KR101109916B1 - 마이크로폰 감지 소자 및 그 형성 방법 - Google Patents

마이크로폰 감지 소자 및 그 형성 방법 Download PDF

Info

Publication number
KR101109916B1
KR101109916B1 KR1020077011994A KR20077011994A KR101109916B1 KR 101109916 B1 KR101109916 B1 KR 101109916B1 KR 1020077011994 A KR1020077011994 A KR 1020077011994A KR 20077011994 A KR20077011994 A KR 20077011994A KR 101109916 B1 KR101109916 B1 KR 101109916B1
Authority
KR
South Korea
Prior art keywords
diaphragm
substrate
delete delete
sensing element
microphone sensing
Prior art date
Application number
KR1020077011994A
Other languages
English (en)
Korean (ko)
Other versions
KR20070104522A (ko
Inventor
제 왕
유보 미아오
Original Assignee
산동 겟탑 어쿠스틱 캄파니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 산동 겟탑 어쿠스틱 캄파니 리미티드 filed Critical 산동 겟탑 어쿠스틱 캄파니 리미티드
Publication of KR20070104522A publication Critical patent/KR20070104522A/ko
Application granted granted Critical
Publication of KR101109916B1 publication Critical patent/KR101109916B1/ko

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Sensors (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
KR1020077011994A 2004-10-29 2004-11-29 마이크로폰 감지 소자 및 그 형성 방법 KR101109916B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/977,692 2004-10-29
US10/977,692 US7346178B2 (en) 2004-10-29 2004-10-29 Backplateless silicon microphone
PCT/SG2004/000385 WO2006046927A2 (fr) 2004-10-29 2004-11-29 Microphone silicium sans plaque arriere

Publications (2)

Publication Number Publication Date
KR20070104522A KR20070104522A (ko) 2007-10-26
KR101109916B1 true KR101109916B1 (ko) 2012-03-13

Family

ID=36228181

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077011994A KR101109916B1 (ko) 2004-10-29 2004-11-29 마이크로폰 감지 소자 및 그 형성 방법

Country Status (6)

Country Link
US (2) US7346178B2 (fr)
JP (1) JP2008518549A (fr)
KR (1) KR101109916B1 (fr)
CN (2) CN101453682B (fr)
TW (1) TWI295543B (fr)
WO (1) WO2006046927A2 (fr)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10216259B2 (en) * 2000-02-14 2019-02-26 Pierre Bonnat Method and system for processing signals that control a device using human breath
AU5030100A (en) * 1999-05-19 2000-12-05 California Institute Of Technology High performance mems thin-film teflon electret microphone
US7346178B2 (en) * 2004-10-29 2008-03-18 Silicon Matrix Pte. Ltd. Backplateless silicon microphone
US7795695B2 (en) * 2005-01-27 2010-09-14 Analog Devices, Inc. Integrated microphone
US7449356B2 (en) * 2005-04-25 2008-11-11 Analog Devices, Inc. Process of forming a microphone using support member
US7885423B2 (en) 2005-04-25 2011-02-08 Analog Devices, Inc. Support apparatus for microphone diaphragm
US7825484B2 (en) * 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
US20070147650A1 (en) * 2005-12-07 2007-06-28 Lee Sung Q Microphone and speaker having plate spring structure and speech recognition/synthesizing device using the microphone and the speaker
JP4797829B2 (ja) * 2006-06-26 2011-10-19 ヤマハ株式会社 コンデンサマイクロホン及びコンデンサマイクロホンの製造方法
EP2044802B1 (fr) * 2006-07-25 2013-03-27 Analog Devices, Inc. Système à microphones multiples
US7804969B2 (en) * 2006-08-07 2010-09-28 Shandong Gettop Acoustic Co., Ltd. Silicon microphone with impact proof structure
US8165323B2 (en) 2006-11-28 2012-04-24 Zhou Tiansheng Monolithic capacitive transducer
WO2008067431A2 (fr) * 2006-11-30 2008-06-05 Analog Devices, Inc. Système de microphone avec microphone en silicium fixé à un couvercle plat
EP1931173B1 (fr) * 2006-12-06 2011-07-20 Electronics and Telecommunications Research Institute Microphone condensateur doté d'un diaphragme d'articulation en flexion et son procédé de fabrication
US8121315B2 (en) * 2007-03-21 2012-02-21 Goer Tek Inc. Condenser microphone chip
CN101321408B (zh) * 2007-06-06 2012-12-12 歌尔声学股份有限公司 内旋转梁振膜及其组成的传声器芯片
CN101321407B (zh) * 2007-06-06 2012-12-26 歌尔声学股份有限公司 梁式振膜组成的传声器芯片
US8103027B2 (en) * 2007-06-06 2012-01-24 Analog Devices, Inc. Microphone with reduced parasitic capacitance
DE102007029911A1 (de) * 2007-06-28 2009-01-02 Robert Bosch Gmbh Akustisches Sensorelement
US7571650B2 (en) * 2007-07-30 2009-08-11 Hewlett-Packard Development Company, L.P. Piezo resistive pressure sensor
US8144899B2 (en) * 2007-10-01 2012-03-27 Industrial Technology Research Institute Acoustic transducer and microphone using the same
US8045733B2 (en) * 2007-10-05 2011-10-25 Shandong Gettop Acoustic Co., Ltd. Silicon microphone with enhanced impact proof structure using bonding wires
TW200919593A (en) * 2007-10-18 2009-05-01 Asia Pacific Microsystems Inc Elements and modules with micro caps and wafer level packaging method thereof
TWI358235B (en) 2007-12-14 2012-02-11 Ind Tech Res Inst Sensing membrane and micro-electro-mechanical syst
US8467559B2 (en) * 2008-02-20 2013-06-18 Shandong Gettop Acoustic Co., Ltd. Silicon microphone without dedicated backplate
JP5374077B2 (ja) * 2008-06-16 2013-12-25 ローム株式会社 Memsセンサ
US7979415B2 (en) * 2008-09-04 2011-07-12 Microsoft Corporation Predicting future queries from log data
JP2010098518A (ja) * 2008-10-16 2010-04-30 Rohm Co Ltd Memsセンサの製造方法およびmemsセンサ
US8218286B2 (en) * 2008-11-12 2012-07-10 Taiwan Semiconductor Manufacturing Company, Ltd. MEMS microphone with single polysilicon film
CN101734606B (zh) * 2008-11-14 2013-01-16 财团法人工业技术研究院 感测薄膜及应用其的微机电系统装置
IT1392742B1 (it) * 2008-12-23 2012-03-16 St Microelectronics Rousset Trasduttore acustico integrato in tecnologia mems e relativo processo di fabbricazione
US8281658B2 (en) 2009-01-12 2012-10-09 Taiwan Semiconductor Manufacturing Company, Ltd. Method to produce 3-D optical gyroscope my MEMS technology
US8367516B2 (en) 2009-01-14 2013-02-05 Taiwan Semiconductor Manufacturing Company, Ltd. Laser bonding for stacking semiconductor substrates
US8363860B2 (en) * 2009-03-26 2013-01-29 Analog Devices, Inc. MEMS microphone with spring suspended backplate
US8237235B2 (en) * 2009-04-14 2012-08-07 Taiwan Semiconductor Manufacturing Company, Ltd. Metal-ceramic multilayer structure
US8238018B2 (en) 2009-06-01 2012-08-07 Zhou Tiansheng MEMS micromirror and micromirror array
US8362578B2 (en) * 2009-06-02 2013-01-29 Taiwan Semiconductor Manufacturing Company, Ltd. Triple-axis MEMS accelerometer
US8106470B2 (en) * 2009-06-09 2012-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Triple-axis MEMS accelerometer having a bottom capacitor
US8710638B2 (en) * 2009-07-15 2014-04-29 Taiwan Semiconductor Manufacturing Company, Ltd. Socket type MEMS device with stand-off portion
WO2011146846A2 (fr) * 2010-05-21 2011-11-24 Sand9, Inc. Membranes micromécaniques, structures et procédés associés
JP5400708B2 (ja) * 2010-05-27 2014-01-29 オムロン株式会社 音響センサ、音響トランスデューサ、該音響トランスデューサを利用したマイクロフォン、および音響トランスデューサの製造方法
US9036231B2 (en) 2010-10-20 2015-05-19 Tiansheng ZHOU Micro-electro-mechanical systems micromirrors and micromirror arrays
US10551613B2 (en) 2010-10-20 2020-02-04 Tiansheng ZHOU Micro-electro-mechanical systems micromirrors and micromirror arrays
CN102457800A (zh) * 2010-10-21 2012-05-16 北京卓锐微技术有限公司 无背极板的mems电容式麦克风及其制备方法
US9380380B2 (en) 2011-01-07 2016-06-28 Stmicroelectronics S.R.L. Acoustic transducer and interface circuit
JP5872163B2 (ja) 2011-01-07 2016-03-01 オムロン株式会社 音響トランスデューサ、および該音響トランスデューサを利用したマイクロフォン
US20120328132A1 (en) * 2011-06-27 2012-12-27 Yunlong Wang Perforated Miniature Silicon Microphone
US8625823B2 (en) * 2011-07-12 2014-01-07 Robert Bosch Gmbh MEMS microphone overtravel stop structure
CN102368837B (zh) * 2011-09-15 2014-08-27 上海交通大学 基于表面微细加工工艺的电容式微麦克风及其制备方法
US9385634B2 (en) 2012-01-26 2016-07-05 Tiansheng ZHOU Rotational type of MEMS electrostatic actuator
US9105492B2 (en) * 2012-05-08 2015-08-11 LuxVue Technology Corporation Compliant micro device transfer head
DE102012218501A1 (de) * 2012-10-11 2014-04-17 Robert Bosch Gmbh Bauelement mit einer mikromechanischen Mikrofonstruktur
JP5649636B2 (ja) * 2012-11-08 2015-01-07 ティエンシェン・ジョウ 静電容量トランスデューサの製造方法
TWI536852B (zh) * 2013-02-18 2016-06-01 國立清華大學 電容式麥克風的製作方法
US20140247954A1 (en) * 2013-03-01 2014-09-04 Silicon Audio, Inc. Entrained Microphones
US8946831B2 (en) 2013-03-12 2015-02-03 Invensense, Inc. Low frequency response microphone diaphragm structures and methods for producing the same
US9809448B2 (en) 2013-03-13 2017-11-07 Invensense, Inc. Systems and apparatus having MEMS acoustic sensors and other MEMS sensors and methods of fabrication of the same
US8692340B1 (en) * 2013-03-13 2014-04-08 Invensense, Inc. MEMS acoustic sensor with integrated back cavity
JP6028927B2 (ja) * 2013-03-27 2016-11-24 セイコーエプソン株式会社 振動子の製造方法、振動子、および発振器
US8962368B2 (en) * 2013-07-24 2015-02-24 Goertek, Inc. CMOS compatible MEMS microphone and method for manufacturing the same
JP6179297B2 (ja) * 2013-09-13 2017-08-16 オムロン株式会社 音響トランスデューサ及びマイクロフォン
JP6149628B2 (ja) * 2013-09-13 2017-06-21 オムロン株式会社 音響トランスデューサ及びマイクロフォン
US8921957B1 (en) 2013-10-11 2014-12-30 Robert Bosch Gmbh Method of improving MEMS microphone mechanical stability
CN103686570B (zh) * 2013-12-31 2017-01-18 瑞声声学科技(深圳)有限公司 Mems麦克风
CN103730348B (zh) * 2014-01-06 2016-01-27 中国科学院微电子研究所 一种降低背孔工艺中对等离子体刻蚀机腔体污染的方法
TWI575963B (zh) * 2014-02-27 2017-03-21 先技股份有限公司 微機電麥克風裝置
US9344808B2 (en) * 2014-03-18 2016-05-17 Invensense, Inc. Differential sensing acoustic sensor
US9762992B2 (en) * 2015-05-08 2017-09-12 Kabushiki Kaisha Audio-Technica Condenser microphone unit, condenser microphone, and method of manufacturing condenser microphone unit
JP6809008B2 (ja) * 2016-07-08 2021-01-06 オムロン株式会社 Mems構造及び、mems構造を有する静電容量型センサ、圧電型センサ、音響センサ
KR101807071B1 (ko) * 2016-10-06 2017-12-08 현대자동차 주식회사 마이크로폰 및 그 제조 방법
DE102016125082B3 (de) * 2016-12-21 2018-05-09 Infineon Technologies Ag Halbleitervorrichtung, mikrofon und verfahren zum herstellen einer halbleitervorrichtung
CN108313975B (zh) 2017-01-16 2019-12-13 中芯国际集成电路制造(上海)有限公司 半导体装置及其制造方法
KR102082716B1 (ko) 2018-06-01 2020-02-28 주식회사 신성씨앤티 멤스 음향 센서
CN110165935B (zh) * 2019-05-21 2020-10-13 武汉大学深圳研究院 多层可穿戴压电能量收集器及其制备方法
US10993043B2 (en) 2019-09-09 2021-04-27 Shin Sung C&T Co., Ltd. MEMS acoustic sensor
CN111148000B (zh) * 2019-12-31 2021-10-22 瑞声科技(南京)有限公司 一种mems麦克风及阵列结构
US11526018B2 (en) * 2021-03-09 2022-12-13 Meta Platforms Technologies, Llc Phased array of ultrasound transducers for depth sensing
CN113347541A (zh) * 2021-07-07 2021-09-03 瑞声声学科技(深圳)有限公司 麦克风及其制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070147650A1 (en) * 2005-12-07 2007-06-28 Lee Sung Q Microphone and speaker having plate spring structure and speech recognition/synthesizing device using the microphone and the speaker
US20090092273A1 (en) * 2007-10-05 2009-04-09 Silicon Matrix Pte. Ltd. Silicon microphone with enhanced impact proof structure using bonding wires

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63242091A (ja) 1987-03-30 1988-10-07 Toshiba Corp 信号分離回路
US5146435A (en) 1989-12-04 1992-09-08 The Charles Stark Draper Laboratory, Inc. Acoustic transducer
DK0561566T3 (da) * 1992-03-18 2000-03-27 Knowles Electronics Llc Faststofkondensatormikrofon
US5490220A (en) 1992-03-18 1996-02-06 Knowles Electronics, Inc. Solid state condenser and microphone devices
US5452268A (en) 1994-08-12 1995-09-19 The Charles Stark Draper Laboratory, Inc. Acoustic transducer with improved low frequency response
US5870482A (en) 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone
US6829131B1 (en) 1999-09-13 2004-12-07 Carnegie Mellon University MEMS digital-to-acoustic transducer with error cancellation
WO2001022776A1 (fr) * 1999-09-21 2001-03-29 University Of Hawaii Procede de formation de transducteurs acoustiques piezo-electriques a membrane de parylene
JP3611779B2 (ja) * 1999-12-09 2005-01-19 シャープ株式会社 電気信号−音響信号変換器及びその製造方法並びに電気信号−音響変換装置
EP1310136B1 (fr) * 2000-08-11 2006-03-22 Knowles Electronics, LLC Transducteur a bande large miniature
WO2002052893A1 (fr) * 2000-12-22 2002-07-04 Brüel & Kjær Sound & Vibration Measurement A/S Transducteur capacitif micro-usine tres stable
AU2002365352A1 (en) * 2001-11-27 2003-06-10 Corporation For National Research Initiatives A miniature condenser microphone and fabrication method therefor
CN1159950C (zh) * 2001-12-07 2004-07-28 清华大学 单片集成电容式硅基微传声器及其制作工艺
EP1359402B1 (fr) * 2002-05-01 2014-10-01 Infineon Technologies AG Capteur de pression
US6667189B1 (en) * 2002-09-13 2003-12-23 Institute Of Microelectronics High performance silicon condenser microphone with perforated single crystal silicon backplate
US6926672B2 (en) * 2002-12-18 2005-08-09 Barbara Ann Karmanos Cancer Institute Electret acoustic transducer array for computerized ultrasound risk evaluation system
JP4101785B2 (ja) * 2003-09-11 2008-06-18 アオイ電子株式会社 コンデンサーマイクロフォン及びその作製方法
US7346178B2 (en) * 2004-10-29 2008-03-18 Silicon Matrix Pte. Ltd. Backplateless silicon microphone
US8467559B2 (en) * 2008-02-20 2013-06-18 Shandong Gettop Acoustic Co., Ltd. Silicon microphone without dedicated backplate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070147650A1 (en) * 2005-12-07 2007-06-28 Lee Sung Q Microphone and speaker having plate spring structure and speech recognition/synthesizing device using the microphone and the speaker
US20090092273A1 (en) * 2007-10-05 2009-04-09 Silicon Matrix Pte. Ltd. Silicon microphone with enhanced impact proof structure using bonding wires

Also Published As

Publication number Publication date
US20080123878A1 (en) 2008-05-29
WO2006046927A3 (fr) 2006-10-19
JP2008518549A (ja) 2008-05-29
KR20070104522A (ko) 2007-10-26
CN101107879B (zh) 2012-01-25
US8045734B2 (en) 2011-10-25
CN101453682B (zh) 2013-09-11
CN101107879A (zh) 2008-01-16
TWI295543B (en) 2008-04-01
WO2006046927A2 (fr) 2006-05-04
TW200633561A (en) 2006-09-16
US20060093170A1 (en) 2006-05-04
CN101453682A (zh) 2009-06-10
US7346178B2 (en) 2008-03-18

Similar Documents

Publication Publication Date Title
KR101109916B1 (ko) 마이크로폰 감지 소자 및 그 형성 방법
KR102381099B1 (ko) Mems 트랜스듀서를 위한 시스템 및 방법
TWI386073B (zh) 具有使用接合引線之增強型衝擊驗證之矽麥克風
EP1012547B1 (fr) Microphone miniature a condensateur a semi-conducteurs
US7329933B2 (en) Silicon microphone with softly constrained diaphragm
US8934648B2 (en) Support apparatus for microphone diaphragm
CN108124226B (zh) 具有改进灵敏度的集成电声mems换能器及其制造工艺
US20170297895A1 (en) System and Method for a Comb-drive MEMS Device
JP2009060600A (ja) コンデンサマイクロホン
JP2008517523A (ja) シリコンマイクロホン
CN108600928A (zh) Mems器件及其制造方法
US11496820B2 (en) MEMS device with quadrilateral trench and insert
CN110113703B (zh) 一种mems结构的制备方法
US20210314718A1 (en) Process of fabricating lateral mode capacitive microphone including a capacitor plate with sandwich structure
JP2012028900A (ja) コンデンサマイクロホン
US11546711B2 (en) Process of fabricating lateral mode capacitive microphone
KR102499855B1 (ko) 멤스 마이크로폰 이를 포함하는 멤스 마이크로폰 패키지 및 이의 제조 방법
JP6699854B2 (ja) Mems素子
JP4737720B2 (ja) ダイヤフラム及びその製造方法並びにそのダイヤフラムを有するコンデンサマイクロホン及びその製造方法
CN113660592B (zh) Mems器件及其制备方法
CN114946197A (zh) 膜结构、换能器装置和制造膜结构的方法
JP2010187303A (ja) 圧力センサ

Legal Events

Date Code Title Description
A201 Request for examination
N231 Notification of change of applicant
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20150128

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20151217

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20161220

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20171219

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20181231

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20191231

Year of fee payment: 9