publication number
- KR101111932B1 KR101111932B1 KR1020097018942A KR20097018942A KR101111932B1 KR 101111932 B1 KR101111932 B1 KR 101111932B1 KR 1020097018942 A KR1020097018942 A KR 1020097018942A KR 20097018942 A KR20097018942 A KR 20097018942A KR 101111932 B1 KR101111932 B1 KR 101111932B1
- Authority
- KR
- South Korea
- Prior art keywords
- conductor circuit
- layer
- wiring board
- printed wiring
- insulating layer
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/073—Displacement plating, substitution plating or immersion plating, e.g. for finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
필 강도 (N/cm) | ||
초기 단계 | 가습 시험 후 | |
실시예 1 | 10.68 | 7.15 |
비교예 1 | 7.35 | 0 |
비교예 2 | 5.88 | 0 |
Claims (12)
- 제 1 층간 수지 절연층과,상기 제 1 층간 수지 절연층 상에 형성되어 있는 제 1 도체 회로와,상기 제 1 층간 수지 절연층과 상기 제 1 도체 회로 상에 형성되고, 상기 제 1 도체 회로에 도달하는 개구부를 갖는 제 2 층간 수지 절연층과,상기 제 2 층간 수지 절연층 상에 형성되어 있는 제 2 도체 회로와,상기 개구부 내에 형성되고, 상기 제 1 도체 회로와 상기 제 2 도체 회로를 접속시키는 비아 도체를 구비하는 다층 프린트 배선판으로서,상기 제 1 도체 회로의 표면은 평탄하고,상기 제 1 도체 회로의 표면에, Sn, Ni, Zn, Co, Ti, Pd, Ag, Pt 및 Au 중 적어도 1 종의 금속을 포함하는 금속층이 형성되고,상기 금속층 상에 커플링제로 이루어지는 피막이 형성되고,상기 비아 도체의 바닥부의 적어도 일부가 상기 제 1 도체 회로와 직접 접속되어 있는 것을 특징으로 하는 다층 프린트 배선판.
- 제 1 항에 있어서,상기 비아 도체의 바닥부 전체가 상기 제 1 도체 회로와 직접 접속되어 있는, 다층 프린트 배선판.
- 제 1 항에 있어서,상기 제 1 도체 회로는, 상기 제 1 층간 수지 절연층 상에 형성된 무전해 도금막과, 상기 무전해 도금막 상에 형성된 전해 도금막으로 이루어지고,상기 비아 도체는, 상기 개구부의 내벽면 및 상기 개구부의 바닥면을 구성하는 상기 제 1 도체 회로의 표면에 형성된 무전해 도금막과, 상기 무전해 도금막 상에 형성된 전해 도금막으로 이루어지는, 다층 프린트 배선판.
- 제 3 항에 있어서,상기 제 1 도체 회로를 구성하는 전해 도금막과, 상기 비아 도체를 구성하는 무전해 도금막이 구리로 이루어지는, 다층 프린트 배선판.
- 제 1 항 내지 제 4 항 중 어느 한 항에 있어서,상기 금속층을 구성하는 금속으로서, 그 산화물의 등전점이 5 이하인 금속을 포함하는, 다층 프린트 배선판.
- 제 1 항 내지 제 4 항 중 어느 한 항에 있어서,상기 금속층은 Sn 을 포함하는 금속층인, 다층 프린트 배선판.
- 삭제
- 제 1 층간 수지 절연층을 형성하는 공정과,상기 제 1 층간 수지 절연층 상에, 평탄한 표면을 갖는 제 1 도체 회로를 형성하는 공정과,상기 제 1 도체 회로 표면의 적어도 일부에, Sn, Ni, Zn, Co, Ti, Pd, Ag, Pt 및 Au 중 적어도 1 종의 금속을 포함하는 금속층을 형성하는 공정과,상기 금속층 상에 커플링제로 이루어지는 피막을 형성하는 공정과,상기 제 1 층간 수지 절연층과 상기 평탄한 표면을 갖는 제 1 도체 회로 상에, 제 2 층간 수지 절연층을 형성하는 공정과,상기 제 2 층간 수지 절연층을 관통하는 개구부를 형성하는 공정과,상기 개구부로부터 노출되는 상기 금속층을 제거하는 공정과,상기 제 2 층간 수지 절연층 상에 제 2 도체 회로를 형성하는 공정과,상기 개구부에, 상기 제 1 도체 회로와 상기 제 2 도체 회로를 접속시키는 비아 도체를 형성하는 공정을 구비하는 것을 특징으로 하는 다층 프린트 배선판의 제조 방법.
- 제 8 항에 있어서,상기 개구부로부터 노출되는 상기 금속층을, 과망간산 수용액을 이용하여 제거하는, 다층 프린트 배선판의 제조 방법.
- 제 8 항에 있어서,상기 개구부를 형성함으로써 발생되는 수지 잔사의 제거와, 상기 개구부 아래에 위치하는 상기 금속층의 제거를 동시에 실시하는, 다층 프린트 배선판의 제조 방법.
- 제 8 항 내지 제 10 항 중 어느 한 항에 있어서,상기 금속층을 형성하는 공정에 있어서, 상기 제 1 도체 회로가 노출되어 있는 면 전체에 Sn 도금에 의해 상기 금속층을 형성하는, 다층 프린트 배선판의 제조 방법.
- 제 8 항 내지 제 10 항 중 어느 한 항에 있어서,상기 제 2 도체 회로를 형성하는 공정과 상기 비아 도체를 형성하는 공정을 동시에 실시하는, 다층 프린트 배선판의 제조 방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10145908P | 2008-09-30 | 2008-09-30 | |
US61/101,459 | 2008-09-30 | ||
PCT/JP2009/062818 WO2010038531A1 (ja) | 2008-09-30 | 2009-07-15 | 多層プリント配線板、及び、多層プリント配線板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20100061408A KR20100061408A (ko) | 2010-06-07 |
KR101111932B1 true KR101111932B1 (ko) | 2012-03-14 |
Family
ID=42073308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020097018942A KR101111932B1 (ko) | 2008-09-30 | 2009-07-15 | 다층 프린트 배선판, 및 다층 프린트 배선판의 제조 방법 |
Country Status (7)
Country | Link |
---|---|
US (2) | US8633400B2 (ko) |
EP (1) | EP2200413A4 (ko) |
JP (1) | JP5033192B2 (ko) |
KR (1) | KR101111932B1 (ko) |
CN (2) | CN101790903B (ko) |
TW (1) | TWI394508B (ko) |
WO (1) | WO2010038531A1 (ko) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4951674B2 (ja) * | 2008-09-30 | 2012-06-13 | イビデン株式会社 | 多層プリント配線板、及び、多層プリント配線板の製造方法 |
KR101051491B1 (ko) * | 2009-10-28 | 2011-07-22 | 삼성전기주식회사 | 다층 경연성 인쇄회로기판 및 다층 경연성 인쇄회로기판의 제조방법 |
TW201118059A (en) * | 2009-11-20 | 2011-06-01 | Holy Stone Entpr Co Ltd | Manufacturing process for high precision ceramic substrate |
TW201118940A (en) * | 2009-11-20 | 2011-06-01 | Holy Stone Entpr Co Ltd | Ceramic substrate manufacturing method |
KR20120097413A (ko) * | 2009-12-30 | 2012-09-03 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 패턴화된 기재를 제공하기 위해 마스크를 사용하는 방법 |
JP5512562B2 (ja) * | 2010-03-29 | 2014-06-04 | 日本特殊陶業株式会社 | 多層配線基板 |
JP2012182437A (ja) * | 2011-02-09 | 2012-09-20 | Ngk Spark Plug Co Ltd | 配線基板及びその製造方法 |
JP2012216773A (ja) * | 2011-03-29 | 2012-11-08 | Shinko Electric Ind Co Ltd | 配線基板及びその製造方法 |
JP5540276B2 (ja) * | 2011-03-31 | 2014-07-02 | Tdk株式会社 | 電子部品内蔵基板及びその製造方法 |
EP2603064A1 (en) * | 2011-12-08 | 2013-06-12 | Atotech Deutschland GmbH | Multilayer printed circuit board manufacture |
TWI444123B (zh) * | 2012-02-16 | 2014-07-01 | Via Tech Inc | 線路板製作方法及線路板 |
JP6009300B2 (ja) * | 2012-09-27 | 2016-10-19 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
US9520222B2 (en) * | 2012-09-28 | 2016-12-13 | Ibiden Co., Ltd. | Wiring board and method for manufacturing wiring board |
US10433421B2 (en) * | 2012-12-26 | 2019-10-01 | Intel Corporation | Reduced capacitance land pad |
CN103384448A (zh) * | 2013-06-27 | 2013-11-06 | 清华大学 | 印刷电路板及表面处理方法 |
JP6424610B2 (ja) * | 2014-04-23 | 2018-11-21 | ソニー株式会社 | 半導体装置、および製造方法 |
US9418951B2 (en) * | 2014-05-15 | 2016-08-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor structure with composite barrier layer under redistribution layer and manufacturing method thereof |
US9832866B2 (en) * | 2015-06-29 | 2017-11-28 | Samsung Electro-Mechanics Co., Ltd. | Multilayered substrate and method of manufacturing the same |
US10455708B2 (en) | 2015-06-29 | 2019-10-22 | Samsung Electro-Mechanics Co., Ltd. | Multilayered substrate and method for manufacturing the same |
JP6819608B2 (ja) * | 2015-11-30 | 2021-01-27 | 凸版印刷株式会社 | 多層プリント配線基板及びその製造方法 |
CN109643837B (zh) * | 2016-11-29 | 2021-09-10 | 株式会社村田制作所 | 磁场耦合元件、天线装置以及电子设备 |
KR102618832B1 (ko) * | 2022-11-25 | 2023-12-29 | 주식회사 호진플라텍 | 구리-주석 합금층의 형성방법 |
US11919036B1 (en) | 2023-04-21 | 2024-03-05 | Yield Engineering Systems, Inc. | Method of improving the adhesion strength of metal-organic interfaces in electronic devices |
US11818849B1 (en) | 2023-04-21 | 2023-11-14 | Yield Engineering Systems, Inc. | Increasing adhesion of metal-organic interfaces by silane vapor treatment |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5925297A (ja) * | 1982-08-03 | 1984-02-09 | 日本電解株式会社 | 印刷回路用銅箔 |
JP2776886B2 (ja) * | 1989-05-31 | 1998-07-16 | イビデン株式会社 | 多層プリント配線板およびその製造方法 |
JP2001144446A (ja) * | 1999-04-06 | 2001-05-25 | Ibiden Co Ltd | 多層プリント配線板の製造方法および多層プリント配線板 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2570394B2 (ja) | 1988-07-08 | 1997-01-08 | 富士電機株式会社 | 缶商品自動販売機の商品加熱装置 |
JP3054018B2 (ja) * | 1993-12-28 | 2000-06-19 | イビデン株式会社 | プリント配線板の製造方法 |
WO1999044403A1 (fr) * | 1998-02-26 | 1999-09-02 | Ibiden Co., Ltd. | Carte a circuits imprimes multicouche avec structure de trous d'interconnexion pleins |
MY144503A (en) * | 1998-09-14 | 2011-09-30 | Ibiden Co Ltd | Printed circuit board and method for its production |
MY139405A (en) | 1998-09-28 | 2009-09-30 | Ibiden Co Ltd | Printed circuit board and method for its production |
JP2000340948A (ja) | 1999-06-01 | 2000-12-08 | Mec Kk | 銅と樹脂との接着性を向上させる方法およびそれを用いて製造される多層配線板 |
DE60031680T2 (de) * | 1999-06-02 | 2007-09-06 | Ibiden Co., Ltd., Ogaki | Mehrschichtige, gedruckte leiterplatte und herstellungsmethode für eine mehrschichtige, gedruckte leiterplatte |
JP4016078B2 (ja) * | 2000-01-18 | 2007-12-05 | 株式会社東亜電化 | プリント配線板の製造方法および多層プリント配線板 |
US6800169B2 (en) * | 2001-01-08 | 2004-10-05 | Fujitsu Limited | Method for joining conductive structures and an electrical conductive article |
JP3654354B2 (ja) * | 2001-05-28 | 2005-06-02 | 学校法人早稲田大学 | 超lsi配線板及びその製造方法 |
TW584596B (en) * | 2001-12-10 | 2004-04-21 | Mitsui Chemicals Inc | Method for manufacturing a polyimide and metal compound sheet |
JP3807312B2 (ja) | 2002-01-18 | 2006-08-09 | 富士通株式会社 | プリント基板とその製造方法 |
TW200507131A (en) * | 2003-07-02 | 2005-02-16 | North Corp | Multi-layer circuit board for electronic device |
KR100557540B1 (ko) * | 2004-07-26 | 2006-03-03 | 삼성전기주식회사 | Bga 패키지 기판 및 그 제작 방법 |
TWI299248B (en) * | 2004-09-09 | 2008-07-21 | Phoenix Prec Technology Corp | Method for fabricating conductive bumps of a circuit board |
EP1729552A3 (en) * | 2005-06-03 | 2009-01-07 | Ngk Spark Plug Co., Ltd. | Wiring board and manufacturing method of wiring board |
JP2007107080A (ja) * | 2005-10-17 | 2007-04-26 | Hitachi Chem Co Ltd | 銅の表面処理方法及び銅表面 |
TWI278265B (en) * | 2006-01-09 | 2007-04-01 | Phoenix Prec Technology Corp | Method for fabricating circuit board with electrically conducting structure and the same |
DE102007045794A1 (de) * | 2006-09-27 | 2008-04-17 | MEC Co., Ltd., Amagasaki | Haftvermittler für Harz und Verfahren zur Erzeugung eines Laminates, umfassend den Haftvermittler |
US8314348B2 (en) * | 2008-03-03 | 2012-11-20 | Ibiden Co., Ltd. | Multilayer printed wiring board and method of manufacturing multilayer printed wiring board |
US20090218119A1 (en) | 2008-03-03 | 2009-09-03 | Ibiden Co., Ltd | Method of manufacturing multilayer printed wiring board |
JP4951674B2 (ja) | 2008-09-30 | 2012-06-13 | イビデン株式会社 | 多層プリント配線板、及び、多層プリント配線板の製造方法 |
-
2009
- 2009-07-15 CN CN2009800001904A patent/CN101790903B/zh active Active
- 2009-07-15 KR KR1020097018942A patent/KR101111932B1/ko active IP Right Grant
- 2009-07-15 JP JP2009533604A patent/JP5033192B2/ja active Active
- 2009-07-15 CN CN201110441869.6A patent/CN102573268B/zh active Active
- 2009-07-15 EP EP09817568A patent/EP2200413A4/en not_active Withdrawn
- 2009-07-15 WO PCT/JP2009/062818 patent/WO2010038531A1/ja active Application Filing
- 2009-08-03 TW TW098126087A patent/TWI394508B/zh active
- 2009-09-28 US US12/568,467 patent/US8633400B2/en active Active
-
2011
- 2011-12-08 US US13/314,689 patent/US9038266B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5925297A (ja) * | 1982-08-03 | 1984-02-09 | 日本電解株式会社 | 印刷回路用銅箔 |
JP2776886B2 (ja) * | 1989-05-31 | 1998-07-16 | イビデン株式会社 | 多層プリント配線板およびその製造方法 |
JP2001144446A (ja) * | 1999-04-06 | 2001-05-25 | Ibiden Co Ltd | 多層プリント配線板の製造方法および多層プリント配線板 |
Also Published As
Publication number | Publication date |
---|---|
CN101790903A (zh) | 2010-07-28 |
CN102573268A (zh) | 2012-07-11 |
TW201021659A (en) | 2010-06-01 |
CN101790903B (zh) | 2012-04-11 |
US9038266B2 (en) | 2015-05-26 |
EP2200413A1 (en) | 2010-06-23 |
US20100126758A1 (en) | 2010-05-27 |
JP5033192B2 (ja) | 2012-09-26 |
US8633400B2 (en) | 2014-01-21 |
KR20100061408A (ko) | 2010-06-07 |
JPWO2010038531A1 (ja) | 2012-03-01 |
EP2200413A4 (en) | 2011-12-14 |
CN102573268B (zh) | 2015-03-11 |
US20120082779A1 (en) | 2012-04-05 |
TWI394508B (zh) | 2013-04-21 |
WO2010038531A1 (ja) | 2010-04-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101111932B1 (ko) | 다층 프린트 배선판, 및 다층 프린트 배선판의 제조 방법 | |
KR101111930B1 (ko) | 다층 프린트 배선판, 및 다층 프린트 배선판의 제조 방법 | |
US8901431B2 (en) | Printed wiring board and method for manufacturing printed wiring board | |
US7227250B2 (en) | Ball grid array substrate having window and method of fabricating same | |
JP5216078B2 (ja) | 多層プリント配線板、及び、多層プリント配線板の製造方法 | |
US8436252B2 (en) | Printed wiring board and method for manufacturing the same | |
WO2010035866A1 (ja) | 半導体素子搭載用パッケージ基板とその製造方法 | |
JP4703067B2 (ja) | Icチップ実装用基板の製造方法 | |
JP2003234432A (ja) | 半導体チップ実装回路基板および多層化回路基板 | |
JP2005159330A (ja) | 多層回路基板の製造方法及びこれから得られる多層回路基板、半導体チップ搭載基板並びにこの基板を用いた半導体パッケージ | |
JP2003234431A (ja) | 半導体チップ実装回路基板とその製造方法および多層化回路基板 | |
JP2002204075A (ja) | 多層プリント配線板の製造方法 | |
JP2002204076A (ja) | 多層プリント配線板およびその製造方法 | |
JP2011159695A (ja) | 半導体素子搭載用パッケージ基板及びその製造方法 | |
CN114245611A (zh) | 布线基板和布线基板的制造方法 | |
JP2002204074A (ja) | 多層プリント配線板 | |
JP2003069228A (ja) | 樹脂充填用マスクおよび多層プリント配線板の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20150105 Year of fee payment: 4 |
|
FPAY | Annual fee payment |
Payment date: 20160104 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20170102 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20180103 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20190103 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20200103 Year of fee payment: 9 |