KR101045473B1 - 다중 두께 반도체 상호 접속 및 그 제조 방법 - Google Patents

다중 두께 반도체 상호 접속 및 그 제조 방법 Download PDF

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KR101045473B1
KR101045473B1 KR1020047017954A KR20047017954A KR101045473B1 KR 101045473 B1 KR101045473 B1 KR 101045473B1 KR 1020047017954 A KR1020047017954 A KR 1020047017954A KR 20047017954 A KR20047017954 A KR 20047017954A KR 101045473 B1 KR101045473 B1 KR 101045473B1
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South Korea
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thickness
layer
interconnect
conductor
dielectric layer
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Expired - Fee Related
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KR1020047017954A
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Korean (ko)
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KR20050007531A (ko
Inventor
카들린 씨. 유
키르크 제이. 스트로제우스키
자노스 파카스
헥토르 산체즈
예옹-지흐 티. 리
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프리스케일 세미컨덕터, 인크.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Layout of the interconnection structure
    • H01L23/5283—Cross-sectional geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76807—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics for dual damascene structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76816—Aspects relating to the layout of the pattern or to the size of vias or trenches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020047017954A 2002-05-09 2003-04-15 다중 두께 반도체 상호 접속 및 그 제조 방법 Expired - Fee Related KR101045473B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/141,714 2002-05-09
US10/141,714 US6815820B2 (en) 2002-05-09 2002-05-09 Method for forming a semiconductor interconnect with multiple thickness
PCT/US2003/012089 WO2003100825A2 (en) 2002-05-09 2003-04-15 Multiple thickness semiconductor interconnect and method therefor

Publications (2)

Publication Number Publication Date
KR20050007531A KR20050007531A (ko) 2005-01-19
KR101045473B1 true KR101045473B1 (ko) 2011-06-30

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ID=29399731

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KR1020047017954A Expired - Fee Related KR101045473B1 (ko) 2002-05-09 2003-04-15 다중 두께 반도체 상호 접속 및 그 제조 방법

Country Status (7)

Country Link
US (2) US6815820B2 (enExample)
JP (1) JP4932153B2 (enExample)
KR (1) KR101045473B1 (enExample)
CN (1) CN100397613C (enExample)
AU (1) AU2003247343A1 (enExample)
TW (1) TWI293493B (enExample)
WO (1) WO2003100825A2 (enExample)

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KR100558493B1 (ko) * 2003-12-03 2006-03-07 삼성전자주식회사 반도체 기억소자의 배선 형성방법
US7784010B1 (en) * 2004-06-01 2010-08-24 Pulsic Limited Automatic routing system with variable width interconnect
DE102006025405B4 (de) * 2006-05-31 2018-03-29 Globalfoundries Inc. Verfahren zur Herstellung einer Metallisierungsschicht eines Halbleiterbauelements mit unterschiedlich dicken Metallleitungen
CN100452063C (zh) * 2006-06-07 2009-01-14 清华大学 硅集成电路衬底多频率点下综合耦合参数的快速提取方法
US7566651B2 (en) * 2007-03-28 2009-07-28 International Business Machines Corporation Low contact resistance metal contact
US8026170B2 (en) * 2007-09-26 2011-09-27 Sandisk Technologies Inc. Method of forming a single-layer metal conductors with multiple thicknesses
US8304863B2 (en) * 2010-02-09 2012-11-06 International Business Machines Corporation Electromigration immune through-substrate vias
US20120299187A1 (en) * 2011-05-27 2012-11-29 Broadcom Corporation Aluminum Bond Pad With Trench Thinning for Fine Pitch Ultra-Thick Aluminum Products
US8906801B2 (en) * 2012-03-12 2014-12-09 GlobalFoundries, Inc. Processes for forming integrated circuits and integrated circuits formed thereby
US8813012B2 (en) 2012-07-16 2014-08-19 Synopsys, Inc. Self-aligned via interconnect using relaxed patterning exposure
KR102385454B1 (ko) * 2015-09-24 2022-04-08 엘지디스플레이 주식회사 휘도가 개선된 표시장치
CN107481918B (zh) * 2016-06-08 2020-04-07 中芯国际集成电路制造(上海)有限公司 芯片的制备方法及刻蚀方法
US10651201B2 (en) 2017-04-05 2020-05-12 Samsung Electronics Co., Ltd. Integrated circuit including interconnection and method of fabricating the same, the interconnection including a pattern shaped and/or a via disposed for mitigating electromigration
US11705414B2 (en) * 2017-10-05 2023-07-18 Texas Instruments Incorporated Structure and method for semiconductor packaging
KR102442096B1 (ko) * 2017-11-22 2022-09-07 삼성전자주식회사 반도체 장치
EP4567886A3 (en) * 2018-12-19 2025-08-20 Imec VZW Interconnection system of an intergrated circuit
US12334392B2 (en) * 2019-08-07 2025-06-17 Intel Corporation Multi-height interconnect trenches for resistance and capacitance optimization
US11195792B2 (en) 2020-01-10 2021-12-07 International Business Machines Corporation Top via stack
US20230275018A1 (en) * 2022-02-25 2023-08-31 Taiwan Semiconductor Manufacturing Company, Ltd. Metal lines of hybrid heights
CN119581415B (zh) * 2025-01-26 2025-05-13 全智芯(上海)技术有限公司 用于调整互连线结构的方法、设备和介质

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KR20000027538A (ko) * 1998-10-28 2000-05-15 김영환 반도체 소자의 금속 배선 형성 방법
KR100277810B1 (ko) * 1996-06-03 2001-02-01 가네꼬 히사시 반도체 장치 및 그 제조 방법
JP2001068474A (ja) * 1999-08-24 2001-03-16 Nec Ic Microcomput Syst Ltd 半導体装置の製造方法

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US5258328A (en) * 1992-03-16 1993-11-02 Kabushiki Kaisha Toshiba Method of forming multilayered wiring structure of semiconductor device
JPH0685071A (ja) * 1992-08-31 1994-03-25 Fujitsu Ltd 半導体装置の製造方法
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KR100277810B1 (ko) * 1996-06-03 2001-02-01 가네꼬 히사시 반도체 장치 및 그 제조 방법
KR20000027538A (ko) * 1998-10-28 2000-05-15 김영환 반도체 소자의 금속 배선 형성 방법
JP2001068474A (ja) * 1999-08-24 2001-03-16 Nec Ic Microcomput Syst Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
AU2003247343A1 (en) 2003-12-12
AU2003247343A8 (en) 2003-12-12
TW200406870A (en) 2004-05-01
CN100397613C (zh) 2008-06-25
CN1653607A (zh) 2005-08-10
TWI293493B (en) 2008-02-11
US7176574B2 (en) 2007-02-13
WO2003100825A3 (en) 2004-04-15
JP2005525000A (ja) 2005-08-18
KR20050007531A (ko) 2005-01-19
US6815820B2 (en) 2004-11-09
JP4932153B2 (ja) 2012-05-16
US20050035459A1 (en) 2005-02-17
WO2003100825A2 (en) 2003-12-04
US20030209779A1 (en) 2003-11-13

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