IT1392742B1 - Trasduttore acustico integrato in tecnologia mems e relativo processo di fabbricazione - Google Patents

Trasduttore acustico integrato in tecnologia mems e relativo processo di fabbricazione

Info

Publication number
IT1392742B1
IT1392742B1 ITTO2008A000983A ITTO20080983A IT1392742B1 IT 1392742 B1 IT1392742 B1 IT 1392742B1 IT TO2008A000983 A ITTO2008A000983 A IT TO2008A000983A IT TO20080983 A ITTO20080983 A IT TO20080983A IT 1392742 B1 IT1392742 B1 IT 1392742B1
Authority
IT
Italy
Prior art keywords
processing
acoustic transducer
mems technology
integrated acoustic
relative process
Prior art date
Application number
ITTO2008A000983A
Other languages
English (en)
Inventor
Sebastiano Conti
Matteo Perletti
Original Assignee
St Microelectronics Rousset
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Rousset filed Critical St Microelectronics Rousset
Priority to ITTO2008A000983A priority Critical patent/IT1392742B1/it
Priority to US12/644,602 priority patent/US8942394B2/en
Publication of ITTO20080983A1 publication Critical patent/ITTO20080983A1/it
Application granted granted Critical
Publication of IT1392742B1 publication Critical patent/IT1392742B1/it

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/005Electrostatic transducers using semiconductor materials
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00Diaphragms for electromechanical transducers; Cones
    • H04R7/16Mounting or tensioning of diaphragms or cones
    • H04R7/24Tensioning by means acting directly on free portions of diaphragm or cone
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones
ITTO2008A000983A 2008-12-23 2008-12-23 Trasduttore acustico integrato in tecnologia mems e relativo processo di fabbricazione IT1392742B1 (it)

Priority Applications (2)

Application Number Priority Date Filing Date Title
ITTO2008A000983A IT1392742B1 (it) 2008-12-23 2008-12-23 Trasduttore acustico integrato in tecnologia mems e relativo processo di fabbricazione
US12/644,602 US8942394B2 (en) 2008-12-23 2009-12-22 Integrated acoustic transducer obtained using MEMS technology, and corresponding manufacturing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ITTO2008A000983A IT1392742B1 (it) 2008-12-23 2008-12-23 Trasduttore acustico integrato in tecnologia mems e relativo processo di fabbricazione

Publications (2)

Publication Number Publication Date
ITTO20080983A1 ITTO20080983A1 (it) 2010-06-24
IT1392742B1 true IT1392742B1 (it) 2012-03-16

Family

ID=41210373

Family Applications (1)

Application Number Title Priority Date Filing Date
ITTO2008A000983A IT1392742B1 (it) 2008-12-23 2008-12-23 Trasduttore acustico integrato in tecnologia mems e relativo processo di fabbricazione

Country Status (2)

Country Link
US (1) US8942394B2 (it)
IT (1) IT1392742B1 (it)

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011061771A1 (en) * 2009-11-20 2011-05-26 Unimicron Technology Corp. Lid, fabricating method thereof, and mems package made thereby
US8617960B2 (en) * 2009-12-31 2013-12-31 Texas Instruments Incorporated Silicon microphone transducer
US8575037B2 (en) 2010-12-27 2013-11-05 Infineon Technologies Ag Method for fabricating a cavity structure, for fabricating a cavity structure for a semiconductor structure and a semiconductor microphone fabricated by the same
JP5872163B2 (ja) 2011-01-07 2016-03-01 オムロン株式会社 音響トランスデューサ、および該音響トランスデューサを利用したマイクロフォン
US9380380B2 (en) 2011-01-07 2016-06-28 Stmicroelectronics S.R.L. Acoustic transducer and interface circuit
US8625823B2 (en) * 2011-07-12 2014-01-07 Robert Bosch Gmbh MEMS microphone overtravel stop structure
DE102012200957A1 (de) * 2011-07-21 2013-01-24 Robert Bosch Gmbh Bauelement mit einer mikromechanischen Mikrofonstruktur
JP5177309B1 (ja) * 2012-01-31 2013-04-03 オムロン株式会社 静電容量型センサ
EP2810036A4 (en) 2012-02-03 2015-10-07 Dieter Naegele-Preissmann CAPACITIVE PRESSURE SENSOR AND METHOD FOR THE PRODUCTION THEREOF
JP5973792B2 (ja) * 2012-05-31 2016-08-23 新日本無線株式会社 Mems素子の製造方法
DE102012107457B4 (de) * 2012-08-14 2017-05-24 Tdk Corporation MEMS-Bauelement mit Membran und Verfahren zur Herstellung
ITTO20120976A1 (it) 2012-11-09 2014-05-10 St Microelectronics Srl Procedimento per la fabbricazione di un cappuccio per una struttura di incapsulamento di dispositivi elettronici e cappuccio per una struttura di incapsulamento di dispositivi elettronici
US20140247954A1 (en) * 2013-03-01 2014-09-04 Silicon Audio, Inc. Entrained Microphones
JP6127600B2 (ja) 2013-03-12 2017-05-17 オムロン株式会社 静電容量型センサ、音響センサ及びマイクロフォン
US8692340B1 (en) 2013-03-13 2014-04-08 Invensense, Inc. MEMS acoustic sensor with integrated back cavity
US9809448B2 (en) 2013-03-13 2017-11-07 Invensense, Inc. Systems and apparatus having MEMS acoustic sensors and other MEMS sensors and methods of fabrication of the same
JP6127611B2 (ja) 2013-03-14 2017-05-17 オムロン株式会社 静電容量型センサ、音響センサ及びマイクロフォン
ITTO20130225A1 (it) 2013-03-21 2014-09-22 St Microelectronics Srl Struttura sensibile microelettromeccanica per un trasduttore acustico capacitivo includente un elemento di limitazione delle oscillazioni di una membrana, e relativo processo di fabbricazione
ITTO20130313A1 (it) 2013-04-18 2014-10-19 St Microelectronics Srl Struttura di rilevamento micromeccanica perfezionata per un trasduttore acustico mems e relativo procedimento di fabbricazione
ITTO20130350A1 (it) 2013-04-30 2014-10-31 St Microelectronics Srl Assemblaggio a livello di fetta di un dispositivo sensore mems e relativo dispositivo sensore mems
ITTO20130540A1 (it) 2013-06-28 2014-12-29 St Microelectronics Srl Dispositivo mems dotato di membrana sospesa e relativo procedimento di fabbricazione
US8921957B1 (en) 2013-10-11 2014-12-30 Robert Bosch Gmbh Method of improving MEMS microphone mechanical stability
ITTO20130910A1 (it) 2013-11-08 2015-05-09 St Microelectronics Srl Dispositivo trasduttore acustico microelettromeccanico con migliorate funzionalita' di rilevamento e relativo apparecchio elettronico
DE102013224718A1 (de) * 2013-12-03 2015-06-03 Robert Bosch Gmbh MEMS-Mikrofonbauelement und Vorrichtung mit einem solchen MEMS-Mikrofonbauelement
US9344808B2 (en) * 2014-03-18 2016-05-17 Invensense, Inc. Differential sensing acoustic sensor
US10469948B2 (en) * 2014-05-23 2019-11-05 Infineon Technologies Ag Method for manufacturing an opening structure and opening structure
US9426581B2 (en) 2014-06-03 2016-08-23 Invensense, Inc. Top port microelectromechanical systems microphone
US9428377B2 (en) 2014-07-25 2016-08-30 Semiconductor Manufacturing International (Shanghai) Corporation Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)
KR101463429B1 (ko) * 2014-08-20 2014-11-20 한국지질자원연구원 초저주파 음파 감지 장치
US10494254B2 (en) * 2015-01-26 2019-12-03 Cirrus Logic, Inc. MEMS devices and processes
US9815685B2 (en) * 2015-06-15 2017-11-14 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor sensing structure and manufacturing method thereof
US10128057B2 (en) 2015-10-28 2018-11-13 Stmicroelectronics S.R.L. Supercapacitor with movable separator and method of operating a supercapacitor
US11579011B2 (en) * 2016-02-19 2023-02-14 Fujifilm Sonosite, Inc. Membrane hydrophone for high frequency ultrasound and method of manufacture
US9731965B1 (en) 2016-03-31 2017-08-15 Stmicroelectronics S.R.L. Dry scribing methods, devices and systems
KR102511103B1 (ko) * 2016-04-26 2023-03-16 주식회사 디비하이텍 멤스 마이크로폰 및 이의 제조 방법
KR101906665B1 (ko) * 2016-04-26 2018-10-10 주식회사 디비하이텍 멤스 마이크로폰의 제조 방법
KR102098434B1 (ko) * 2016-04-26 2020-04-07 주식회사 디비하이텍 멤스 마이크로폰 및 이의 제조 방법
ITUA20163571A1 (it) 2016-05-18 2017-11-18 St Microelectronics Srl Trasduttore acustico mems con elettrodi interdigitati e relativo procedimento di fabbricazione
KR102486586B1 (ko) * 2016-06-13 2023-01-10 주식회사 디비하이텍 멤스 마이크로폰의 제조 방법
TWI694965B (zh) * 2016-06-30 2020-06-01 英國商席瑞斯邏輯國際半導體有限公司 Mems裝置與製程
US10085094B2 (en) * 2016-06-30 2018-09-25 Cirrus Logic, Inc. MEMS devices and processes
TWI708511B (zh) * 2016-07-21 2020-10-21 聯華電子股份有限公司 壓阻式麥克風的結構及其製作方法
KR101807069B1 (ko) * 2016-10-21 2017-12-08 현대자동차 주식회사 마이크로폰 및 그 제조방법
IT201600121533A1 (it) 2016-11-30 2018-05-30 St Microelectronics Srl Trasduttore elettroacustico integrato mems con sensibilita' migliorata e relativo processo di fabbricazione
DE102017102190B4 (de) * 2017-02-03 2020-06-04 Infineon Technologies Ag Membranbauteile und Verfahren zum Bilden eines Membranbauteils
DE102017012327B3 (de) 2017-02-03 2022-05-12 Infineon Technologies Ag Membranbauteile und Verfahren zum Bilden eines Membranbauteils
DE102017205971B4 (de) * 2017-04-07 2022-09-22 Infineon Technologies Ag Mems-schallwandler-element und verfahren zum herstellen eines mems-schallwandler-elements
CN108810773A (zh) * 2017-04-26 2018-11-13 中芯国际集成电路制造(上海)有限公司 麦克风及其制造方法
DE102017209495B9 (de) 2017-06-06 2022-11-10 Infineon Technologies Ag MEMS-Schallwandler, MEMS-Mikrofon und Verfahren zum Bereitstellen eines MEMS-Schallwandlers
KR20190016718A (ko) * 2017-08-09 2019-02-19 주식회사 디비하이텍 멤스 마이크로폰 및 이의 제조 방법
KR102370645B1 (ko) * 2017-09-11 2022-03-07 주식회사 디비하이텍 멤스 마이크로폰 및 이의 제조 방법
KR102424774B1 (ko) * 2017-09-11 2022-07-25 주식회사 디비하이텍 멤스 마이크로폰 및 이의 제조 방법
KR102370642B1 (ko) * 2017-09-11 2022-03-07 주식회사 디비하이텍 멤스 마이크로폰 및 이의 제조 방법
TWI644578B (zh) * 2017-12-12 2018-12-11 絡達科技股份有限公司 音頻系統
WO2019197793A1 (en) * 2018-04-12 2019-10-17 Cirrus Logic International Semiconductor Limited Mems devices
KR102499855B1 (ko) * 2018-05-03 2023-02-13 주식회사 디비하이텍 멤스 마이크로폰 이를 포함하는 멤스 마이크로폰 패키지 및 이의 제조 방법
KR102488122B1 (ko) * 2018-06-15 2023-01-12 주식회사 디비하이텍 멤스 마이크로폰 및 이의 제조 방법
US10715924B2 (en) * 2018-06-25 2020-07-14 Taiwan Semiconductor Manufacturing Co., Ltd. MEMS microphone having diaphragm
KR20200004041A (ko) * 2018-07-03 2020-01-13 주식회사 디비하이텍 멤스 마이크로폰 및 이의 제조 방법
KR20200005954A (ko) * 2018-07-09 2020-01-17 주식회사 디비하이텍 멤스 마이크로폰 및 이의 제조 방법
EP3620429A1 (en) * 2018-09-06 2020-03-11 Infineon Technologies AG Mems membrane transducer and method for producing same
WO2020072920A1 (en) 2018-10-05 2020-04-09 Knowles Electronics, Llc Microphone device with ingress protection
WO2020072938A1 (en) * 2018-10-05 2020-04-09 Knowles Electronics, Llc Methods of forming mems diaphragms including corrugations
JP2020066071A (ja) * 2018-10-23 2020-04-30 新日本無線株式会社 Mems素子
JP7173663B2 (ja) * 2018-12-07 2022-11-16 日清紡マイクロデバイス株式会社 Mems素子
CN109905833B (zh) * 2018-12-31 2021-04-20 瑞声科技(新加坡)有限公司 Mems麦克风制造方法
JP2022551418A (ja) * 2019-09-23 2022-12-09 フジフィルム ソノサイト インコーポレイテッド 高周波超音波用のメンブレン型ハイドロフォン及びハイドロフォンの製造方法
US11729569B2 (en) * 2019-10-10 2023-08-15 Bose Corporation Dimensional consistency of miniature loudspeakers
CN111405441B (zh) * 2020-04-16 2021-06-15 瑞声声学科技(深圳)有限公司 一种压电式mems麦克风
US11665485B2 (en) * 2020-10-08 2023-05-30 UPBEAT TECHNOLOGY Co., Ltd Micro-electro-mechanical system acoustic sensor, micro-electro-mechanical system package structure and method for manufacturing the same
CN216752082U (zh) * 2021-12-20 2022-06-14 瑞声声学科技(深圳)有限公司 Mems麦克风芯片

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5452268A (en) * 1994-08-12 1995-09-19 The Charles Stark Draper Laboratory, Inc. Acoustic transducer with improved low frequency response
US6535460B2 (en) * 2000-08-11 2003-03-18 Knowles Electronics, Llc Miniature broadband acoustic transducer
US7146016B2 (en) * 2001-11-27 2006-12-05 Center For National Research Initiatives Miniature condenser microphone and fabrication method therefor
US7346178B2 (en) * 2004-10-29 2008-03-18 Silicon Matrix Pte. Ltd. Backplateless silicon microphone
EP1894437A1 (en) * 2005-05-17 2008-03-05 Nxp B.V. Improved membrane for a mems condenser microphone
CN101371614A (zh) * 2006-01-20 2009-02-18 模拟设备公司 用于电容式传声器隔膜的支撑设备
GB0605576D0 (en) * 2006-03-20 2006-04-26 Oligon Ltd MEMS device
WO2008103672A2 (en) 2007-02-20 2008-08-28 Case Western Reserve University Microfabricated microphone
US8121315B2 (en) * 2007-03-21 2012-02-21 Goer Tek Inc. Condenser microphone chip

Also Published As

Publication number Publication date
US20100158279A1 (en) 2010-06-24
US8942394B2 (en) 2015-01-27
ITTO20080983A1 (it) 2010-06-24

Similar Documents

Publication Publication Date Title
IT1392742B1 (it) Trasduttore acustico integrato in tecnologia mems e relativo processo di fabbricazione
IT1395550B1 (it) Trasduttore acustico integrato in tecnologia mems e relativo processo di fabbricazione
BRPI0810618A2 (pt) Material abafador de som e amortecedor de vibração e processo de produção do mesmo
BRPI0915486A2 (pt) copolímero com blocos procedente de materias renováveis e processo fabricação de tal copolímero com blocos
BRPI0916568A2 (pt) método de produção de particulas de polissacarídeo reticuladas
BRPI1013615A2 (pt) camada funcional elétrica, processo de produção e uso dela
IT1392576B1 (it) Dispositivo di rilevamento elettronico di materiali biologici e relativo processo di fabbricazione
BRPI0918706A2 (pt) processo de polimerização de propoleno/ <244> -olefina e artigo
BRPI0906305A2 (pt) artigo absorvente e método de produção do mesmo
BRPI0922713A2 (pt) conjunto de guarnição e processo de fabricação de um conjunto de guarnição
BR112012005321A2 (pt) processo e composição
BRPI0920481A2 (pt) dispositivo transdutor acústico, microfone e transdutor
BRPI0922711A2 (pt) elemento de guarnição e processo de fabricação de um elemento
NO20073363L (no) Anordning og fremgangsmate ved marin tarnstruktur
BRPI0910939A2 (pt) dispositivo estabilizador e processo de produção do mesmo
BRPI0915036A2 (pt) processo de produção de caspofungina e seus intermediários
CY2018007I1 (el) Διαδικασια παραγωγης και επεξεργασιας του παραγοντα viii και τα παραγωγα του
BRPI0910379A2 (pt) método e fabricação de um artigo do vestuário
ITUD20080007A1 (it) Metodo di rilevazione e/o elaborazione di segnali sismici
DE602009000787D1 (de) Herstellungsverfahren von Lufthohlräumen in Mikrostrukturen
BRPI0906230B8 (pt) processo de fabricação de metil-2-pentametileno diamina e metil-3-piperidina
BRPI0717940A2 (pt) Produto e processo
ITMI20070060A1 (it) Processo di fabbricazione di un dispositivo integrato
BRPI0910938A2 (pt) suporte personalizável incluindo dispositivo antifalsificação e processo de fabricação de tal suporte
BRPI0922075A2 (pt) composição e processo de colagem de peças.