JP3675805B1 - 両面導体ポリイミド積層体の連続製造方法 - Google Patents

両面導体ポリイミド積層体の連続製造方法 Download PDF

Info

Publication number
JP3675805B1
JP3675805B1 JP2004009530A JP2004009530A JP3675805B1 JP 3675805 B1 JP3675805 B1 JP 3675805B1 JP 2004009530 A JP2004009530 A JP 2004009530A JP 2004009530 A JP2004009530 A JP 2004009530A JP 3675805 B1 JP3675805 B1 JP 3675805B1
Authority
JP
Japan
Prior art keywords
roll
polyimide
sided conductor
double
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2004009530A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005203628A (ja
Inventor
和弥 宮本
明 徳光
正一 井伊
義浩 重松
伊知郎 日笠山
勝浩 菅野
雄次郎 中川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co Ltd filed Critical Nippon Steel Chemical Co Ltd
Priority to JP2004009530A priority Critical patent/JP3675805B1/ja
Priority to KR1020067016381A priority patent/KR101056277B1/ko
Priority to PCT/JP2004/019522 priority patent/WO2005068182A1/ja
Priority to CN2004800405144A priority patent/CN1906028B/zh
Priority to TW094101198A priority patent/TW200538277A/zh
Application granted granted Critical
Publication of JP3675805B1 publication Critical patent/JP3675805B1/ja
Publication of JP2005203628A publication Critical patent/JP2005203628A/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
    • B32B37/0053—Constructional details of laminating machines comprising rollers; Constructional features of the rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
JP2004009530A 2004-01-16 2004-01-16 両面導体ポリイミド積層体の連続製造方法 Expired - Lifetime JP3675805B1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004009530A JP3675805B1 (ja) 2004-01-16 2004-01-16 両面導体ポリイミド積層体の連続製造方法
KR1020067016381A KR101056277B1 (ko) 2004-01-16 2004-12-27 양면 도체 폴리이미드 적층체의 연속 제조 방법
PCT/JP2004/019522 WO2005068182A1 (ja) 2004-01-16 2004-12-27 両面導体ポリイミド積層体の連続製造方法
CN2004800405144A CN1906028B (zh) 2004-01-16 2004-12-27 两面导体聚酰亚胺积层体的连续制造方法
TW094101198A TW200538277A (en) 2004-01-16 2005-01-14 Continuous production method for both-sided conductor polyimide laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004009530A JP3675805B1 (ja) 2004-01-16 2004-01-16 両面導体ポリイミド積層体の連続製造方法

Publications (2)

Publication Number Publication Date
JP3675805B1 true JP3675805B1 (ja) 2005-07-27
JP2005203628A JP2005203628A (ja) 2005-07-28

Family

ID=34792273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004009530A Expired - Lifetime JP3675805B1 (ja) 2004-01-16 2004-01-16 両面導体ポリイミド積層体の連続製造方法

Country Status (5)

Country Link
JP (1) JP3675805B1 (enExample)
KR (1) KR101056277B1 (enExample)
CN (1) CN1906028B (enExample)
TW (1) TW200538277A (enExample)
WO (1) WO2005068182A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013013495A1 (de) 2013-08-16 2015-02-19 Thyssenkrupp Steel Europe Ag Verfahren und Vorrichtung zur Herstellung eines Verbundwerkstoffs
JP6323275B2 (ja) * 2014-09-16 2018-05-16 大日本印刷株式会社 Ｉｃカードの製造装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3580128B2 (ja) * 1998-04-17 2004-10-20 宇部興産株式会社 金属箔積層フィルムの製法
JP2001239585A (ja) * 2000-02-28 2001-09-04 Kuraray Co Ltd 金属張積層体およびその製造方法。
JP4231227B2 (ja) * 2002-01-09 2009-02-25 株式会社カネカ 耐熱性フレキシブル積層板の製造方法

Also Published As

Publication number Publication date
KR20060124700A (ko) 2006-12-05
CN1906028A (zh) 2007-01-31
WO2005068182A1 (ja) 2005-07-28
CN1906028B (zh) 2010-05-05
JP2005203628A (ja) 2005-07-28
TWI358356B (enExample) 2012-02-21
KR101056277B1 (ko) 2011-08-11
TW200538277A (en) 2005-12-01

Similar Documents

Publication Publication Date Title
TWI406757B (zh) 包銅之疊層基板
JP3759454B2 (ja) 積層体及びその製造方法
KR102592679B1 (ko) 금속장 적층판의 제조 방법, 피복 가압 롤의 제조 방법 및 수복 방법
JP2014195947A (ja) 両面フレキシブル金属張積層板の製造方法
JP3790250B2 (ja) 両面導体ポリイミド積層体の連続製造方法
JP3675805B1 (ja) 両面導体ポリイミド積層体の連続製造方法
JP4510506B2 (ja) ポリイミド金属積層板の製造方法
JP6774285B2 (ja) 金属張積層板
JP2005201393A (ja) 加熱プレスロール
JP2007203505A (ja) 両面金属張積層板の製造方法
JP6776087B2 (ja) 金属張積層板の製造方法及び回路基板の製造方法
JP4360956B2 (ja) フレキシブルプリント配線板用基板の製造方法
JP2005259790A (ja) フレキシブルプリント配線用基板とその製造方法
CN119036971B (zh) 一种聚酰亚胺复合膜、制备方法及其应用
JP4850560B2 (ja) フレキシブルプリント配線用基板
WO2023234377A1 (ja) 長尺積層基材、長尺シートロール、及びそれらの製造方法
JP2005297471A (ja) フレキシブル金属積層体
JP2007272941A (ja) Ｈｄｄサスペンション用積層体の製造方法
JPH10323935A (ja) 両面導体ポリイミド積層体の製造方法
JP2005144805A (ja) ポリイミド金属積層板

Legal Events

Date Code Title Description
TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20050405

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20050426

R150 Certificate of patent or registration of utility model

Ref document number: 3675805

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080513

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090513

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100513

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100513

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110513

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140513

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140513

Year of fee payment: 9

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140513

Year of fee payment: 9

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term