KR101056277B1 - 양면 도체 폴리이미드 적층체의 연속 제조 방법 - Google Patents

양면 도체 폴리이미드 적층체의 연속 제조 방법 Download PDF

Info

Publication number
KR101056277B1
KR101056277B1 KR1020067016381A KR20067016381A KR101056277B1 KR 101056277 B1 KR101056277 B1 KR 101056277B1 KR 1020067016381 A KR1020067016381 A KR 1020067016381A KR 20067016381 A KR20067016381 A KR 20067016381A KR 101056277 B1 KR101056277 B1 KR 101056277B1
Authority
KR
South Korea
Prior art keywords
roll
polyimide
double
sided conductor
press
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020067016381A
Other languages
English (en)
Korean (ko)
Other versions
KR20060124700A (ko
Inventor
가즈야 미야모토
아키라 도쿠미쓰
마사카즈 이이
요시히로 시게마쓰
이치로 히가사야마
마사히로 간노
유지로 나카가와
Original Assignee
신닛테츠가가쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신닛테츠가가쿠 가부시키가이샤 filed Critical 신닛테츠가가쿠 가부시키가이샤
Publication of KR20060124700A publication Critical patent/KR20060124700A/ko
Application granted granted Critical
Publication of KR101056277B1 publication Critical patent/KR101056277B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
KR1020067016381A 2004-01-16 2004-12-27 양면 도체 폴리이미드 적층체의 연속 제조 방법 Expired - Lifetime KR101056277B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004009530A JP3675805B1 (ja) 2004-01-16 2004-01-16 両面導体ポリイミド積層体の連続製造方法
JPJP-P-2004-00009530 2004-01-16
PCT/JP2004/019522 WO2005068182A1 (ja) 2004-01-16 2004-12-27 両面導体ポリイミド積層体の連続製造方法

Publications (2)

Publication Number Publication Date
KR20060124700A KR20060124700A (ko) 2006-12-05
KR101056277B1 true KR101056277B1 (ko) 2011-08-11

Family

ID=34792273

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020067016381A Expired - Lifetime KR101056277B1 (ko) 2004-01-16 2004-12-27 양면 도체 폴리이미드 적층체의 연속 제조 방법

Country Status (5)

Country Link
JP (1) JP3675805B1 (enExample)
KR (1) KR101056277B1 (enExample)
CN (1) CN1906028B (enExample)
TW (1) TW200538277A (enExample)
WO (1) WO2005068182A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013013495A1 (de) 2013-08-16 2015-02-19 Thyssenkrupp Steel Europe Ag Verfahren und Vorrichtung zur Herstellung eines Verbundwerkstoffs
JP6323275B2 (ja) * 2014-09-16 2018-05-16 大日本印刷株式会社 Ｉｃカードの製造装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11300887A (ja) 1998-04-17 1999-11-02 Ube Ind Ltd 金属箔積層フィルムの製法
JP2001239585A (ja) * 2000-02-28 2001-09-04 Kuraray Co Ltd 金属張積層体およびその製造方法。
JP2003200496A (ja) * 2002-01-09 2003-07-15 Kanegafuchi Chem Ind Co Ltd 耐熱性フレキシブル積層板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11300887A (ja) 1998-04-17 1999-11-02 Ube Ind Ltd 金属箔積層フィルムの製法
JP2001239585A (ja) * 2000-02-28 2001-09-04 Kuraray Co Ltd 金属張積層体およびその製造方法。
JP2003200496A (ja) * 2002-01-09 2003-07-15 Kanegafuchi Chem Ind Co Ltd 耐熱性フレキシブル積層板の製造方法

Also Published As

Publication number Publication date
JP3675805B1 (ja) 2005-07-27
WO2005068182A1 (ja) 2005-07-28
TW200538277A (en) 2005-12-01
CN1906028A (zh) 2007-01-31
CN1906028B (zh) 2010-05-05
KR20060124700A (ko) 2006-12-05
JP2005203628A (ja) 2005-07-28
TWI358356B (enExample) 2012-02-21

Similar Documents

Publication Publication Date Title
TW201800213A (zh) 覆金屬積層板之製造方法及覆金屬積層板
JP4304854B2 (ja) 多層ポリイミドフィルムおよび積層体
KR102592679B1 (ko) 금속장 적층판의 제조 방법, 피복 가압 롤의 제조 방법 및 수복 방법
KR101027203B1 (ko) 양면 도체 폴리이미드 적층체의 연속 제조 방법
JPWO2018186223A1 (ja) 金属張積層板およびその製造方法
CN112440539A (zh) 层叠膜及该层叠膜的制造方法
CN110143023B (zh) 挠性覆铜板制备方法及印刷电路板
CN112980004A (zh) 液状组合物、液晶聚酯膜及该液晶聚酯膜的制造方法和层叠膜及该层叠膜的制造方法
KR101056277B1 (ko) 양면 도체 폴리이미드 적층체의 연속 제조 방법
JP4757645B2 (ja) 両面金属張積層板の製造方法
KR20220055462A (ko) 필름, 필름의 제조 방법, 금속 피복 적층체, 및 피복 금속 도체
JP4894866B2 (ja) 多層ポリイミドフィルムおよび積層体
KR20060129081A (ko) 가요성 프린트 배선용 기판과 그의 제조방법
TWI360373B (enExample)
JP4785340B2 (ja) ポリイミド金属積層板
JP3034838B2 (ja) 両面導体ポリイミド積層体の製造方法
JP2009029141A (ja) 熱圧着性ポリイミドおよび積層体
HK40054575A (en) Liquid composition, liquid crystal polyester film and method for producing same, and laminated film and method for producing same
JP2005297471A (ja) フレキシブル金属積層体
JP2007296731A (ja) 寸法安定性に優れるフレキシブル金属張積層板およびその製造方法
JP2005335102A (ja) 寸法安定性を向上させた接着性接合部材及びそれからなるフレキシブル金属張積層板
JP2007296728A (ja) 寸法安定性に優れるフレキシブル金属張積層板およびその製造方法
JP2007296729A (ja) 寸法安定性に優れるフレキシブル金属張積層板およびその製造方法
JP2007296733A (ja) 寸法安定性に優れるフレキシブル金属張積層板およびその製造方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

FPAY Annual fee payment

Payment date: 20140722

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20160722

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20170725

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PC1801 Expiration of term

St.27 status event code: N-4-6-H10-H14-oth-PC1801

Not in force date: 20241228

Ip right cessation event data comment text: Termination Category : EXPIRATION_OF_DURATION