KR101102157B1 - 금속 나노 입자를 이용한 휘발성 음저항 소자 - Google Patents
금속 나노 입자를 이용한 휘발성 음저항 소자 Download PDFInfo
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- KR101102157B1 KR101102157B1 KR1020050086779A KR20050086779A KR101102157B1 KR 101102157 B1 KR101102157 B1 KR 101102157B1 KR 1020050086779 A KR1020050086779 A KR 1020050086779A KR 20050086779 A KR20050086779 A KR 20050086779A KR 101102157 B1 KR101102157 B1 KR 101102157B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0021—Auxiliary circuits
- G11C13/0033—Disturbance prevention or evaluation; Refreshing of disturbed memory data
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0014—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0009—RRAM elements whose operation depends upon chemical change
- G11C13/0014—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
- G11C13/0016—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material comprising polymers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/20—Resistors
- H01L28/26—Resistors with an active material comprising an organic conducting material, e.g. conducting polymers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/85—Thermoelectric active materials
- H10N10/856—Thermoelectric active materials comprising organic compositions
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/011—Manufacture or treatment of multistable switching devices
- H10N70/021—Formation of the switching material, e.g. layer deposition
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices without a potential-jump barrier or surface barrier, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N80/00—Bulk negative-resistance effect devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C2211/00—Indexing scheme relating to digital stores characterized by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C2211/56—Indexing scheme relating to G11C11/56 and sub-groups for features not covered by these groups
- G11C2211/561—Multilevel memory cell aspects
- G11C2211/5614—Multilevel memory cell comprising negative resistance, quantum tunneling or resonance tunneling elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/80—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays
- H10B63/82—Arrangements comprising multiple bistable or multi-stable switching components of the same type on a plane parallel to the substrate, e.g. cross-point arrays the switching components having a common active material layer
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
Description
Claims (17)
- 두 금속 전극 사이에 유기층을 포함하는 음저항 소자에 있어서,상기 유기층이 직경 10 nm 이하의 금속 나노 입자를 유기물 내에 고르게 분산시켜 형성되는 것을 특징으로 하는 금속 나노 입자를 이용한 휘발성 음저항 소자.
- 제 1항에 있어서, 상기 금속 나노 입자는 하기 화학식 1로 표시되는 유기물로 그 표면이 안정화된 것을 특징으로 하는 휘발성 음저항 소자.[화학식 1]CH3(CH2)nSH상기 식에서, n은 3 내지 19의 정수이다.
- 제 1항에 있어서, 상기 금속 나노 입자는 금, 은, 구리, 철, 텅스텐, 백금, 알루미늄, 크롬, 니켈, 아연, 티타늄 및 납으로 구성된 그룹으로부터 선택된 금속의 나노 입자인 것을 특징으로 하는 휘발성 음저항 소자.
- 제 1항에 있어서, 상기 유기물은 비전도성 고분자인 것을 특징으로 하는 휘발성 음저항 소자.
- 제 4항에 있어서, 상기 비전도성 고분자는 폴리메틸메타아크릴레이트, 폴리스티렌, PET 및 이들의 유도체로 구성된 그룹으로부터 선택되는 것임을 특징으로 하는 휘발성 음저항 소자.
- 제 1항에 있어서, 상기 유기층은 그 두께가 10 내지 500 nm인 것을 특징으로 하는 휘발성 음저항 소자.
- 제 1항에 있어서, 상기 유기층은 금속 나노 입자가 분산된 유기물을 스핀 코팅, 열 증착, 스퍼터링, 잉크젯 프린팅 또는 롤코팅하여 형성되는 것을 특징으로 하는 휘발성 음저항 소자.
- 제 1항에 있어서, 상기 전극은 금속, 금속 합금, 금속 질화물, 금속 산화물 및 금속 황화물로 구성된 그룹으로부터 선택되는 1종 이상인 것을 특징으로 하는 휘발성 음저항 소자.
- 제 8항에 있어서, 상기 전극은 금, 은, 철, 백금, 알루미늄, 티타늄, 텅스텐 및 인듐틴옥사이드로 구성된 그룹으로부터 선택되는 것을 특징으로 하는 휘발성 음저항 소자.
- 제 1항에 있어서, 상기 두 금속 전극의 상부 전극 및 하부 전극은 기판에 대해서 수평 또는 수직 구조로 형성되는 것을 특징으로 하는 휘발성 음저항 소자.
- 제 1항에 있어서, 상기 소자가 상부 전극 아래 또는 하부 전극 위에 배리어 층을 추가로 포함하는 것을 특징으로 하는 휘발성 음저항 소자.
- 제 11항에 있어서, 상기 배리어 층이 SiOx, AlOx, NbOx, TiOx, CrOx, VOx, TaOx, CuOx, MgOx, AlNOx로 구성되는 그룹으로부터 선택되는 무기재료 또는 Alq3, 폴리메틸메타크릴레이트, 폴리스티렌 및 PET로 구성된 그룹으로부터 선택되는 유기재료를 포함하는 것을 특징으로 하는 휘발성 음저항 소자.
- 제 11항에 있어서, 상기 배리어 층이 SiO2, Al2O3, Cu2O, TiO2, BN 및 V2O3로 구성된 그룹으로부터 선택되는 물질을 포함하는 것을 특징으로 하는 휘발성 음저항 소자.
- 제 11항에 있어서, 상기 배리어 층의 두께는 2 내지 30 nm 인 것을 특징으로 하는 휘발성 음저항 소자.
- 제 1항 내지 제 14항 중 어느 한 항에 따른 휘발성 음저항 소자를 이용한 스 위칭 소자.
- 제 1항 내지 제 14항 중 어느 한 항에 따른 휘발성 음저항 소자를 이용한 논리 소자.
- 제 16항에 있어서, 상기 논리 소자는 모바일(mobile), 딜레이 플립-플롭 서킷(delayed flip-flop circuts), 스태틱 바이너리 프리퀀시 디바이더(static binary frequency divider) 및 아날로그-디지털 컨버터(analog-to-digital converter)로 구성된 그룹으로부터 선택되는 것을 특징으로 하는 논리 소자.
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KR1020050086779A KR101102157B1 (ko) | 2005-09-16 | 2005-09-16 | 금속 나노 입자를 이용한 휘발성 음저항 소자 |
US11/452,838 US8546789B2 (en) | 2005-09-16 | 2006-06-14 | Volatile negative differential resistance device using metal nanoparticles |
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KR1020050086779A KR101102157B1 (ko) | 2005-09-16 | 2005-09-16 | 금속 나노 입자를 이용한 휘발성 음저항 소자 |
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KR20070032500A KR20070032500A (ko) | 2007-03-22 |
KR101102157B1 true KR101102157B1 (ko) | 2012-01-02 |
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KR102410165B1 (ko) * | 2019-10-22 | 2022-06-20 | 한양대학교 산학협력단 | 뉴런 거동 모방 전자 시냅스 소자 및 이의 제조 방법 |
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KR102539290B1 (ko) * | 2021-04-14 | 2023-06-05 | 한양대학교 산학협력단 | 금속-유기 골격체를 포함하는 전자 시냅스 소자의 활성층 형성용 조성물, 이를 이용한 활성층 형성 방법 및 활성층을 포함하는 전자 시냅스 소자 |
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KR101114770B1 (ko) * | 2004-12-24 | 2012-03-05 | 삼성전자주식회사 | 비휘발성 유기 메모리 소자의 제조 방법 및 그에 의해수득된 비휘발성 유기 메모리 소자 |
KR101078150B1 (ko) * | 2005-03-17 | 2011-10-28 | 삼성전자주식회사 | 유기-무기 복합체 다공성 물질을 이용한 비휘발성 나노 채널 메모리 소자 |
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KR20030001571A (ko) * | 2001-06-25 | 2003-01-08 | 대한민국 (한밭대학총장) | 전계발광소자의 제조방법 |
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US8546789B2 (en) | 2013-10-01 |
US20070080345A1 (en) | 2007-04-12 |
KR20070032500A (ko) | 2007-03-22 |
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