AU2003299889A1 - Improved megasonic cleaning efficiency using auto- tuning of an rf generator at constant maximum efficiency - Google Patents

Improved megasonic cleaning efficiency using auto- tuning of an rf generator at constant maximum efficiency

Info

Publication number
AU2003299889A1
AU2003299889A1 AU2003299889A AU2003299889A AU2003299889A1 AU 2003299889 A1 AU2003299889 A1 AU 2003299889A1 AU 2003299889 A AU2003299889 A AU 2003299889A AU 2003299889 A AU2003299889 A AU 2003299889A AU 2003299889 A1 AU2003299889 A1 AU 2003299889A1
Authority
AU
Australia
Prior art keywords
tuning
auto
efficiency
generator
constant maximum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003299889A
Other versions
AU2003299889A8 (en
Inventor
Thomas W. Anderson
John Boyd
Robert Knop
Andras Kuthi
Michael G.R. Smith
William Thie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/360,322 external-priority patent/US6995067B2/en
Priority claimed from US10/360,316 external-priority patent/US6998349B2/en
Priority claimed from US10/360,320 external-priority patent/US7033845B2/en
Priority claimed from US10/359,765 external-priority patent/US7053000B2/en
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2003299889A1 publication Critical patent/AU2003299889A1/en
Publication of AU2003299889A8 publication Critical patent/AU2003299889A8/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0207—Driving circuits
    • B06B1/0223—Driving circuits for generating signals continuous in time
    • B06B1/0238—Driving circuits for generating signals continuous in time of a single frequency, e.g. a sine-wave
    • B06B1/0246—Driving circuits for generating signals continuous in time of a single frequency, e.g. a sine-wave with a feedback signal
    • B06B1/0253—Driving circuits for generating signals continuous in time of a single frequency, e.g. a sine-wave with a feedback signal taken directly from the generator circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/70—Specific application
    • B06B2201/71—Cleaning in a tank

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Stabilization Of Oscillater, Synchronisation, Frequency Synthesizers (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
AU2003299889A 2003-02-06 2003-12-23 Improved megasonic cleaning efficiency using auto- tuning of an rf generator at constant maximum efficiency Abandoned AU2003299889A1 (en)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US10/360,322 US6995067B2 (en) 2003-02-06 2003-02-06 Megasonic cleaning efficiency using auto-tuning of an RF generator at constant maximum efficiency
US10/360,322 2003-02-06
US10/359,765 2003-02-06
US10/360,316 US6998349B2 (en) 2003-02-06 2003-02-06 System, method and apparatus for automatic control of an RF generator for maximum efficiency
US10/360,320 US7033845B2 (en) 2003-02-06 2003-02-06 Phase control of megasonic RF generator for optimum operation
US10/360,320 2003-02-06
US10/360,316 2003-02-06
US10/359,765 US7053000B2 (en) 2003-02-06 2003-02-06 System, method and apparatus for constant voltage control of RF generator for optimum operation
PCT/US2003/041226 WO2004071938A2 (en) 2003-02-06 2003-12-23 Improved megasonic cleaning efficiency using auto- tuning of an rf generator at constant maximum efficiency

Publications (2)

Publication Number Publication Date
AU2003299889A1 true AU2003299889A1 (en) 2004-09-06
AU2003299889A8 AU2003299889A8 (en) 2004-09-06

Family

ID=32872957

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003299889A Abandoned AU2003299889A1 (en) 2003-02-06 2003-12-23 Improved megasonic cleaning efficiency using auto- tuning of an rf generator at constant maximum efficiency

Country Status (7)

Country Link
EP (1) EP1590828A2 (en)
JP (1) JP4602773B2 (en)
KR (1) KR101108901B1 (en)
CN (1) CN100401479C (en)
AU (1) AU2003299889A1 (en)
TW (1) TWI292985B (en)
WO (1) WO2004071938A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2270838B1 (en) * 2009-07-02 2019-06-12 IMEC vzw Method and apparatus for controlling optimal operation of acoustic cleaning
TWI490931B (en) * 2009-10-05 2015-07-01 Tokyo Electron Ltd Ultrasonic cleaning device, ultrasonic cleaning method, and recording medium that records computer program for executing the ultrasonic cleaning method
TWI716699B (en) * 2018-06-29 2021-01-21 施俊名 Ultrasonic frequency adjusting device for ultrasonic processing apparatus
CN110801160B (en) * 2018-08-06 2021-06-18 佛山市顺德区美的电热电器制造有限公司 Control method and system of cooking device and cooking device
CN113578859A (en) * 2021-08-02 2021-11-02 史荃 Staggered phase difference frequency type ultrasonic online sterilization, crushing, stirring and cleaning method and equipment
CN113787050B (en) * 2021-09-27 2023-08-18 韶关市洁盟超声科技有限公司 Ultrasonic cleaner with controllable ultrasonic output waveform
CN116581067B (en) * 2023-07-12 2023-09-22 北京东方金荣超声电器有限公司 Control method of megasonic system based on wet processing of device

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6418229A (en) * 1987-07-14 1989-01-23 Oki Electric Ind Co Ltd Super-ultrasonic cleaning device
JP3112542B2 (en) * 1992-01-24 2000-11-27 オリンパス光学工業株式会社 Ultrasonic polishing equipment
US5339844A (en) * 1992-08-10 1994-08-23 Hughes Aircraft Company Low cost equipment for cleaning using liquefiable gases
US5601655A (en) * 1995-02-14 1997-02-11 Bok; Hendrik F. Method of cleaning substrates
US5931173A (en) * 1997-06-09 1999-08-03 Cypress Semiconductor Corporation Monitoring cleaning effectiveness of a cleaning system
EP1121752A4 (en) * 1998-10-14 2003-05-21 Delsys Pharmaceutical Corp Electrostatic sensing chuck using area matched electrodes
US6311702B1 (en) * 1998-11-11 2001-11-06 Applied Materials, Inc. Megasonic cleaner
US6799583B2 (en) 1999-05-13 2004-10-05 Suraj Puri Methods for cleaning microelectronic substrates using ultradilute cleaning liquids
US6228563B1 (en) * 1999-09-17 2001-05-08 Gasonics International Corporation Method and apparatus for removing post-etch residues and other adherent matrices
JP2001346805A (en) 2000-06-09 2001-12-18 Olympus Optical Co Ltd Ultrasonic surgical instrument
US20020049551A1 (en) * 2000-10-20 2002-04-25 Ethicon Endo-Surgery, Inc. Method for differentiating between burdened and cracked ultrasonically tuned blades
US6623700B1 (en) * 2000-11-22 2003-09-23 Xerox Corporation Level sense and control system for biofluid drop ejection devices
US6503454B1 (en) * 2000-11-22 2003-01-07 Xerox Corporation Multi-ejector system for ejecting biofluids
US6713022B1 (en) * 2000-11-22 2004-03-30 Xerox Corporation Devices for biofluid drop ejection
US6706337B2 (en) * 2001-03-12 2004-03-16 Agfa Corporation Ultrasonic method for applying a coating material onto a substrate and for cleaning the coating material from the substrate

Also Published As

Publication number Publication date
KR101108901B1 (en) 2012-02-20
WO2004071938A3 (en) 2004-12-29
JP4602773B2 (en) 2010-12-22
TW200421713A (en) 2004-10-16
EP1590828A2 (en) 2005-11-02
WO2004071938A2 (en) 2004-08-26
CN100401479C (en) 2008-07-09
TWI292985B (en) 2008-01-21
KR20050097992A (en) 2005-10-10
AU2003299889A8 (en) 2004-09-06
JP2006513844A (en) 2006-04-27
CN1759471A (en) 2006-04-12

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase