KR101108901B1 - 일정한 최대 효율로 rf 생성기의 자동-조정을 이용하는개선된 메가소닉 세정 작용 - Google Patents
일정한 최대 효율로 rf 생성기의 자동-조정을 이용하는개선된 메가소닉 세정 작용 Download PDFInfo
- Publication number
- KR101108901B1 KR101108901B1 KR1020057014555A KR20057014555A KR101108901B1 KR 101108901 B1 KR101108901 B1 KR 101108901B1 KR 1020057014555 A KR1020057014555 A KR 1020057014555A KR 20057014555 A KR20057014555 A KR 20057014555A KR 101108901 B1 KR101108901 B1 KR 101108901B1
- Authority
- KR
- South Korea
- Prior art keywords
- output
- generator
- input
- voltage
- coupled
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0207—Driving circuits
- B06B1/0223—Driving circuits for generating signals continuous in time
- B06B1/0238—Driving circuits for generating signals continuous in time of a single frequency, e.g. a sine-wave
- B06B1/0246—Driving circuits for generating signals continuous in time of a single frequency, e.g. a sine-wave with a feedback signal
- B06B1/0253—Driving circuits for generating signals continuous in time of a single frequency, e.g. a sine-wave with a feedback signal taken directly from the generator circuit
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
- B06B2201/70—Specific application
- B06B2201/71—Cleaning in a tank
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/360,316 | 2003-02-06 | ||
US10/359,765 US7053000B2 (en) | 2003-02-06 | 2003-02-06 | System, method and apparatus for constant voltage control of RF generator for optimum operation |
US10/360,322 | 2003-02-06 | ||
US10/360,320 US7033845B2 (en) | 2003-02-06 | 2003-02-06 | Phase control of megasonic RF generator for optimum operation |
US10/360,316 US6998349B2 (en) | 2003-02-06 | 2003-02-06 | System, method and apparatus for automatic control of an RF generator for maximum efficiency |
US10/359,765 | 2003-02-06 | ||
US10/360,322 US6995067B2 (en) | 2003-02-06 | 2003-02-06 | Megasonic cleaning efficiency using auto-tuning of an RF generator at constant maximum efficiency |
US10/360,320 | 2003-02-06 | ||
PCT/US2003/041226 WO2004071938A2 (en) | 2003-02-06 | 2003-12-23 | Improved megasonic cleaning efficiency using auto- tuning of an rf generator at constant maximum efficiency |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20050097992A KR20050097992A (ko) | 2005-10-10 |
KR101108901B1 true KR101108901B1 (ko) | 2012-02-20 |
Family
ID=32872957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020057014555A KR101108901B1 (ko) | 2003-02-06 | 2003-12-23 | 일정한 최대 효율로 rf 생성기의 자동-조정을 이용하는개선된 메가소닉 세정 작용 |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1590828A2 (zh) |
JP (1) | JP4602773B2 (zh) |
KR (1) | KR101108901B1 (zh) |
CN (1) | CN100401479C (zh) |
AU (1) | AU2003299889A1 (zh) |
TW (1) | TWI292985B (zh) |
WO (1) | WO2004071938A2 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2270838B1 (en) | 2009-07-02 | 2019-06-12 | IMEC vzw | Method and apparatus for controlling optimal operation of acoustic cleaning |
TWI490931B (zh) * | 2009-10-05 | 2015-07-01 | Tokyo Electron Ltd | 超音波清洗裝置、超音波清洗方法、及記錄有用來執行此超音波清洗方法之電腦程式的記錄媒體 |
TWI716699B (zh) * | 2018-06-29 | 2021-01-21 | 施俊名 | 用於超音波加工器具之超音波頻率調整裝置 |
CN110801160B (zh) * | 2018-08-06 | 2021-06-18 | 佛山市顺德区美的电热电器制造有限公司 | 烹饪装置的控制方法、系统及烹饪装置 |
CN113578859A (zh) * | 2021-08-02 | 2021-11-02 | 史荃 | 一种错相差频式超声波在线灭菌破碎搅拌清洁方法和设备 |
CN113787050B (zh) * | 2021-09-27 | 2023-08-18 | 韶关市洁盟超声科技有限公司 | 一种超声波输出波形可控的超声波清洗机 |
CN116581067B (zh) * | 2023-07-12 | 2023-09-22 | 北京东方金荣超声电器有限公司 | 基于器件湿法处理的兆声波系统的控制方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001346805A (ja) | 2000-06-09 | 2001-12-18 | Olympus Optical Co Ltd | 超音波手術装置 |
JP2002543976A (ja) | 1999-05-13 | 2002-12-24 | エフエスアイ インターナショナル インコーポレイテッド | 超希薄洗浄液を使用して、ミクロ電子基材を洗浄する方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6418229A (en) * | 1987-07-14 | 1989-01-23 | Oki Electric Ind Co Ltd | Super-ultrasonic cleaning device |
JP3112542B2 (ja) * | 1992-01-24 | 2000-11-27 | オリンパス光学工業株式会社 | 超音波研磨装置 |
US5339844A (en) * | 1992-08-10 | 1994-08-23 | Hughes Aircraft Company | Low cost equipment for cleaning using liquefiable gases |
US5601655A (en) * | 1995-02-14 | 1997-02-11 | Bok; Hendrik F. | Method of cleaning substrates |
US5931173A (en) * | 1997-06-09 | 1999-08-03 | Cypress Semiconductor Corporation | Monitoring cleaning effectiveness of a cleaning system |
CA2346240A1 (en) * | 1998-10-14 | 2000-04-20 | Delsys Pharmaceutical Corporation | Electrostatic sensing chuck using area matched electrodes |
US6311702B1 (en) * | 1998-11-11 | 2001-11-06 | Applied Materials, Inc. | Megasonic cleaner |
US6228563B1 (en) * | 1999-09-17 | 2001-05-08 | Gasonics International Corporation | Method and apparatus for removing post-etch residues and other adherent matrices |
US20020049551A1 (en) * | 2000-10-20 | 2002-04-25 | Ethicon Endo-Surgery, Inc. | Method for differentiating between burdened and cracked ultrasonically tuned blades |
US6713022B1 (en) * | 2000-11-22 | 2004-03-30 | Xerox Corporation | Devices for biofluid drop ejection |
US6623700B1 (en) * | 2000-11-22 | 2003-09-23 | Xerox Corporation | Level sense and control system for biofluid drop ejection devices |
US6503454B1 (en) * | 2000-11-22 | 2003-01-07 | Xerox Corporation | Multi-ejector system for ejecting biofluids |
US6706337B2 (en) * | 2001-03-12 | 2004-03-16 | Agfa Corporation | Ultrasonic method for applying a coating material onto a substrate and for cleaning the coating material from the substrate |
-
2003
- 2003-12-23 CN CNB200380110213XA patent/CN100401479C/zh not_active Expired - Fee Related
- 2003-12-23 WO PCT/US2003/041226 patent/WO2004071938A2/en active Application Filing
- 2003-12-23 EP EP03800161A patent/EP1590828A2/en not_active Withdrawn
- 2003-12-23 AU AU2003299889A patent/AU2003299889A1/en not_active Abandoned
- 2003-12-23 KR KR1020057014555A patent/KR101108901B1/ko not_active IP Right Cessation
- 2003-12-23 JP JP2004568342A patent/JP4602773B2/ja not_active Expired - Fee Related
- 2003-12-31 TW TW092137672A patent/TWI292985B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002543976A (ja) | 1999-05-13 | 2002-12-24 | エフエスアイ インターナショナル インコーポレイテッド | 超希薄洗浄液を使用して、ミクロ電子基材を洗浄する方法 |
JP2001346805A (ja) | 2000-06-09 | 2001-12-18 | Olympus Optical Co Ltd | 超音波手術装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2006513844A (ja) | 2006-04-27 |
TWI292985B (en) | 2008-01-21 |
CN1759471A (zh) | 2006-04-12 |
EP1590828A2 (en) | 2005-11-02 |
AU2003299889A8 (en) | 2004-09-06 |
JP4602773B2 (ja) | 2010-12-22 |
AU2003299889A1 (en) | 2004-09-06 |
WO2004071938A2 (en) | 2004-08-26 |
KR20050097992A (ko) | 2005-10-10 |
TW200421713A (en) | 2004-10-16 |
WO2004071938A3 (en) | 2004-12-29 |
CN100401479C (zh) | 2008-07-09 |
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