KR101065346B1 - 전자 부품의 실장 장치 - Google Patents

전자 부품의 실장 장치 Download PDF

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Publication number
KR101065346B1
KR101065346B1 KR1020087029514A KR20087029514A KR101065346B1 KR 101065346 B1 KR101065346 B1 KR 101065346B1 KR 1020087029514 A KR1020087029514 A KR 1020087029514A KR 20087029514 A KR20087029514 A KR 20087029514A KR 101065346 B1 KR101065346 B1 KR 101065346B1
Authority
KR
South Korea
Prior art keywords
cassette
main body
mounting position
apparatus main
tool
Prior art date
Application number
KR1020087029514A
Other languages
English (en)
Korean (ko)
Other versions
KR20090021158A (ko
Inventor
마사히로 스즈키
Original Assignee
시바우라 메카트로닉스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 시바우라 메카트로닉스 가부시키가이샤 filed Critical 시바우라 메카트로닉스 가부시키가이샤
Publication of KR20090021158A publication Critical patent/KR20090021158A/ko
Application granted granted Critical
Publication of KR101065346B1 publication Critical patent/KR101065346B1/ko

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
KR1020087029514A 2006-06-06 2007-04-20 전자 부품의 실장 장치 KR101065346B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-157621 2006-06-06
JP2006157621A JP4643495B2 (ja) 2006-06-06 2006-06-06 電子部品の実装装置

Publications (2)

Publication Number Publication Date
KR20090021158A KR20090021158A (ko) 2009-02-27
KR101065346B1 true KR101065346B1 (ko) 2011-09-16

Family

ID=38801231

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087029514A KR101065346B1 (ko) 2006-06-06 2007-04-20 전자 부품의 실장 장치

Country Status (5)

Country Link
JP (1) JP4643495B2 (fr)
KR (1) KR101065346B1 (fr)
CN (1) CN101461049B (fr)
TW (1) TWI392033B (fr)
WO (1) WO2007141966A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012106417A2 (fr) 2011-02-02 2012-08-09 3M Innovative Properties Company Substrats à motifs dotés de pistes conductrices foncées
CN102595820B (zh) * 2012-03-11 2014-09-17 郑小玲 一种光电感应封装机构
JP6244550B2 (ja) * 2014-02-10 2017-12-13 パナソニックＩｐマネジメント株式会社 部品実装装置における保護シート交換方法
CN110228681A (zh) * 2019-06-25 2019-09-13 东莞市德速达精密设备有限公司 开放式多层供料器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10341098A (ja) 1997-06-05 1998-12-22 Sanyo Electric Co Ltd 電子部品装着装置
KR19990067356A (ko) * 1995-11-06 1999-08-16 모리시타 요이찌 부품실장장치
KR20040000812A (ko) * 2002-06-25 2004-01-07 미래산업 주식회사 전자부품 공급장치 및 방법
JP2006054368A (ja) 2004-08-13 2006-02-23 Shibaura Mechatronics Corp 実装装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05310325A (ja) * 1992-05-08 1993-11-22 Matsushita Electric Ind Co Ltd 多種部品供給装置
EP1535143A4 (fr) * 2002-06-19 2010-05-05 Brooks Automation Inc Systeme de manutention automatisee de materiaux destine a la manutention de semi-conducteurs, utilisant une combinaison de carrousels verticaux et de palans aeriens
KR100491161B1 (ko) * 2002-11-26 2005-05-24 주식회사 테라세미콘 반도체 제조장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990067356A (ko) * 1995-11-06 1999-08-16 모리시타 요이찌 부품실장장치
JPH10341098A (ja) 1997-06-05 1998-12-22 Sanyo Electric Co Ltd 電子部品装着装置
KR20040000812A (ko) * 2002-06-25 2004-01-07 미래산업 주식회사 전자부품 공급장치 및 방법
JP2006054368A (ja) 2004-08-13 2006-02-23 Shibaura Mechatronics Corp 実装装置

Also Published As

Publication number Publication date
WO2007141966A1 (fr) 2007-12-13
CN101461049A (zh) 2009-06-17
JP2007329198A (ja) 2007-12-20
TW200805516A (en) 2008-01-16
JP4643495B2 (ja) 2011-03-02
TWI392033B (zh) 2013-04-01
CN101461049B (zh) 2010-09-29
KR20090021158A (ko) 2009-02-27

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