KR101087384B1 - 코팅 다이 및 사용법 - Google Patents
코팅 다이 및 사용법 Download PDFInfo
- Publication number
- KR101087384B1 KR101087384B1 KR1020057021719A KR20057021719A KR101087384B1 KR 101087384 B1 KR101087384 B1 KR 101087384B1 KR 1020057021719 A KR1020057021719 A KR 1020057021719A KR 20057021719 A KR20057021719 A KR 20057021719A KR 101087384 B1 KR101087384 B1 KR 101087384B1
- Authority
- KR
- South Korea
- Prior art keywords
- die
- gas relief
- cavity
- gas
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0254—Coating heads with slot-shaped outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/439,448 US7083826B2 (en) | 2003-05-16 | 2003-05-16 | Coating die and method for use |
| US10/439,448 | 2003-05-16 | ||
| PCT/US2004/011274 WO2004103578A1 (en) | 2003-05-16 | 2004-04-13 | Coating die and method for use |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20060009935A KR20060009935A (ko) | 2006-02-01 |
| KR101087384B1 true KR101087384B1 (ko) | 2011-11-25 |
Family
ID=33417801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020057021719A Expired - Fee Related KR101087384B1 (ko) | 2003-05-16 | 2004-04-13 | 코팅 다이 및 사용법 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7083826B2 (https=) |
| EP (2) | EP2072148B1 (https=) |
| JP (1) | JP4685783B2 (https=) |
| KR (1) | KR101087384B1 (https=) |
| AT (1) | ATE427788T1 (https=) |
| DE (1) | DE602004020458D1 (https=) |
| WO (1) | WO2004103578A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020015785A (ko) * | 2000-08-23 | 2002-03-02 | 고성달 | 피혁의 염색방법 |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7083826B2 (en) * | 2003-05-16 | 2006-08-01 | 3M Innovative Properties Company | Coating die and method for use |
| ES2856334T3 (es) * | 2003-11-24 | 2021-09-27 | Intertape Polymer Corp | Proceso para preparar una composición autoadhesiva usando una extrusora planetaria |
| JP4704425B2 (ja) * | 2004-05-13 | 2011-06-15 | ディーエスエム アイピー アセッツ ビー.ブイ. | 繊維のフィルムの形成のための装置および方法 |
| DE602006005164D1 (de) * | 2005-07-13 | 2009-03-26 | Agfa Gevaert Nv | Verfahren zur breitschlitzextrusionsbeschichtung einer flüssigen zusammensetzung |
| US7621737B2 (en) * | 2006-07-19 | 2009-11-24 | 3M Innovative Properties Company | Die with insert and gas purging method for die |
| JP5007168B2 (ja) * | 2007-07-10 | 2012-08-22 | 日東電工株式会社 | ダイコーター調整方法及び光学フィルムの製造方法 |
| BRPI0819558A2 (pt) * | 2007-12-31 | 2015-05-05 | 3M Innovative Properties Co | "método para aplicação de um material revestidor" |
| KR101014659B1 (ko) * | 2008-07-09 | 2011-02-16 | (주)티에스티아이테크 | 유체 토출장치 |
| KR101107651B1 (ko) * | 2011-07-27 | 2012-01-20 | 성안기계 (주) | 도포 균일성이 향상된 슬롯다이 |
| JP6055280B2 (ja) * | 2012-11-11 | 2016-12-27 | 平田機工株式会社 | 塗布液充填方法 |
| JP6068271B2 (ja) * | 2013-06-10 | 2017-01-25 | 東レ株式会社 | 塗布器、及び塗布装置 |
| JP6196916B2 (ja) * | 2014-02-25 | 2017-09-13 | 東京応化工業株式会社 | ノズルおよび塗布装置 |
| JP6309407B2 (ja) * | 2014-09-17 | 2018-04-11 | 東レ株式会社 | 塗布器、塗布装置、及び塗布方法 |
| SG11201806808XA (en) * | 2016-02-12 | 2018-09-27 | 3M Innovative Properties Co | Slot die with actively controlled coating width |
| JP6967477B2 (ja) * | 2018-03-22 | 2021-11-17 | 東レ株式会社 | 塗布器、及び塗布器のエア排出方法 |
| KR102368359B1 (ko) * | 2019-05-14 | 2022-02-25 | 주식회사 엘지에너지솔루션 | 에어 벤트를 포함하는 슬롯 다이 코팅 장치 |
| CN115605295A (zh) * | 2020-09-28 | 2023-01-13 | 株式会社Lg新能源(Kr) | 多狭缝模具涂布机 |
| WO2022102979A1 (ko) * | 2020-11-13 | 2022-05-19 | 주식회사 엘지에너지솔루션 | 에어 벤트를 포함하는 듀얼 슬롯 다이 코터 |
| CN113171889B (zh) * | 2021-04-27 | 2022-07-12 | 常州瑞择微电子科技有限公司 | 水帘喷头 |
| CN218945476U (zh) * | 2022-11-29 | 2023-05-02 | 宁德时代新能源科技股份有限公司 | 涂布模头和涂布设备 |
| EP4427847B1 (en) * | 2023-01-28 | 2025-12-17 | Contemporary Amperex Technology (Hong Kong) Limited | Coating die, coating apparatus and battery production apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5374312A (en) | 1991-01-23 | 1994-12-20 | Tokyo Electron Limited | Liquid coating system |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3023456A (en) * | 1959-08-03 | 1962-03-06 | Dow Chemical Co | Extruder apparatus |
| US3889633A (en) * | 1974-05-08 | 1975-06-17 | Formulabs Ind Inks Inc | Apparatus for applying one or more stripes to conductors |
| CH585920A5 (https=) * | 1974-06-07 | 1977-03-15 | Hoechst Ag | |
| US4491417A (en) * | 1983-04-29 | 1985-01-01 | Usm Corporation | Devolatilizing mixing extruder |
| US4938994A (en) * | 1987-11-23 | 1990-07-03 | Epicor Technology, Inc. | Method and apparatus for patch coating printed circuit boards |
| JPH074399Y2 (ja) * | 1989-08-28 | 1995-02-01 | 石川島播磨重工業株式会社 | 給油量制御装置 |
| JP2816510B2 (ja) * | 1991-01-23 | 1998-10-27 | 東京エレクトロン株式会社 | 液体供給ノズル |
| JPH0515828A (ja) * | 1991-07-09 | 1993-01-26 | Kanzaki Paper Mfg Co Ltd | 加圧型カーテン塗布装置 |
| CA2098784A1 (en) * | 1992-07-08 | 1994-01-09 | Bentley Boger | Apparatus and methods for applying conformal coatings to electronic circuit boards |
| JP2537739B2 (ja) * | 1992-07-31 | 1996-09-25 | 三菱化学株式会社 | ダイコ―タ |
| US5702527A (en) * | 1995-02-22 | 1997-12-30 | Minnesota Mining And Manufacturing Company | Restricted flow die |
| JPH10277464A (ja) | 1997-04-02 | 1998-10-20 | Dainippon Printing Co Ltd | 塗布装置及びこれを使用する塗布方法 |
| JPH11188301A (ja) | 1997-12-26 | 1999-07-13 | Hirata Corp | 流体塗布装置 |
| US6319316B1 (en) * | 1998-02-17 | 2001-11-20 | Fastar, Ltd. | System and method for performing low contamination extrusion for microelectronics applications |
| US6548115B1 (en) | 1998-11-30 | 2003-04-15 | Fastar, Ltd. | System and method for providing coating of substrates |
| JP2002119907A (ja) * | 2000-10-12 | 2002-04-23 | Konica Corp | 押出し塗布装置およびエア抜き方法 |
| GB0030182D0 (en) | 2000-12-11 | 2001-01-24 | Univ Brunel | Material processing |
| JP2003071368A (ja) * | 2001-09-06 | 2003-03-11 | Matsushita Electric Ind Co Ltd | 液体塗布方法及び液体塗布装置、並びにこれを用いた陰極線管の製造方法及び装置 |
| JP2003340335A (ja) * | 2002-05-27 | 2003-12-02 | Okazaki Kikai Kogyo Kk | 周面浸漬型のグラビアコータ |
| US7083826B2 (en) | 2003-05-16 | 2006-08-01 | 3M Innovative Properties Company | Coating die and method for use |
-
2003
- 2003-05-16 US US10/439,448 patent/US7083826B2/en not_active Expired - Lifetime
-
2004
- 2004-04-13 EP EP09002791A patent/EP2072148B1/en not_active Expired - Lifetime
- 2004-04-13 AT AT04785479T patent/ATE427788T1/de not_active IP Right Cessation
- 2004-04-13 JP JP2006532403A patent/JP4685783B2/ja not_active Expired - Fee Related
- 2004-04-13 WO PCT/US2004/011274 patent/WO2004103578A1/en not_active Ceased
- 2004-04-13 EP EP04785479A patent/EP1624973B1/en not_active Expired - Lifetime
- 2004-04-13 KR KR1020057021719A patent/KR101087384B1/ko not_active Expired - Fee Related
- 2004-04-13 DE DE602004020458T patent/DE602004020458D1/de not_active Expired - Lifetime
-
2006
- 2006-07-26 US US11/459,980 patent/US7695768B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5374312A (en) | 1991-01-23 | 1994-12-20 | Tokyo Electron Limited | Liquid coating system |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20020015785A (ko) * | 2000-08-23 | 2002-03-02 | 고성달 | 피혁의 염색방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1624973A1 (en) | 2006-02-15 |
| EP2072148B1 (en) | 2011-12-07 |
| US20060257574A1 (en) | 2006-11-16 |
| US7083826B2 (en) | 2006-08-01 |
| JP2007504001A (ja) | 2007-03-01 |
| DE602004020458D1 (de) | 2009-05-20 |
| ATE427788T1 (de) | 2009-04-15 |
| EP2072148A1 (en) | 2009-06-24 |
| KR20060009935A (ko) | 2006-02-01 |
| US7695768B2 (en) | 2010-04-13 |
| WO2004103578A1 (en) | 2004-12-02 |
| EP1624973B1 (en) | 2009-04-08 |
| JP4685783B2 (ja) | 2011-05-18 |
| US20040228972A1 (en) | 2004-11-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| E902 | Notification of reason for refusal | ||
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| P13-X000 | Application amended |
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| E701 | Decision to grant or registration of patent right | ||
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